Depressuring in Aspen HYSYS

Revised: Nov 27, 2012

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Objectives

Construct a simple case using the Depressuring Analysis in Aspen HYSYS.

2012 Aspen Technology, Inc. All rights reserved

Background
Pressure can build up to dangerous levels. Blowdown vents safely release pressure, and can be set up to release automatically or manually. Excess gas is usually sent to a flare system for disposal. Depressuring systems sometimes utilize pressure vessels along with relief valves.

2012 Aspen Technology, Inc. All rights reserved

Key Teaching Points

HYSYS Depressuring Analysis is capable of modeling adiabatic cases, as well as those involving outside heat sources such as fires. Although the Depressuring Analysis utilizes dynamics to simulate depressuring, it can be run in steady-state The decrease in pressure is accompanied by a drop in temperature because of Joule-Thomson effect

2012 Aspen Technology, Inc. All rights reserved

Problem Statement
A nitrogen stream that has built up an excess pressure
Pressure: 2161 psia Temperature: 62.6 F Molar flow rate: 2.205 lbmole/hr

Use the Aspen HYSYS Depressuring Utility to determine the behavior of the gas in a depressuring process that takes 100 seconds. Assume an adiabatic case with no external heat source.

2012 Aspen Technology, Inc. All rights reserved

Copyright
Copyright 2012 by Aspen Technology, Inc. (AspenTech). All rights reserved. This work may not be reproduced or distributed in any form or by any means without the prior written consent of AspenTech. ASPENTECH MAKES NO WARRANTY OR REPRESENTATION, EITHER EXPRESSED OR IMPLIED, WITH RESPECT TO THIS WORK and assumes no liability for any errors or omissions. In no event will AspenTech be liable to you for damages, including any loss of profits, lost savings, or other incidental or consequential damages arising out of the use of the information contained in, or the digital files supplied with or for use with, this work. This work and its contents are provided for educational purposes only. AspenTech, aspenONE, and the Aspen leaf logo, are trademarks of Aspen Technology, Inc.. Brands and product names mentioned in this documentation are trademarks or service marks of their respective companies.

2012 Aspen Technology, Inc. All rights reserved