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Sealing Material
Bond Pads
A.
B.
Etch
C.
Sealing Material
D.
NanoGetters
Cavity
Cap Wafer
NanoGetters
Vacuum
E.
Active Micromachine Wafer
Resonator or Tunneling Cantilever
Bond Pad
The process flow for glass frit wafer bonding, including the
addition of the thin film getter used to form the chip-level
vacuum package.
Q=61,700
Gain (db)
-5
Q values of
2,000-68,000
are obtained by
wafer-level vacuum
packaging
-10
-15
-20
-25
-30
16354
16355
16356
16357
Frequency (Hz)
16358
33000
31000
29000
27000
25000
23000
21000
19000
17000
15000
0
500
1000
1500
2000