Beruflich Dokumente
Kultur Dokumente
Sitharaj S
Suresh Muthaiah
Karthic Balasubramanian
3/24/15
AAT
Market survey
OBC
3/24/15
Image
PRICE (INR)
MASS(Grams)
POWER(Watts)
ISIS OBC
352,422
94
400mW
389,303
50
Cube Computer
368,813
50-70
200mW
2,048,965
70
<1Watts/3Watts
3,893,033
70
<5Watts/9Watts
AAT
OBC
Payload
Payload
data
storage
Payload
Handling
Telecommand
Telemetry
Control
Payload Data
EPS
Telemetry
COM
Telecommand
Handling
System &
Subsystem
management
ADCS
CENTRALIZED
DISTRIBUTED
EPS
EPS
ADCS
ADCS
OBC
OBC
PAYLOAD
PAYLOAD
COM
COM
Customer requirements
C&DH
Requirements
Hardware
Requirements
Environmental
Integration
Mass, power
Software
Requirements
Resource
requirements
Redundancy,
reliability
Libraries,
RTOS
Mission
Software
Voice Of Customer
Need
CTQs
Drivers
Technical aspect
Low Cost
Cost aspect
Radiation Protection (SEU, SEL)
Operating Temperature (-45 to 85 C)
Redundancy (for import part of OBC)
OBC
Reliability aspect
Mass aspect
Customization aspect
3/24/15
AAT
Hardware Analysis
Sensors
Temperature
Power
Current
voltage
OBC
MCU
Memory
I/O System
I2C
Timer
FLASH
SRAM
SPI
GPIO
RTC
WDT
EEPROM
SD Card
Controller selection
FPGAs
It consists of logic blocks that arranged in matrix form.
So users can define their function(Like CPU, I2C, SPI) easily in FPGA
It process the user application parallel .
ASIC Application Specific Integrated Circuit
It is an integrated circuit (IC) customized for a particular use, rather than intended for general-purpose use.
System upgrade is very difficult and cost is high.
Microcontroller
Microcontroller is general purpose programmable integrated chip that has rich set of functionality.
Microcontroller is consists of CPU, control unit, memory, variety of integrated peripherals such as Timer, ADC,
DAC, I2C, SPI, etc.
Microprocessor
Microprocessor is general purpose computing device that is consists of CPU, control unit. We need to connect
memory and other peripherals externally.
We need to connect peripherals externally so it creates complexity in design and increase mass, size, power of
the system.
Controller Selection
Key parameters
Processing performance
Power consumption
On-chip communication
Peripheral availability
Memory capacity & Interface
Existing Mission Experience
size, mass, cost
Processor Architecture
By Vendors
Mission experience
By ISA
Architecture
Copyright
CISC
PowerPC
RISC
Manufacture
Texas Instrumentation
Pumpkin
Microchip
Pumpkin
ARM
ARM
SPARC
Sun Microsystem
Freescale semiconductor
Atmel AVR
ATMEL
ATMEL
Microchip PIC
Microchip
Technology
Hardware Specification
Feature
Specification
Processor
MSP430 at 20Mhz
Memory
On board Communication
Integrated Peripherals
Software
Form Factor
PC/104
Power
<250mW
Operating temperature
Size
96x90x10mm
Mass
55 to 80grams
Hardware Specification
Feature
Specification
Processor
Memory
4Mb Flash for code, 2Mb SRAM for data with SEU, SEL
protection, 4Gb MMC/SD for payload data & telemetry.
On board Communication
Integrated Peripherals
Software
Form Factor
PC/104
Power
<400mW
Operating temperature
Size
96x90x10mm
Mass
55 to 80grams
Software analysis
Software specification is consists of bare-metal software and user application specific software(Mission
software).
Bare metal software is nothing but operating system and hardware low level drivers.
Here our system is real time system that means it should not be allow time latency like interrupt latency,
I/O response, Task context delay.
From an above requirement, The RTOS bare metal software is only way to run our system in real time
environment.
Drivers is nothing but small programs like embedded c or assembly language that manages hardware
peripherals ADC, DAC, I2C, SPI,PWM etc.
User application software is consists of mission tasks such as telemetry managers, Telecommand
interpreter, system manager task etc.
Requirements
RTOS
Specification
Language
Event-driven,
Priority,
multitasking
Assembly,
C/C++
Drivers
Assembly, C/C++
User application
Mission specified
application
C/C++
User Application
Operating system
Hardware
Phase 5 - HW/SW
Integration
Development Cycle
Gant chart
1-Sep-14
Concept study phase
Baseline Design Review
Preliminary Design phase
Preliminary design review
Critical design phase
Critical design review
Final design approval
Requirements procurement
Prototype M anufacturing
Testing, Verification and Validation
Test readiness review
Product/ Project presentation
Product display
21-Sep-14
11-Oct-14
31-Oct-14
20-Nov-14
10-Dec-14
30-Dec-14
19-Jan-15
8-Feb-15
28-Feb-15
20-M ar-15
Cost estimation
Human resources & labor cost
Tools cost (SW/HW)
Designing Manufacturing cost
Estimated cost: 100,000 to 250,000
Risks in
The risks of the project are clearly defined in advance, before beginning
Through market research
matrix
Medium
risk
High risk
Low risk
Low risk
High risk
Developing plans and practices, that notify the most serious risks
Planning and monitoring of risks by introducing standardized connection
between risk management processes, enabling quick respond to changes in
other people involved in the development and take into account changes the
objectives of the project
Medium
risk
Medium
risk
Low risk
Medium
risk
10
Low risk
11
High risk
Conclusion
Every CubeSat mission has their own mission objective and design so customer need a reconfigurable
hardware and software OBC module for their mission. Reconfiguration means to modify the existing OBC
subsystem available in the market. Direct hardware based reconfiguration is not feasible because it take more
time and perhaps creates unnecessary system behavior when modifying important components of OBC. So
software based hardware reconfiguration is a good way to complete mission objective because we are not
changing physical component we are only changing behavior of physical components of OBC to achieve
mission objective.
3/24/15
AAT
19
Thank You
Questions