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Introduction
Wiring-Up of chip devices takes place through various conductors produced during processing Today, interconnects constitute the main source of delay in MOS circuits We will examine:
Sheet Resistance Resistance / Unit Area Area Capacitance Delay Units CMOS Inverter Delay Rise and Fall Time Estimation
Sheet Resistance
Resistance of a square slab of material RAB = L/A t => R = L/t*W Let L = W (square slab) => RAB = /t = Rs ohm / square
A w
B
RAB = ZRsh Z = L/W
Typical sheet resistance values for materials are very well characterised
Layer
Aluminium N Diffusion Silicide Polysilicon N-transistor Channel
Rs (Ohm / Sq)
0.03 10 50 24 15 - 100 104
P-transistor Channel
2.5 x 104
2 R = 1sq x Rs = Rs = 104
Polysilicon
W = 8
L = 2
Capacitance
Standard unit for a technology node is the gate - channel capacitance of the minimum sized transistor (2 x 2), given as Cg This is a technology specific value
For 5m technology, Cg = 0.01pF/m2
Delay Unit
For a feature size square gate, = Rs x Cg i.e for 5m technology, = 104 ohm/sq x 0.01pF = 0.1ns Because of effects of parasitics which we have not considered in our model, delay is typically of the order of 0.2 - 0.3 ns Note that is very similar to channel transit time sd