Design For

Manufacturability ( DFM)

C.Devanathan,
200821522,
CIM II Year.
Design for Manufacturability

Contents

Introduction and Definition

History of DFM
DFM Principle
Why DFM
Objectives of DFM
DFM activities
DFM typical approach
DFM Tools and methodology
DFM in Electronics Industry
Case study

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Introduction
DFM is product design considering
manufacturing requirements
DFM is the first step in which a team
approach is taken to develop the
product.
DFM is an umbrella which covers a
variety of tools and techniques to
accomplish a manufacturable product.

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Introduction
Design for manufacturability is the
process of proactively designing
products to
(1) Optimize all the manufacturing
functions: fabrication, assembly, test,
procurement, shipping, delivery, service,
and repair.
2) Assure the best cost, quality,
reliability, regulatory compliance, safety,
time-to-market, and customer
satisfaction.
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Definition
Design for Manufacturing (DFM) is a
development practice emphasizing
manufacturing issues throughout the
product development process.
Successful DFM results in lower
production cost without sacrificing
product quality.

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History of DFM
Principles of DFM are not new.
Awareness of importance of designing
parts for easy manufacturing is key for
all time.
Difference is in the use of standards
and design guides during the
beginning stages of the design and
not later

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Eli Whitney (early 1800s)

Made use of standardizing the design of
the lock on the musket so that
interchangeable parts could be used
Before him, all muskets were made by
craftsmen and no two muskets were the
same or used the same parts.
His parts were built to specs and a
tolerances
He organized a mass production process
for locks
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History Contd.,
Book edited by Richard Bolz who
organized the DFM methodology
DFM was originally called
producibility (1960s) and then
manufacturability (1970s) and then
Design for Manufacturability (1985)

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DFM Principles
Use of standards
Use of common components
Design to specifications and
tolerances
Use of manufacturing guidelines in
the early stages of design that
maximize quality of manufactured
part
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DFM Principles
Minimize the use of materials
Minimize the use of floor space in
plant
Locate all necessary components
near functional operation
Use of automated machining for
minimal errors

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Why DFM?
60% of overall product cost is
determined by decisions made early in
the design process
75% of manufacturing cost is
determined by design drawings and
specifications
70 80% of all products defects are
directly related to design issues

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Why DFM?
Lower development cost
Shorter development time
Faster manufacturing start of
build
Lower assembly and test costs
Higher quality

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Objective of DFM
To identify product concepts that are
easy to manufacture

Focus on component design for ease of

manufacture and assembly
Integrate manufacturing to ensure the
best match of needs and requirements.

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Activities of DFM
An analysis of the complete
product in order to simplify its
design.
An analysis of each individual part
to maximize its manufacturability.

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DFM Typical Approach

Product Development team making it happen!!

- Product requirements and deliverables

- DFM tools and methods

start
finish

Design

Test

Tool Build

Launch

Product Development Steps

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DFM Typical Approach

Product Team

EE
Project Manage
Component Engineer
Purchasing
Fab., process engineer
Assembly process engineer
Test engineer
Quality engineer
Uses DFM tools and methods

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For a Sound DFM Team:

Training / Education of several types
are needed:
Attitudinal training.
Clear role clarification.
Information sharing.
Involvement and participation

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DFM Tools and Methodology

Use of the Standard Guidelines.
Design For Assembly (DFA), (IBM
experience)
Failure Mode and Effect Analysis
(FMEA), (Sun example)
Taguchi Method, (Hitachi
experience)

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DFM Tools and Methodology

Value Analysis--Value
Engineering (HP example)
Quality Function Deployment
(QFD), Going to the Gemba
(Hitachi)
Group Technology, (IBM example)
Cost management and
optimization, SPC, Six-Sigma
(Motorola), TQC, etc
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DFM Tools Pros and Cons

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DFM Tools: Comparisons

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DFM in Electronics Industry

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Consideration and requirements of

Electronics Components
Size, form, fit, function
Cost and availability
Initial quality and long term
reliability
Moisture sensitive device (MSD)
considerations and requirements
Solderability and solder joint
requirements
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Consideration and requirements of

Electronics Components
Component to board edge spacing
requirements
Component body to body spacing
requirements
Component to board CTE
requirements
All IC (PGA, BGA, DIP, SIP, SIMM,
DIMM, etc.) pins correctly identified
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circuit requirements
DC
Noise, cross talk, interference
Micro strip
Buried Micro strip
Analog
R/F
EMI
Shielding type
Impedance
High power
Thermal
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PCB material considerations as

required
Impedance
Dielectric constant
Overall board construction
requirements
Dielectric withstanding voltage
Moisture and insulation resistance
Dielectric breakdown voltage
High power requirements
R/F and EMI requirements
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Guidelines for DFM in Electronics

Industry
More important guidelines for
designers of Electronics products:
1. Standardization: Standardize
circuit board sizes and
dimensions.
2. Utilize the standard components
3. Standardize the orientation of the
devices on the board.
4. Product simplification
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Guidelines for DFM

5. The number of different hole sizes
on the printed board minimized.
6. The location of identification labels
on components standardized.
7. Minimize / eliminate the
adjustments
8. It is advisable to use only one
component placement method.
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Guidelines for DFM

9. Provide sufficient spacing between
leads, vias, and traces to avoid
solder short circuit.
10.Componets that require a press to
install- avoided.
11. When flexible circuit boards are
used, avoid bends that are sharp so
as not to crack copper conduction
paths.
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Guidelines for DFM

12. Consider the environment in
which the product will be
manufactured and used.
13. Designers should be aware of the
stack-up of positional tolerances.
14.SMT boards require proper size
and spacing of mounting pads.

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Guidelines for DFM

15.Via holes should not be placed
under metal conditions.
16.For, through hole boards, most
traces should be on the component
side, fewest on the solder side.
17.Use of even number of circuit
board layers to reduce the
possibility of the circuit board
warping when the heat for soldering
is applied.
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Case Study in Electronics

industry

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Beyond Prototypes!! : Design for

Manufacturing Concerns for Pico Radio
Test bed
Must add draft angle and fillets to
part. This will add complexity to
the model and slightly increase the
size of the part. Part will be
slightly conical instead of perfectly
cylindrical to allow part removal
from the injection mold.
Currently two sliders are required
to form the serial port access hole
and the power switch hole. Both
holes need to be designed out.
We will need to use larger screw
bosses to account for draft angle PCB cut-outs (hopefully) have
been enlarged to account for this.

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Beyond Prototypes!! : Design for

Manufacturing Concerns for Pico Radio
Test bed
Add a feature to screw the
PCB directly to the
casing??
Case lid should be stiffer.
Casing design is small
enough to be shot on our
in-house injection press.
EDM will be required to
make this mold. We must
located an external vendor
for this.
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Our MCAD tools

AutoCAD, Solidworks
SDRCs IDEAS, OpenCascade

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Our ECAD tools

Cadences ORCAD
Will be used for Bluetooth radio boards,
schematics and PCB designs
(Old BWRC CAD tools were Zuken Redac for
Layout, Routing, Manufacturing and
Viewlogic for the schematics)3

Checking that these new tools can

export and import new standards from
the ISO
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DfM Pipelines (right side of ASU/UCB chart)

AP 210

AP
2

10

ECAD

D
U
C
A
D
E

Moldable Part

AP 203

MCAD

Mold Fill
Mold
Cut-ability

AP 203
Feature Manager

MOSIS
chip fab/pack.

Cybercut Pipeline

PCB Assembly
(Outsource)

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Cut Mold
(Out source/In-House)

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STEP
The Standard for the Exchange of
Product model (STEP) Provides a
common method of defining product
data
Application Protocols (APs) define the
content, scope and information
requirements of a designated
application area

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STEP protocols AP203 and AP210

All mechanical CAD systems export
and import STEP files in the AP203
protocol
Electronic assembly interconnect
and packaging design is now
described in AP210

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STEP AP210
April 1999
ISO (International Organization for
Standardization) accepted STEP
Application Protocol as International
Standard
Electronic Assemblies, Interconnection
and Packaging
Printed Wiring Assemblies (PWA)

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Some Industries Following DFM

AT&T
Boeing
Lockheed Martin
GE
Intel
GM
Ford

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Toyota
Yahoo
Microsoft
IBM
Cisco Systems
HP
Sonic

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References
Design for Manufacturability
Hand book - James G.Bralla.
www.toodoc.com

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