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Historical Background
The development of societies were
intimately tied by their ability to
produce and manipulate materials to
fill their needs.
Early civilisation: Stone AgeBronze
Age Iron Age
Subdivision
Material Science: Study the
relationships exist between the
structure and properties
Material Engineering: Use these
relationship correlations to design
material with predetermined set of
properties
Categories of Properties
1.
2.
3.
4.
5.
6.
Importance Components in
Science and Engineering of
Materials
Pick Application
2.
Properties
3.
Material
Example
Classification of Materials
3 basic classifications: Metals, Ceramics
and Polymers.
Combinations of two or more: Composites.
Advanced Materials: Used for high-tech
applications
Metals
Composed one or metallic materials. Can
be combined with small amts non-metallic
elements (C,N and O).
High density, stiff and strong, resistant
to fracture, good electricity and thermal
conductors, not transparent, nice
appearance. Desirable magnetic
properties (Fe, Co, Ni)
Ceramics
Compounds between metallic and nonmetallic
elements: oxides, nitrides, carbides. Eg.
Alumina Al2O3, Silica SiO2, Silicon carbide
SiC Traditional ceramics (porcelain, cement,
glass)
Stiff and strong, brittle, easily fracture,
electrical and heat insulators,
High resistant to harsh environment
Can be transparent, translucent or opaque
Can exhibit magnetic behaviour (Fe3O4)
Polymers
Plastics and rubber materials, organic compunds
(C, H and O, N, Si). Large molecular structures,
C atoms as backbones. Eg. PE, PVC, PC, PS,
Rubber.
Low density (light), not stiff and strong,
stiffness and strength permass are comparable
to other materials, Extremely ductile (easily
formed to complex shapes), Relatively inert,
easily compose and soften at modest
temperatures, low electrical and thermal
conductivity, non magnetic.
Composites
Composed two or move individual materials
(metals, ceramics, polymers). To achieve a
combination of properties. Eg GFRP, CFRP.
Stiffer and stronger but lighter, more
expensive.
Advanced Materials
Used for high technology applications. Eg.
Computer chips, fiber-optics systems,
aircraft and etc.
Eg. Semiconductors (electronic materials;
silicon, germanium), Biomaterials (artificial
body parts; plastics, titanium allloys ),
smart materials (eg. sensors (optical
fibres, piezoelectric materials), actuators
(piezoelectric ceramics)) and
nanoengineered materials.
Hardness (BHN)
600
500
400
(c)
(a)
(b)
4 m
300
200
30 m
30 m
100
0.01 0.1
30 m
1
10 100 1000
Cooling Rate (C/s)
21
THERMAL
Thermal Conductivity
of Copper:
300
(W/m-K)
Thermal Conductivity
400
200
100
0
0
10
20
30
Composition (wt% Zinc)
40
22
MAGNETIC
Magnetic Storage:
Magnetic Permeability
vs. Composition:
--Adding 3 atomic % Si
makes Fe a better
recording medium!
Magnetization
--Recording medium
is magnetized by
recording head.
Fe+3%Si
Fe
Magnetic Field
Fig. 20.23, Callister 7e.
(Fig. 20.23 is from J.U. Lemke, MRS
Bulletin,
Vol. XV, No. 3, p. 31, 1990.)
23
ELECTRICAL
Electrical Resistivity of Copper:
6
(10-8 Ohm-m)
Resistivity,
5
4
3
2
1
0
3
+
Cu
.3
N
%
t
2a
i
N
%
i
N
at
%
6
at
.1
2
2
1
+
1.
Cu
+
u
dC
e
i
N
rm
o
%
f
at
de
2
1
1.
+
Cu
Cu
e
r
Pu
-200
-100
T (C)
25
26
Hip Implant
Key problems to overcome
fixation agent to hold
acetabular cup
cup lubrication material
must avoid any debris in cup
Ball
Acetabular
Cup and Liner
Femoral
Stem
Adapted from chapter-opening
photograph, Chapter 22, Callister 7e.
27