Beruflich Dokumente
Kultur Dokumente
MBSC_TolPlazaCiawi2
MIP_MBSC_TolPlazaCiawi1_CL06_BC_01&CL06_BQ_11&CL06_BQ_14_Batch07
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 1
BEFORE
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
AFTER
Page 2
BEFORE
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
AFTER
Page 3
AFTER
BEFORE
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 4
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 5
Area
MIP Area
Category
BSC
Problem
Team Handling PIC
Category
Status
Solution
Category
Solution
CL06_BC_01&CL06
Cluster_0 MBSC_TolPlazaC
_BQ_11&CL06_BQ_ Residence
Quality
6
iawi1
14
Performance
CL_0
6
Closed
Parameter
_Tuning
CL06_BC_01 : Mod GcellIdle Basic with CRO to faster reselection good level
on location bad spot
CL06_BQ_11 : Mod G2GNCELL to faster HO from site
BOO222MM1_DRAMAGA2MD2 to site
BOO818MD1_CIHERANGDRAMAGADMTMD3
CL06_BQ_14 : Mod G2GNCELL to faster HO from site
BOO339MM1_PRMBUKITASRIMG3 to site
BOO187MG1_SUKAHARJABGRMG1
AFTER
BEFORE
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 6
Update Date
Actual
Closed Date
Date Action
26/07/2016
Date Action
26/07/2016
Area
MIP Area
Category
BSC
Problem
Category
Team
Handling
PIC
Status
Solution
Category
Solution
CL06_BC_01&CL0
Residenc Cluster_0 MBSC_TolPlazaC
6_BQ_11&CL06_B
e
6
iawi1
Q_14
Quality
Performance CL_06
Closed
Parameter
_Tuning
CL06_BC_01 : Mod GcellIdle Basic with CRO to faster reselection good level
on location bad spot
CL06_BQ_11 : Mod G2GNCELL to faster HO from site
BOO222MM1_DRAMAGA2MD2 to site
BOO818MD1_CIHERANGDRAMAGADMTMD3
CL06_BQ_14 : Mod G2GNCELL to faster HO from site
BOO339MM1_PRMBUKITASRIMG3 to site
BOO187MG1_SUKAHARJABGRMG1
BEFORE
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Update Date
Actual Closed
Date
Date Action
26/07/2016
Date Action
26/07/2016
AFTER
Page 7
Action Taken,
Parameter Tuning
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 8
Action Taken,
Justific_C
R
Problem:
Bad Lev due to :
CL06_BC_01 : Late reselection from site BOO818MD1_CIHERANGDRAMAGADMTMD3
Bad Qual due to :
CL06_BQ_11 : Dragging serv from site BOO222MM1_DRAMAGA2MD2 & Late HO from site BOO222MM1_DRAMAGA2MD2 to site
BOO818MD1_CIHERANGDRAMAGADMTMD3.
Solution:
CL06_BC_01 : Mod GcellIdle Basic with CRO to faster reselection good level on location bad spot
CL06_BQ_11 : Mod G2GNCELL to faster HO from site BOO222MM1_DRAMAGA2MD2 to site BOO818MD1_CIHERANGDRAMAGADMTMD3
Long Term Solution:
Summary:
KPI Distribution slightly maintain
RxLev MR & RxQual MR have a improvement
Drive Test Result have a improvement
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 9
Action Taken,
Parameter Tuning
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 10
Action Taken,
Justific_C
R
Problem:
Bad Qual due to :
CL06_BQ_14 : Late HO from site BOO339MM1_PRMBUKITASRIMG3 to site BOO187MG1_SUKAHARJABGRMG1
Solution:
CL06_BQ_14 : Mod G2GNCELL to faster HO from site BOO339MM1_PRMBUKITASRIMG3 to site BOO187MG1_SUKAHARJABGRMG1
Long Term Solution:
Summary:
KPI Distribution slightly maintain
RxLev MR & RxQual MR have a improvement
Drive Test Result have a improvement
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 11
Action
date
Action
date
Parameter Tuning
Action
date
Action
date
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 12
Action
date
Action
date
Parameter Tuning
Action
date
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Action
date
Page 13
Action
date
Action
date
Parameter Tuning
Action
date
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Action
date
Page 14
HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR
Page 15