Beruflich Dokumente
Kultur Dokumente
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Manufacturing Processes
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Manufacturing Processes
Copper Laminate
PRE-PREG
Many combinations of
material thickness can be
Layer 6 (Outer) FOIL used.
PCB Fabricators
manufacturing techniques
vary
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Manufacturing Processes
Layer 1
Layer 2
Impedance Considerations
Press temperature and
Layer 3 pressure have an effect on
the flatness and hence
Layer 4 impedance. This should be
checked prior to drilling
Layer 5
Drilling itself does not effect
impedance
Layer 6
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Manufacturing Processes
Layer 1
Layer 2
Impedance Considerations
Electroless copper effects
Layer 3 copper thickness on outer
layers (T)
Layer 4
Sometimes other solutions
are used containing carbon
Layer 5
etc
Layer 6
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Manufacturing Processes
Layer 1
Layer 2
Impedance Considerations
Does not effect impedance
Layer 3
Layer 4
Layer 5
Layer 6
Copper
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Manufacturing Processes
Electro-plating Process 1
Additional Copper to all Exposed Surfaces
Layer 1
Layer 2
Impedance Considerations
Electro-plating increases the
Layer 3 copper thickness on outer
layers (T)
Layer 4
This will always be variations
in the amount of copper
Layer 5
added.
Electro-plating Process 2
Add Tin over Exposed Copper Areas
Tin Plating
Laminated Film Additional Copper
Layer 1
Layer 2
Impedance Considerations
Does not effect impedance
Layer 3
Layer 4
Layer 5
Layer 6
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Manufacturing Processes
Electro-plating Process 3
Remove Laminated Film
Layer 1
Layer 2
Impedance Considerations
Does not effect impedance
Layer 3
Layer 4
Layer 5
Layer 6
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Manufacturing Processes
Layer 1
Layer 2
Impedance Considerations
The etch process produces
Layer 3 an etch back or undercut of
the tracks. This can be
Layer 4 specified by the W / W1
parameters
This means that tracks will
Layer 5
end up approximately
0,025 mm (0.001) thinner
Layer 6 than the original design.
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Manufacturing Processes
Layer 1
Layer 2
Impedance Considerations
The Removal of Tin will
Layer 3 slightly reduce the copper
thickness (T) on the outer
Layer 4 layers
Layer 5
Layer 6
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Manufacturing Processes
Layer 1
Layer 6
Tracks
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Manufacturing Processes
Impedance Considerations
Some PCB Fabricators chose
to check the impedance
before the solder mask is
Layer 6
added
Structures can be checked in
Normal and Coated mode
Thickness of solder mask
should be specified using H1
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Manufacturing Processes
Impedance Considerations
Does not effect impedance
Layer 6
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Manufacturing Processes
Impedance Considerations
Surface Finish (Tin / Lead /
Gold / Silver) is usually only
added to pads
Layer 6
If board has no solder mask
the thickness of finish should
be added to T.
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Manufacturing Processes
Component Notation
SCL2 9624
R34
Impedance Considerations
Does not effect impedance
IC3
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Manufacturing Processes
Impedance Considerations
Controlled Impedance
coupons are routed from the
panel
Good controls are necessary
to ensure that coupons can
be matched to manufacturing
panels
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Manufacturing Processes
Impedance Considerations
Controlled Impedance
coupons are routed from the
panel
Controls are necessary to
ensure that coupons can be
matched to manufacturing
panels this should be
performed on trial panels
prior to production ramp up.
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Manufacturing Processes
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Manufacturing Processes
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Manufacturing Processes
Impedance Considerations
Controlled Impedance
coupons are routed from the
panel
Controls are necessary to
ensure that coupons can be
matched to manufacturing
panels this should be
performed on trial panels
prior to production ramp up.
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Design & test tools for controlled impedance & Signal integrity
PCB Faultfinding systems & software
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