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Growing
Aps.org
Technique
Melt:
Directional
Solidification
Examples
Elemental &
Compound
semiconductors: Si,
Ge, GaAs, InP
Czochralski
("Cz")
Windows: sapphire
Scintillators: BGO,
CdWO4
NLO materials:
LiNbO3, CsLiB6O10
Alkali scintillatorsCsI:Tl
Halides: windowswide transmitting
filters
Advantages
Disadvantages
FAST
Large sizes possible
Reasonable Kef
Seeded: predetermined
orientation
Crucible can be a
problem
Technique
Examples
Advantages
Disadvantages
Vapor
Physical vapor
transport
(evaporation &
condensation)
Chemical vapor
deposition
(open flow)
Chemical vapor
transport
(closed system)
Solution/Flux
ADP, KDP,
Refractories
Hydrothermal quartz
Diamond: 1450 C, 742
kpsi, Ni flux
Proteins, Minerals,
Mo2C
High Tc
superconductors;
BiSrCaCuO
Mortons tablesalt
Very slow
Temperature control
very important
Kef often very small
doping difficult
Typical Numbers
On previous label, = 1-20 Ohm (presumably
1-20 -cm)
As you know: = 1/ = ne
For silicon at 10 -cm with n = 1700 cm2/V-sec
nP = 3.7x1014/cm3
nSi = 2.33 gm/cm3) x(6.02x1023 atoms/mole)
(28.068 gm/mole) = 4.997x10 22 atoms per
mole
nP / nSi = 7x10-9 = 7 ppb!
Background impurity level must be small on
this scale!
Segregation
Impurity
Distribution after
Normal Freezing
Impurity
Distributio
n after
Single
Pass of
Zone
(Less efficient than
normal freezing)
Impurity
Distribution
from Multi-pass
Zone Refining
n.b.: k =
0.9524, l/L =
0.01
Czochralski
Growth
may be pre-synthesized or a
measured quantity
As may be bubbled through
metal
synthesized from Li and H2 (or
D2)
Typical sizes: Si - 12" , 200 kg
charge; GaAs - 4"
We have grown from a 2 g melt of
isotopically pure K13C15N
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