THIN FILMS

by:
S.ARUNKUAMAR
 Thin Films
Athin filmis alayerof material
ranging from fractions of
ananometer(monolayer) to
severalmicrometersin thickness.
Thin film technology is a "self
organizing" structural evolution.
Ex: In ancient times, people already
knew how to beat gold into a thin
film (< 1 m thickness) with
hammers and knew how use this 2
Purpose of Thin Film development

o To maintain surface uniformity.

o To reduce the amount (or mass) of light
absorbing material.
o Spray Coating Technology for Superior
Functional Medical Coatings.
o To decrease the weight and bulkiness of the
materials.

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 Thin Film Technology
Thin film technology involves deposition of
individual molecules or atoms.
Uniform ultra-thin film coatings onto stents,
catheters, balloons, endoscopic instruments,
pacemakers, heart valves, glucose monitors,
sensors, medical textiles, blood collection
tubes, surgical implants, orthopedic
implants, and diagnostic devices.
Example for industrial thin films produced
are:
1. 1.Amorphous Silicon (a-Si)
2. 2.Cadmium Telluride (CdTe)

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Properties to be considered!
FILM THICKNESS : The physical properties of a thin film
are highly dependent on their thickness. Thickness
measurement methods are applied during deposition ("in
situ") and methods by which the thickness can be
determined after finishing a coating run ("ex situ").
a) Gravimetric Method b) Optical Method
ROUGHNESS : In Ultrathin Films, it can influence all film
properties such as mechanical, electrical, magnetical or
optical properties. roughness types, the mechanisms of their
origin, roughness measurement and roughness
quantification needs to be taken into consideration.

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 CHEMICAL PROPERTIES:
Conventional methods of chemical analysis
as atomic emission, atomic absorption spectral
analysis, X-ray fluorescence and mass
spectrometry play an important role for the
production of the coating materials.
Interaction of photons, electrons, ions or other
particles with the coating or surface has to be
analyzed.
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 Deposition Techniques
Deposition processes is done to
controllably transfer atoms from a
sourceDEPOSITION
to a substrate
TECHNIQUES

GLOW-
DISCHARGE GAS-PHASE
TECHNOLO CHEMICAL
GIES PROCESSES

EVAPORATIVE LIQUID-PHASE
METHODS CHEMICAL
FORMATION
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Chemical Vapour Deposition(CVD)
Gaseous compounds react to
form a dense layer on a
heated substrate. The most
widely deposited wear-
resistant coatings are TiC, TiN,
chromium carbide and
alumina. Deposition
temperatures are generally in
the range 800-1000C.
Thicknesses are limited to
about 10m due to the
thermal expansion mismatch
stresses which develop on
cooling which also restrict the
coating of sharp edged
components.
Advantages
High coating hardness
Good adhesion (if the coating is
not too thick)
Good throwing power (i.e.
uniformity of coating)
Disadvantages
High temperature process (distortion)
Sharp edge coating is difficult
(thermal expansion mismatch
stresses)
Limited range of materials can be
coated
Environmental concerns about
process gases
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Physical Vapour Deposition (PVD)

Low pressure coating processes in

which the coating flux is produced
Advantages
by a physical process. There are
two main types:-
1. Evaporation
2. Sputtering
. In both cases the source material
is a solid (metal or ceramic). A
reactive gas may be used in the
Disadvantages
deposition chamber to deposit
compound coatings from an
elemental source or maintain the
stoichiometry of coatings from
compound sources, though thinner
layers are used in microelectronics
and thicker layers are used for
high temperature .
Excellent process control
Low deposition temperature
Dense, adherent coatings
Elemental, alloy and
compound coatings possible
Vacuum processes with high
capital cost
Limited component size
treatable
Relatively low coating rates
Poor throwing power without
manipulation of components
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Ultrasonic Nozzle Technology

Low velocity, soft spray with minimal

overspray saves up to 80% in coating material
Independent control of process parameters
including flow rate, spray velocity, drop size
and deposition
Precise control over a wide range of flow rates
Non-clogging, repeatable performance
Choice of drop size depending on nozzle
frequency (drop sizes range from 18 - 49
microns)
Deagglomeration of particles in suspension
due to ultrasonic vibration
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 Thin Film Advantages
o Simple fabrication
o Requires low fabrication
temp (300 C)
o Manufacturing requires
little materials. -thin cell
to crystalline thickness=
1 to 300
o Flexible/ non-breakable
o High voltage can be
obtained
o No infrastructure needed
to support cells
o Cell can double as
building material
(roofing tiles, walls, etc)
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 APPLICATION

Thin-film solarcell
Blood collection
Orthopedic Implants

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 Future of Thin Films
Natures solution to thin film cells.

Developing molecules out of organic

compounds like carbon and hydrogen

Super-thin film about 100 nanometers thick,

can be applied as a paint.

Replaces heavy metals currently being used

in cells. Creates a biodegradable, almost
natural cell.
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