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Huawei LTE
Overview
www.huawei.com
Huawei Confidential
Agenda
LTE Market Update
Advancing LTE Commercialization
Leading LTE Solution
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 2
6X
increase in
past 18 months
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 3
North
NorthAmerica:
America:
Major
MajorininAWS/700M
AWS/700M
PCS(1900M),
PCS(1900M),850M
850Mrefarming
refarming
Europe:
Europe:
Major
Majorinin2.6G/800M
2.6G/800M
1.8G
1.8GRefarming
Refarming
C.I.S
C.I.S
China:
China:
2.6G
2.6G
1.8G
1.8GRefarming
Refarming
Major
MajorininTD,
TD,2.3
2.3oror2.6G
2.6G
TD/FDD
TD/FDDConvergence
Convergence
Latin
LatinAmerica:
America:
Japan:
Japan:
Africa:
Africa:
Asia
AsiaPacific:
Pacific:
Major
Majorinin2.6G/AWS
2.6G/AWS
Roaming
Roamingfor
forU.S
U.Sand
andEU
EU
Major
Majorinin2.6G
2.6G
1.8G
Reframing
1.8G Reframing
MENA:
MENA:
Major
Majorinin2.6G
2.6G
1.8G
Refarming
1.8G Refarming
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
License Issued
Auction in 2010
10 countries, 38 Operators
20+ countries, 50+ operators
30+ countries, 60+ operators
Page 4
TBD
1.5G/800M/1.7G/2.1G
1.5G/800M/1.7G/2.1Gby
by
NTT/KDDI/SBM
NTT/KDDI/SBM
2.6G
2.6G
1.8G,
1.8G,2.1G
2.1GRefarming
Refarming
India:
India:
BWA
BWA(TD-LTE)
(TD-LTE)2.3G
2.3G
Phase2
(2011/12)
Data Only
Phase3
(2012/13)
Phase4
(>2013)
IMS
G/U/L
handsets
launch
Full multimedia
All-IP
network
VoIP
PCC &
handsets QoS
launch
Terminal
Vendors
Terminal
USB
LTE only
USB
Multi-mode: GUL, CL
2009
2010
Handset
2012
2011
Page 6
>1.2Gbps
/80MHz
GSM
GSM
Spectral Efficiency
800M
CA
CA
850M
900M
Title
UMTS
UMTS
1500M
1700M
1800M
84Mbps
/10MHz
CDMA
CDMA
1900M
2100M
2300M
TD-SCDMA
TD-SCDMA
21Mbps
/5MHz
2600M
LTE
42Mbps
/5MHz
WiMAX
WiMAX
64QAM
28Mbps
/5MHz
2x2
MIMO
2x2
MIMO
64QAM
DC
150Mbps
/20MHz
2x2
MIMO
2x2
MIMO
OFDM
64QAM
64QAM
300Mbps
/20MHz
CoMP
FDD
FDD LTE
LTE
Relay
4x4
MIMO
4x4
MIMO
OFDM
OFDM
64QAM
64QAM
TDD
TDD LTE
LTE
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 7
Agenda
LTE Market Update
Advancing LTE Commercialization
Leading LTE Solution
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 8
Stockholm
Moscow
Core algorithm RF technology
ASIC, algorithm
Dallas
San Diego
Beijing
Chengdu
Shanghai
Terminal,
chipset
eNodeB, RF,
eNodeB, SAE,
Terminal, ASIC
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Source: ETSI
(Oct. 2010)
Best Contribution to
Research & Development
for LTE
Page 10
Norway , Serbia
Sweden
Belgium
Spain
Chili
Austria
Australia
Germany
Malaysia
Poland
Singapor
e
Italy
Germany
Germany
Latvia
Austria
Uzbekistan
& Armenia
(*) 8 commercial contracts are not listed due to NDA with customers.
Portugal
Philippine
Greece
Saudi
Arabia
Switzerland
USA
UAE
USA
South
Africa
Kenya
China
China HK
Page 11
Saudi
Arabia
Nigeria
Oslo
Quality Proved
Commercial Capability
DL data rate:
90.6 Mbps
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Significant performance
enhancement : 10Mbps higher
throughput after upgrade
Page 12
GSM+LTE
Operator A
2.6GHz cell
Shared eRAN
Operator B
RAN
RAN sharing:
sharing: MOCN
MOCN
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
GSM
900MHz cell
LTE
Multi-Mode:
Multi-Mode: LTE900
LTE900 &
& GSM900
GSM900
Page 13
Multi-Band:
Multi-Band: 2.6G
2.6G &
& 900M
900M
UMTS 2100MHz
LTE 2600MHz
fiber
BBU
GSM 900MHz
GSM 1800MHz
Page 14
MMMMMM
RRRRRR
FFFFFF
UUUUUU
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 15
17 eNodeBs, 5.28km2
HD video-ondemand
HD video
conference
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
HD video
monitoring
TD-LTE CPE
Page 16
TD-LTE
eNodeB
SAE
Agenda
LTE Market Update
Advancing LTE Commercialization
Leading LTE Solution
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 17
E2E Readiness
Backhaul
Performance
Interoperability
Network
operation
Smooth
Evolution
Performan
ce
Enhancem
ent
Device
availability
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Cost
Effectiveness
Page 18
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Backhaul
Radio
Page 19
Core
eRAN
EPC
Backhaul
Distributed
MME
IP Backhaul
or MSTP
SGW/PGW
HSS
Outdoor
Macro
Terminal
PCRF
Indoor
Macro
SingleRAN
SingleBackhaul
SingleEPC
Self-developed
Unified Platform
Unified Platform
Various Types
Flexible Installation
Intelligent Capability
Cost-efficient Transport
Highest Throughput
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 20
1
RRU
RFU
BBU3900
Distributed
eNodeB
DBS3900
Common Platform
Well-proven SingleRAN platform
Common platform for G/U/L
Common platform for FDD & TDD
Indoor Macro
eNodeB
BTS3900/L
Micro eNodeB
Outdoor Macro
eNodeB BTS3900A
Common Modules
One RF module for MIMO
Flexible bandwidth: 1.4M/3M/5M/10M/15M/20MHz
Full 3GPP bands: 2.6G/2.1G/1800M/900M/800M/AWS/700M, etc.
Page 21
USB Modem
E2701
USB Modem
E398
LTE/HSPA/EDGE multimode
USB rotator with inner antenna
Commercial Phase 1: Dec. 2010
Commercial Phase 2: Apr. 2011
LTE DD800
WLAN 802.11n,b,g
Commercial: 2011Q2
Test UE
2009
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
2010
2011
Page 22
Performance Enhancement
Improving cell
throughput
Increasing cell edge
user data rate
Heterogeneous
architecture
Capacity
Seamless service
Experienc experience
e
Service continuity
+
solution
Coverage
UL/DL coverage enhancement solution
+
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 23
UE 1
Macr
o L LL
TTT
EEE
eNode
B
2x2 MIMO
Throughput (Mbps)
-- System1x2
Gain:
2X2 MIMO over SIMO
SIMO
Capacity +
18.15%
20
16.4
15
28.34%
12.09
14.23
12.36
9.42
10
5
ISD:500m
Speed:3km/h
xx.xx%: Gain
Throughput (Mbps)
46.94%
In typical urban
area:
15%~28% gain over SIMO @
15.12%
13.88
UE 1
Micro
SIMO
MIMO
xx.xx%: Gain
ISD:500m
Speed:30km/h
ISD:1732m
Speed:3km/h
SIMO
MIMO
46.40%
35.18
34.15
56.68%
30
26.87
23.24
24.03
20
17.15
10
Macro
~50% gain over SIMO @ Micro
Outdoor-to-Indoor
Speed: 3km/h
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 24
Outdoor-to-Outdoor
Speed: 3km/h
Outdoor-to-Outdoor
Speed: 30km/h
DL 44 MIMO
eNodeB
UE 1
eNodeB
UE 1
UE 2
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Capacity +
Cell Edge
Open Loop
DL:OL-SM
UL:MUMIMO
DL:SFBC
UL:Rx
Diversity
Benefits:
Different MIMO modes fit different
scenarios
DL:CL-Tx Diversity
UL:Rx Diversity
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Adaptive MIMO
Adjust MIMO mode according to
channel quality and users velocity
Closed Loop
DL:CL-SM
UL:MUMIMO
Capacity +
Cell 1,4,7
Power
2
2
76
Victim cell
antenna 1
Frequency
3
3
1
1
Interfering cell
Noise
Evaluated
Capacity +
6
5
Cell 2,5,8
Power
48
Frequency
5
9
combining
Power
Cell 3,6,9
Frequency
antenna 2
Noise
Evaluate
d
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Different subband allocated for different cell edge users among cells
Page 27
Solutions
Pico / Femto for indoor coverage
Relay
LTE Layer
Intra
frequency
mobility
control
Inter
frequency
mobility
control
Femto
Micro
Pico
Macro
Inter-RAT Mobility
Control
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 28
One network
one deployment
one maintenance
Capacity +
3~5dB
3~5dB
gain
gain
Coverage +
Uplink
30%
Before Bundling
Radius
Downlink
After Bundling
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 29
Coverage +
3d
B
L-1800 (>10
MHz)
Hot
spot
DD
1800MHz 800MHz
2.6GH
z
L-2600 (20
MHz)
L-800 (5, 10, 15
MHz)
L-900 (5 MHz)
Urban
Sub-Urban
10d
B
Rural
Wide Coverage
Distance
capacity challenges.
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 30
Experience+
Cell coverage
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
hand over
High speed: up to 431 Km/H
Handover success rate: >99.5%
Handover interruption latency.
100ms
Average DL rate for single UE:
>20Mbps120Km/H
Page 31
CS connectivity
LTE
LTE
Heavy
Load
Heavy
Load
Cell Reselection
PS Handover
Heavy
Load
GSM/UMTS
GSM/UMTS
Service-based
Service-based
Handover
Handover
Coverage-based
Coverage-based
Handover
Handover
Initial Phase
HUAWEI TECHNOLOGIES CO., LTD.
Experience+
Load-based
Load-based
Handover
Handover
Load-based
Load-based
Handover
Handover
Coverage-based
Coverage-based
Handover
Handover
Coverage-based
Coverage-based
Handover
Handover
Developing Phase
Huawei Confidential
Developed
Phase
Heavy
Load
Experience+
Internet
Internet
VoIP
Voice
IMS
LTE Core
LTE Core
2G3G
PS Core
2G3G
CS Core
LTE Core
2G/3G
Access
LTE Access
PS Data
LTE Access
If Voice
Voice
LTE Access
HSPA
Access
VoIP
over LTE
CSFB
PS Data
2G/3G
PS Core
VoIP
Over HSPA
PS HO
Legend:
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
VoIP
PS Data
SRVCC
SRVCC
CS Voice
Page 33
2G3G
CS Core
2G/3G
Access
Voice
Cost-Effectiveness Solution
1
Green
Site Solution
Site Cost
Saving
Dynamic Tx ON/OFF
Dual-band Intelligent
Shutdown
Dynamic PA Voltage
Adjustment
Power
Savin
g
TCO
Saving
4
Networ
k
Sharing
Operatio
n
Efficiency
Huawei Confidential
Green eNodeB
SON
800/900MHz
1800/2100MHz
2.6GHz
RRU
RRU
2.6GHz
GGGU UU 2100MHz
LLLL LL
1800MHz
LLL
GGG
TTT
900MHz
E E EUUU
800MHz
8XMacro:
BTS3900L
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
+
Close to antenna
3MRRU
Multi-band/Multimode/MIMO
Smallest RRU: <15 kg
Page 35
Centralized
installation
PA2
PA1
>15%
Dual-band Intelligent
Shutdown
Power on
off F2 during low load
when load
increasing
>20%
power saving
F2: hot
spot
F1: seamless
at coverage
hot
spot
voltage according to
output power,
modulation mode, etc.
5% PA Efficiency
Improvement
>10% Y-o-Y
Power Consumption
Dynamic PA Voltage
Adjustment Dynamically adjust PA
16% reduction
11%
2009
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
2010
Page 36
2011
Minimize Configuration
Improve Network KPI
Shorten Expertise Education
Simplify Network management
Planning
Phase
ON
Deployment
Phase
Maintenance
Phase
Optimization
Phase
Inventory Management
Sleeping Cell detection
Antenna Fault Detection
Cell/interface/sub. trace
Test
scenari
o
Handover
success
rate
Total
automatic
added
neighbors
Round
1
91%
74
Round
2
97%
94
SON makes LTE network more efficient and solves new challenges when network architecture
changes
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 37
Self-Config.: Quick
Deployment
File Server
S/W
Config
Config
Config
EMS + DHCP
Config
S/W
New
eNodeB
Cell A
CellBB
Cell
Cell B
Cell C
parameters
Reduce call drop rate, handover failure rate,
Reduce unnecessary redirection
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
unnecessary HO Rate
HO successful rate
Cell C
Cell A
More reliable
Improve network KPI by HO optimization
Page 38
MOCN
Poland
eRAN Sharing
f1
Mobyland
Tele2
Carrier Shared
f1/F2
f2
F1/F2
F1/F2
Centern
et
Telenor
Independent expansion
Shared optimization
UE compliant to 3GPP R8
No requirement for UE
Smooth Evolution
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 40
LTE
2600MHz
2100MHz
UMTS
LTE
GSM
LTE
1800MHz
GSM
UMTS
900MHz
2010
800M
900M
mRRU
GSM
UMTS
LTE
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
MRFU
LTE
2011
1800M
LTE
GSM
SDR
LTE
800MHz
Technolo
gy
SDR
SDR
2012
2100M
2.6G
SDR
GSM+LTE
GL Refarming Solution
-- Supporting Smooth Evolution from GSM to LTE
GSM
GSM
Software
upgrade
MRRU
900M/1800
M
2*2 MIMO
GSM
GSM
900M/1800
M
2*2 MIMO
LTE
LTE MIMO
Software
upgrade
LTE
Software
upgrade
L
T
E
LTE
GSM
L
T
E
L
T
E
LTE
MIMO
F
A
N
LTE Board
Software
upgrade
LTE
GSM
MRFU
Multi-mode
BBU GSM Board
LTE
LTE
GSM+LTE
GSM+LTE
GTMU
Power
Power
Add
LTE Board
F
A
N
LBBP
GTMU
LMPT
Power
Power
Software
Upgrade
F
A
N
LTE
Board
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 42
Power
LBBP
LMPT
Power
Thank you
www.huawei.com