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11/7/2013 16 Lecture-I
Impedance curve for CPW
The curves are for GaAs substrate for
r=12.9
Reference: Coplanar waveguide circuits, components and systems, by
Rainee Simons
11/7/2013 17 Lecture-I
Typical circuits using CPW line
11/7/2013 18 Lecture-I
Fin lines
11/7/2013 Lecture-I 19
Fin lines can be imagined as planar transmission
lines inserted into waveguide(Shielded slot line).
Good contact between fins and waveguide not
necessary.
Impedance, frequency of operation depends on the
waveguide cut off frequency.
Introduced by Meier.
Structure of a fin line
Types of fin lines
11/7/2013 20 Lecture-I
Substrate
Metal
Printed fin line Unilateral Symmetric fin
line
Bilateral Symmetric fin
line
Bilateral Antipodal fin line
Strip fin line
Typical points and electrical characteristics
11/7/2013 Lecture-I 21
Produce a normalized shunt capacitance across the
centre of the waveguide (explained in detail in
Foundations for microwave engineering by
R.E.Collins).
Under resonance condition,
Other planar transmission lines
11/7/2013 Lecture-I 22
Suspended microstrip line
Suspended strip line
Coupled strip line
Coupled microstrip line
Coupled slot line
Conductor backed CPW
Broad side coupled CPW/strip line
Edge coupled CPW/strip line
CPW with microshield
Substrate integrated waveguides
MMIC boards
11/7/2013 23 Lecture-I
11/7/2013 Lecture-I 24
Traditional transmitter
board
MMIC board
MMIC boards
Substrates used: Rogers, textronics, Isola, Arlon.
FR-4 substrate is best avoided in case of antenna
applications. It has the ability to contain the fields
within it and best suited for low frequency circuits.
Rogers substrates have low loss and is more rugged
to operate at high frequencies under high
temperatures and pressure.
11/7/2013 25 Lecture-I
11/7/2013 Lecture-I 26
Coefficient of Thermal
Expansion (CTE),
Thermal Coefficient of
Dielectric Constant
(TCDk),
Low modulus
Non-wettability
managing heat flow with
its high thermal
conductivity
Parameters of
substrate
Criterion for selection of substrates
11/7/2013 Lecture-I 27
Military: materials meet or are tested in accordance to military
specifications. (Mil-S-13949 now obsolete).
Commercial: materials are designed for cost sensitive
applications (military grade materials can be used in
commercial applications but pricing is higher).
Multilayer: mechanical properties are such that allow for reliable
multilayer (MLB, other than basic stripline) constructions
Hybrid: mechanical properties are such that allow for reliable
FR4 hybrid MLB constructions
Broad Band: dielectric constant allows for very high
frequency/broadband use
Temp Cycling: electrical and mechanical properties allow for
stable use in temperature varying environments
Surface Mount: mechanical properties allow for surface mount
technology
Miniaturize dielectric constant reduces sizes of circuit elements
RF connectors
11/7/2013 Lecture-I 28
Summary
11/7/2013 Lecture-I 29
Types planar transmission lines their
Structure
Field distribution
Z
0
vs. w curves and c
eff
vs. w curves
power handling capacity and nature of connections
MMIC boards
Typical receiver boards
Selection of substrate for high frequency circuits
References
11/7/2013 Lecture-I 30
Stripline circuit design by Harlan Howe
Microstrip lines and Slotlines by K.C. Gupta,
Ramesh Garg and Prakash Bhartia.
Coplanar waveguide circuits, systems and
components by Rainee Simons
Analysis, Design and Application of Finlines by
Bharathi Bhatt and S.K. Koul
Microwave Engineering by D.M. Pozar.
Foundations of microwave Engineering by R. E.
collins
Microwave solid state circuit design by I. Bahl and P.
Bhartia
Rogers corporation website
Exercises
11/7/2013 Lecture-I 31
1. Generate impedance vs width curves for microstrip
and CPW lines for FR-4, RT duroid 5880, 5870
substrates.
2. Comfortable with the structure of all planar lines
especially microstrip and CPW