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Center for Materials for Information Technology an NSF Materials Science and Engineering Center
Sputter Deposition
Magnetron sputtering is the most widely used method for vacuum thin film deposition. Although the basic diode sputtering method (without magnetron or magnetic enhanced) is still used in some application areas, magnetron sputtering now serves over 90% of the market for sputter deposition. Magnetron sputtering can be used to coat virtually anything with a wide range of materials - any solid metal or alloy and a variety of compounds. ref: www.gencoa.com
Center for Materials for Information Technology an NSF Materials Science and Engineering Center
Sputtering System
A typical sputtering system consists of a vacuum chamber with substrate holders and magnetron guns, vacuum pumps and gauging, a gas supply system, power supplies and a computer control system.
Center for Materials for Information Technology an NSF Materials Science and Engineering Center
ref: http://www.teercoatings.co.uk
The Magnetron
A Magnetron is comprised of : A CATHODE = electron source An ANODE = electron collector A combined ELECTRIC & MAGNETIC FIELD B X E
ref: www.gencoa.com
Center for Materials for Information Technology an NSF Materials Science and Engineering Center
ref: www.gencoa.com
ref: www.gencoa.com
Center for Materials for Information Technology an NSF Materials Science and Engineering Center
A magnetron consists of a target with magnets arranged behind it to make a magnetic trap for charged particles, such as argon ions, in front of the target. Atoms are knocked out of the target surface by the ions - this is sputtering. These sputtered atoms arent charged negatively or positively, so they go straight out of the magnetic trap to coat the substrate. ref: http://www.teercoatings.co.uk
Center for Materials for Information Technology an NSF Materials Science and Engineering Center
Confinement between a negatively biased target and closed magnetic field produces a dense plasma. High densities of ions are generated within the confined plasma, and these ions are subsequently attracted to the negatively biased target, producing sputtering at high rates.
Center for Materials for Information Technology an NSF Materials Science and Engineering Center
ref: www.gencoa.com
Target Erosion
Target erosion is greatest where the magnetic field and the subsequent plasma density is greatest. This leads to inefficient use of target material, particularly in the case of ferromagnetic targets. ref: www.gencoa.com
Center for Materials for Information Technology an NSF Materials Science and Engineering Center
Sputtering Insulators
For an insulator target, the ions bombarding the target will create charging, and the electric field necessary to maintain a plasma is greatly diminished. To alleviate this problem, an RF power supply is used to generate the electric field.
Center for Materials for Information Technology an NSF Materials Science and Engineering Center
ref: www.gencoa.com
Magnetron Guns
ref: www.lesker.com
Center for Materials for Information Technology an NSF Materials Science and Engineering Center
A UHV, magnetron sputter source that fits through the port of a 2.75" CF flange complete with its tilt gimbals assembly. The AJA International new A310-XP only needs a 2.75" CF to accommodate the source head, tilt gimbals and gas injection/isolation chimney. This revolutionary new design is true UHV - all ceramic to metal construction.
Center for Materials for Information Technology an NSF Materials Science and Engineering Center