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2G MIP REPORT BAD SPOT

MBSC_TolPlazaCiawi2
MIP_MBSC_TolPlazaCiawi1_CL06_BC_01&CL06_BQ_11&CL06_BQ_14_Batch07

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Page 1

Capture Tems Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BC_01_Batch07

BEFORE

Late reselection from site


BOO818MD1_CIHERANGDRAMAGADM
TMD3

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

AFTER

Mod GcellIdle Basic with CRO to faster


reselection good level on location bad
spot

Page 2

Capture Tems Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BQ_11_Batch07

BEFORE

Dragging serv from site BOO222MM1_DRAMAGA2MD2 & Late HO from site


BOO222MM1_DRAMAGA2MD2 to site
BOO818MD1_CIHERANGDRAMAGADMTMD3 to good level on area bad spot

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

AFTER

Mod G2GNCELL to faster HO from site


BOO222MM1_DRAMAGA2MD2 to site
BOO818MD1_CIHERANGDRAMAGADMTMD3

Page 3

Capture Tems Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BQ_14_Batch07

AFTER

BEFORE

Late HO from site


BOO339MM1_PRMBUKITASRIMG3 to
site
BOO187MG1_SUKAHARJABGRMG1

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Mod G2GNCELL to faster HO from site


BOO339MM1_PRMBUKITASRIMG3 to
site
BOO187MG1_SUKAHARJABGRMG1

Page 4

Preposition Bad spot on MAP by CI_Basic

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Page 5

Plot RxLevel: Before vs After, Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BC_01&CL06_BQ_11&CL06_BQ_14_Batch07


New Bad Spot No

Area
MIP Area
Category

BSC

Problem
Team Handling PIC
Category

Status

Solution
Category

Solution

CL06_BC_01&CL06
Cluster_0 MBSC_TolPlazaC
_BQ_11&CL06_BQ_ Residence
Quality
6
iawi1
14

Performance

CL_0
6

Closed

Parameter
_Tuning

CL06_BC_01 : Mod GcellIdle Basic with CRO to faster reselection good level
on location bad spot
CL06_BQ_11 : Mod G2GNCELL to faster HO from site
BOO222MM1_DRAMAGA2MD2 to site
BOO818MD1_CIHERANGDRAMAGADMTMD3
CL06_BQ_14 : Mod G2GNCELL to faster HO from site
BOO339MM1_PRMBUKITASRIMG3 to site
BOO187MG1_SUKAHARJABGRMG1

AFTER

BEFORE

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Page 6

Update Date

Actual
Closed Date

Date Action
26/07/2016

Date Action
26/07/2016

Plot RxQual: Before vs After, Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BC_01&CL06_BQ_11&CL06_BQ_14_Batch07


New Bad Spot No

Area
MIP Area
Category

BSC

Problem
Category

Team
Handling

PIC

Status

Solution
Category

Solution

CL06_BC_01&CL0
Residenc Cluster_0 MBSC_TolPlazaC
6_BQ_11&CL06_B
e
6
iawi1
Q_14

Quality

Performance CL_06

Closed

Parameter
_Tuning

CL06_BC_01 : Mod GcellIdle Basic with CRO to faster reselection good level
on location bad spot
CL06_BQ_11 : Mod G2GNCELL to faster HO from site
BOO222MM1_DRAMAGA2MD2 to site
BOO818MD1_CIHERANGDRAMAGADMTMD3
CL06_BQ_14 : Mod G2GNCELL to faster HO from site
BOO339MM1_PRMBUKITASRIMG3 to site
BOO187MG1_SUKAHARJABGRMG1

BEFORE

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Update Date

Actual Closed
Date

Date Action
26/07/2016

Date Action
26/07/2016

AFTER

Page 7

Action Taken,

Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BC_01&CL06_BQ_11_Batch07

Parameter Tuning

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Page 8

Action Taken,

Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BC_01&CL06_BQ_11_Batch07

Justific_C
R

Problem:
Bad Lev due to :
CL06_BC_01 : Late reselection from site BOO818MD1_CIHERANGDRAMAGADMTMD3
Bad Qual due to :
CL06_BQ_11 : Dragging serv from site BOO222MM1_DRAMAGA2MD2 & Late HO from site BOO222MM1_DRAMAGA2MD2 to site
BOO818MD1_CIHERANGDRAMAGADMTMD3.
Solution:
CL06_BC_01 : Mod GcellIdle Basic with CRO to faster reselection good level on location bad spot
CL06_BQ_11 : Mod G2GNCELL to faster HO from site BOO222MM1_DRAMAGA2MD2 to site BOO818MD1_CIHERANGDRAMAGADMTMD3
Long Term Solution:
Summary:
KPI Distribution slightly maintain
RxLev MR & RxQual MR have a improvement
Drive Test Result have a improvement

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Page 9

Action Taken,

Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BQ_14_Batch07

Parameter Tuning

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Page 10

Action Taken,

Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BQ_14_Batch07

Justific_C
R

Problem:
Bad Qual due to :
CL06_BQ_14 : Late HO from site BOO339MM1_PRMBUKITASRIMG3 to site BOO187MG1_SUKAHARJABGRMG1
Solution:
CL06_BQ_14 : Mod G2GNCELL to faster HO from site BOO339MM1_PRMBUKITASRIMG3 to site BOO187MG1_SUKAHARJABGRMG1
Long Term Solution:
Summary:
KPI Distribution slightly maintain
RxLev MR & RxQual MR have a improvement
Drive Test Result have a improvement

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Page 11

TCH Traffic &SDCCH Traffic Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BC_01&CL06_BQ_11&CL06_BQ_14_Batch07

Action
date

Action
date

Parameter Tuning

Action
date

Action
date

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Page 12

CSSR & SDSR Bad Spot


MIP_MBSC_TolPlazaCiawi1_CL06_BC_01&CL06_BQ_11&CL06_BQ_14_Batch07

Action
date

Action
date

Parameter Tuning

Action
date

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Action
date

Page 13

Main KPI Distribution Bad Spot MIP_MBSC_TolPlazaCiawi1_CL06_BC_01&CL06_BQ_11&CL06_BQ_14_Batch07

Action
date

Action
date

Parameter Tuning

Action
date

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Action
date

Page 14

HUAWEI TECHNOLOGIES
CO., LTD.
HISILICON
SEMICONDUCTOR

Page 15

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