Beruflich Dokumente
Kultur Dokumente
Chapter Three
Section 3.6
Straight fins of (a) uniform and (b) non-uniform cross sections; (c) annular
fin, and (d) pin fin of non-uniform cross section.
Fin Equation
is of the form:
d 2T hP
T T 0
2
kAc
dx
(3.62)
d 2
m 2 0
2
dx
(3.64)
Fin Equation
Base (x = 0) condition
0 Tb T b
Tip ( x = L) conditions
A. Convection: kd / dx |x L h L
B. Adiabatic: d / dx |x L 0
C. Fixed temperature: L L
D. Infinite fin (mL>2.65): L 0
d
|x 0 Af h x dAs
dx
Performance Parameters
Fin Efficiency:
f
qf
q f ,max
qf
(3.86)
hA f b
2
Af 2w L2 t / 2
Ap t / 2 L
1 I1 2mL
f
mL I 0 2mL
Fin Effectiveness:
f
qf
hAc , bb
f with h, k and Ac / P
(3.85)
Fin Resistance:
Rt , f
b
qf
1
hAf f
(3.92)
Arrays
Fin Arrays
Representative arrays of
(a) rectangular and
(b) annular fins.
(3.99)
(3.101)
Rt , o
o 1
1 f
A
b t 1
Rt , o
qt o hAt
(3.102)
(3.103)
Arrays (Cont.)
qt o c hAtb
b
Rt , o c
NA f f
1
At C1
C1 1 f hAf Rt, c / Ac,b
1
Rt , o c
o c hAt
o c 1
(3.105a)
(3.105b)
(3.104)
1
cosh mL
Tb T
1/ 2
1/ 2
m hP/kAc
250W/m2 K0.11m/20W/mK610-4 m2
= 47.87 m-1
1/ 2
-4
b 250W/m K0.11m20W/mK610 m
900 C -517W ,
1/ 2
Hence,
q b q f 508W
Comments: Radiation losses from the blade surface contribute to reducing the blade
temperatures, but what is the effect of assuming an adiabatic tip condition? Calculate
the tip temperature allowing for convection from the gas.
L b= 3 mm
Lf = 15 mm
Air
Too = 20oC S
h = 100 W/m2-K
Rt,b
Tc
qc
Rt,c
= 1.8 mm
Assumptions: (1) Steady-state, (2) One-dimensional heat transfer, (3) Isothermal chip, (4)
Negligible heat transfer from top surface of chip, (5) Negligible temperature rise for air flow,
(6) Uniform convection coefficient associated with air flow through channels and over outer
surface of heat sink, (7) Negligible radiation.
Too
Rt,o
T T
Tc T
qc c
R tot
R t,c R t,b R t,o
2
6 2
2
R t,c R t,c / W 2 10 m K / W / 0.02m 0.005 K / W
0.003m /180
R t, b L b / k W
W/mK
0.02m 2
0.042 K / W
A t N Af A b
-4
-3
-4
tanh mLf
0.824
0.704
mLf
1.17
o = 0.719,
Rt,o = 2.00 K/W, and
qc
-3
1/2
85 20 C
31.8 W
(0.015m) =
Comments: The heat sink significantly increases the allowable heat dissipation. If it
were not used and heat was simply transferred by convection from the surface of the chip with
h 100 W/m2gK,R tot =2.05 K/W from Part (a) would be replaced by
Rcnv 1/ hW2 25 K/W, yielding qc 2.60 W.