Printed Ckt Board

Types of PCB
(I)

Single Side (II)

Double Side (III)

Multi Layer

(V)

Flexible PCB

Single Side ( 1 layer ) :- The insulating substrate contains ckt pattern on

only one side. Which is called as solder side. The other side is called component side.

Double Side (2 layer) :-

Flexible Cards

Double side means the ckt pattern is present on

the either side of the insulating material ckt pattern both on component side & solder side.

:-

Flexible boards are similar to rigid boards except

the board are made from a flexible substrate material. The base materials are very thin and
the common thickness is 0.1mm.

Multi layer Board (MLB, 4L,6L,8L,12L,16L ) :The ckt density is high compare to D/S for inner layer
made of special laminate is used for bonding purpose ( Prepreg). The inner layer
is etched CU and outer layer is Non- etched ckt. After lamination or pressing
the boards are drilled and plated like PTH D/S.

Process Flow chart for Single Side P.C.B.

Sheet Cutting

Film master preparation

Screen Preparation

Drying

Screen Printing

Board cleaning

Retouching

Etching

Legend Printing

Roller Tinning or HAL

Final Cutting

Q.C.

Drilling

Ink Stripping

Masking

Process Flow Chart of Double Side P.C.B.

Sheet Cutting

Film Master Preparation

CNC Drilling

Photo Printing

PTH or Electroplating

Board Cleaning

Pattern Plating or Electro Plating

H.A.L.

Green Masking

Legend Printing

Final Cutting

Dry film Stripping

Etching

Tin Stripping

Q.C.

Mechanical Operation
* Sheet Cutting :-

Measure the size of PCB from film or

Artwork.

L
W
* Board Area

Panel Sz.
PCB Sz.
Boarder Area

* Laminates or Copper Sheet :1. Glass Epoxy 2. Paper fenolic 3.Teflon 4. Ceramick (CEM)

* Glass Epoxy :-

Thickness

S/S

1.6 35/0

Cu Thickness
Insulating Material
thickness

D/S

0.8-18/18
1.6-18/18
2.4-18/18
3.2-18/18

Base material is reinforced with glass fiber or paper fiber as filler and epoxy resin and the cu
foil is pressured over it to get cu clad laminates.

* Paper Phenolic :-

Phenolic laminates are reinforced with paper fillers and the cu foil
is pressed to the base material.

Thickness :- Fr-2, C-8000, 1.6- 35/0------ S/S, 0.8-18/18--- D/S

1.6- 18/18-----D/S

* Teflon Laminates :-

Teflon is reinforced with glass fiber to get

aminates of low dielectric constant and it is used in Radio frequency.

* SHEARING MACHINE :- Used for laminate cutting for PCB

production.
*

Manual Shearing

Final Cutting i.e. cutting in finish size.

* Shearing Blades

* Motor drive Shearing.

:-Two Blades :-

(I) Fixed Blades

(ii) Movable Blades.

1 to 1.50

* Punching :-Making Big hole, slot of different shape Die &Punch.

* Blanking :- Clean Cutting operation is done with a punching tool.

* Routing :- Final Cutting by CNC machine or Pin router
* Drilling :- (I)
(ii)

Manual Drilling
CNC Drilling ( Computer numeric Control)

* Manual Drilling :- * Used H.S.S. Drill Bit

* Speed of M/C is 6,000-16,000 RPM
* Stack Drilling
* Jig Drilling.

CNC Programming & Drilling

(I)
(II)
(III)
(IV)

Do path making
Focus the Hole with help of camera and monitor.
For time saving and maintained the accuracy.
After programming Drill one Panel for checking the
program.
Checked Missing Hole, Extra Hole,Shifting, Inter changed Hole, Drill Dia (
Drill dia checked by Hole Gauge. )

(V)

T3

T2
T1

Path Making

* Drill Bit :- Tungsten Carbide drill bit used in CNC machine.

Shank dia

3.175

* In double side PCB drill dia is always 0.1mm extra from finish size.

*. Ink Stripping/ Dry film :To remove the ink by using Naoh or Koh solution.
Ink remove and the cu appears on track and pads only.

Masking
#. To cover the panel with insulating ink. # To avoid the short ckt.
#. To protecte the cu for oxidation
(I) Thermal Masking (II) PISM ( Photo Imagable solder Mask)

# Thermal Masking :-

*. Using Screen Printing.

*. -ve Masking film used in thermal masking.

*. Ink in paste form added Hardener and

# P.I.S.M.:-

masking reducer for making liquid form.

* Using Photo Printing Method.

* + ve Masking film used in PISM.
* Panel coated with PISM ink.
* Dry in oven or UV Light.
* Panel develop in Na2co3 solution.

# Peel off Test

Brushing (Surface Preparation)

To remove the dust particles and oxide layer from the surface of panel.
.
*. Chemical cleaning
*. Mechanical cleaning

* Chemical Cleaning :- Using Alkali chemical to remove oil, grease & soil particle
on the surface of laminates.

* Mechanical Cleaning :Laminate Drilling

Water rinse

Deburing (320 grid brush)

Buffing (wet condition )

Drying (with hot blow air )

Water rinse

FILM MASTER PREPARATION

*

High efficiency Compact camera used for reduction and inlargement

purpose.

Material Used :-

(I)
Lith film
(ii) Lith film Developer
(iii)
Sodium Thosulphate
(iv)
Developing Trays
(v)
Retouching Ink
(vi)
Retouching Brush
(vii)
Butter Paper

* Art Work :(I) Manual Artwork (ii) Take Design Print out
* Lith film Developer :- PART- A(P-Methyl amino phenol sulphats
PART- B ( Sodium Carbonate )
Temp.- 200 +--30c

* Fixer :- Sodium Thosulphate

* Retouching :- Using Opaque ink for cover the pin holes.

SCREEN PRINTING
It is done with the help of a wooden/ Aluminum frame having a
polyester cloth tightened over it. Polyester is available in different meshes. Which
are indicated by T that indicate the number of thread gapping.

Wooden frame

Three methods for Screen Printing :(I) Direct Method :- Ammonium dichromate or Potassium dichromate is mixed
with super coat solution in 1:3 ratio.

(II) Indirect Method :- Using Five Star film.

* Film Develop in H202 (Hydrogen Peroxide Solution )

(III) Direct-Indirect Method :- Chromaline film is used.

* Printing Ink :- Acid Resist Blue ink for Printing of
Single Side PCB.

* Squeegees :- The sharpness of the squeegees is very

important for printing. Line sharpness. Uniform ink
coating thickness and the edge definition depends on
the squeegees sharpness.

ETCHING
(1)Immersion (2) Bubble (3) Splash (4) spray Etching

* Ferric Chloride Etching Solution

Fecl3
HCL
Temp

350-500 g/ltr
60 to 65 ml/ltr
200c to 300c

Cu +Fecl3

Fecl2 +Cucl (Green Color )

* Chromic Sulfuric Acid Etchant

Chromic Acid
H2so4
Temp

200 to 240 g/ltr

60 to 65 ml/ltr
20 to 300 c

* Ammonium Chloride Etchant

*

( Used in Spray Etching )

Ammonium Bicarbonate
Ammonium Nitrate
Cupric Chloride
Ammonium Chloride
Temp

75g/ltr
80g/ltr
200g/ltr
100 to 110g/ltr
45 to 55oC

* Etching Problems
1- Under Cut
2- Over Hang

Over Hang :- Excess metal growth on the side of the lone is

called over hang.

Electrolyses/ P.T.H (Plated Through Hole):The Copper will be deposited on hole wall without electricity.
* With the help of chemical reaction
* 2 to 5microne Cu ( Deposit on hole wall)
Most important process in double Side PCBs

Process of Electrolyses
1- Debarring
Drilled panel are cleaned using debarring machine
which uses a 320 grade silicon carbide brush.

2 - Alkaline Soda Cleaning:-

3 - Micro Etch:-

Ginplate

CC-50 5% by volume

D. I. Water

50%

Temp.

26 to 70oC

W. R.

1- 2 Min.
Ginplate Ad-481

120-150gm/l

D. I. Water

To make one ltr.

H2SO4

5cc /ltr.

Time

2-5Min.

W.R.

1Min.

4 - Pre-Activator

5- Activator

The function of this bath is to initiate the reaction of catalyst.

HCL
30%
Remain Water

D. I. Water

Time

1min.

Gin plate -additive 443

Ginplate activator
Time

5ml/l
76ml/l
5-6 Min.

The function is to activate the entire surface including

metal and base.

6- Post Activator Gin Plate PA-491

Remaining

17%
D.I. Water

Its function is to remove stannic layer and to increases

the bonding of electrolyses cu and ensure uniform bonding.

*. Gin Plate Cu 406A

*. Gin Plate Cu 406B

*. Gin Plate Cu 406C

Water
Time

100ml/ltr
100ml/ltr
10ml/ltr
D.I. Remaining
10-12 Min.

PHOTO PRINTING
# Lamination :- Laminted the D/S Panel with P.P.D.F.R. Film
(Phto Polymer Dry Film Resist ) (1.0,1.5,2.0 mils)
Release Sheet of 1.0mil, Polthin 1.0mils

#. Normalizing
#. Expose in U.V. Light,
used +ve Pattern (ckt) film in D/S

#. Develop in Na2Co3 Solution ,

Take -ve image on Panal
#. In S/S PCB -ve ckt film is used
for mfg. Of S/S PCB

#. Temp- 110-115 0c
Electro Plating
(1) Cu Plating (2) Tin Plating

* To increase the cu thickness of hole wall.

H2So4

10%

CuSo4
Cupper acid
Current
Time
Anode

80g/l
7cc/l

Anode Bag
Bath Tank

Anode Hook

2-3 Amp/Sq.dm
15min
Cu. Min-0.04-0.08%
Polypropylene
P.v.c.

Titanium or
Stainless Steel

*. Tin Plating
Stannous Sulphate
H2So4
Stannous Carrer Additive
Stannolume Brighter
Time
Anode Current
Anode

30g/l
100ml/l
30ml/l
2ml/l
5min
1-2 Amp/dm2
60% Tin &40% Lead

*. Legend Printing or Back Marking

Used for identification of holes for which
component can be placed .Screen Printing method for Back marking
process.

*. Roller Tinning Or Hot Air Levelling ( H.A.L.)

To avoid the oxidation layer on Pads
# Flux ( Liquid)
# Sn+Pb ( Tin+ Lead) 60+40#. Temp- 2300c to 2500c

*. Final Cutting ( Routing)

To Cut the PCB in exact Size ad required by
the customer.

Quality Control
(I) Checking for short ckts.
(II) Checking for shifting
(III) Checking for required hole dia.
(IV) Checking for the proper masking.
(v) Checking for final cut and above all whether the PCB is
delivered in the same material as desired or not