Vishal kumar mor 2809214

Small size, microfabricated structures ) Electrical Signal/ Control

Mechanical functionality )

Structures, Devices, Systems

What are MEMS

 Micro-electromechanical systems (MEMS) is a process technology used to create tiny integrated devices or systems that combine mechanical and electrical components

MEMS is also referred to as MST (Microsystems Technology in Europe) MM (Micromachines in Japan). MEMS with optics is called MOEMS- Micro-OptoElectro-Mechanical-Systems).

What are Microsystems (MST)?

Tiny, integrated, self-aware, stand-alone products, (based on microfabricated components) that can

Courtesy of Sandia National Laboratories

MEMS consist of mechanical microstructures, microsensors, microactuators and microelectronics, all integrated onto the same silicon chip

 Microsensors detect changes in the systems environment by measuring mechanical, thermal, magnetic, chemical or electromagnetic information or phenomena. Microelectronics processes this information and signals The microactuators to react and create some form of changes to the environment.

WHY MEMS
MEMS allow miniaturization of existing devices MEMS offer solutions which cannot be attained by macro-machined products, e.g., capacitive pressure sensor capable of sensing pressure of the order of 1 mTorr is not possible with macromachined capacitive diaphragm. Interdisciplinary nature of MEMS technology and its micromachining techniques, as well as its diversity of applications has resulted in an unprecedented range of devices and synergies across previously unrelated fields (for example biology- microelectronics, optics-microelectronics). MEMS allows the complex electromechanical systems to be manufactured using batch fabrication techniques, decreasing the cost and increasing the reliability. It allows integrated systems, viz., sensors, actuators, circuits, etc. in a single package and offers advantages of reliability, performance, cost, ease of use, etc.

History
history of MEMS is useful to illustrate its diversity, challenges and applications 1950s 1958 Silicon strain gauges commercially available 1959 Theres Plenty of Room at the Bottom Richard Feynman gives a milestone presentation at California Institute of Technology. He issues a public challenge by offering $1000 to the first person to create an electrical motor smaller than 1/64thof an inch.

1960s 1961 First silicon pressure sensor demonstrated 1970s 1970 First silicon accelerometer demonstrated 1979 First micromachined inkjet nozzle by IBM 1980s 1982 Disposable blood pressure transducer 1988 First MEMS conference 1990s Methods of micromachining aimed towards improving sensors. 1995 BioMEMS rapidly develops 2000 MEMS optical-networking components become big business

Applications

GUESS THE SITUATION

Pressure sensors are the biggest medical MEMS application

The technology, similar to that found in the airbag sensor, enables the patients motion and activity to be monitored and signals the pacemaker to adjustits rate accordingly

Figure 7. (a) Disposable blood pressure sensor connected to an IV line [14],(b) disposable blood pressure sensors (as shipped) [15], and (c) intracardial catheter-tip sensors for monitoring blood pressure during cardiac catheterisation, shown on the head of a pin [13].

Inkjet printer head

Thermal inkjet print technology

Overhead projection display

The MEMS Digital Micromirror Device (DMD)

& Many more

The Future of MEMS

Some of the major challenges facing the MEMS industry include: Access to Foundries.
limited access to MEMS fabrication facilities organizations expected to benefit from this technology currently do not have the required capabilities and competencies to support MEMS fabrication telecommunication companies do not currently maintain micromachining facilities for the fabrication of optical switches.

 Design, Simulation and Modelling

complexities of fabrication. high level of manufacturing and fabrication knowledge Currently, MEMS devices use older design tools and are fabricated on a trial and error basis

Therefore, More Powerful and advanced simulation and modelling tools are NECESSARY

Packaging and Testing.

greatest challenge facing the MEMS industry MEMS package typically must provide protection from an operating environment as well as enable access to it. no generic MEMS packaging solution most expensive fabrication step and often makes up 90% (or more) of the final cost

Education and Training.

The complexity and interdisciplinary nature of MEMS require educated and well-trained scientists and engineers from a diversity of fields and backgrounds. The current numbers of qualified MEMS-specific personnel is relatively small and certainly lower than Persons required by industries.

Conclusion
Despite MEMS being an enabling technology for the development and production of many new industrial and consumer products, MEMS is also a disruptive technology in that it differs significantly from existing technology, requiring a completely different set of capabilities and competencies to implement it. Cost reduction is critical and will ultimately result from better availability of infrastructure, more reliable manufacturing processes and technical information as well as new standards on interfacing.

Any Queries?