Beruflich Dokumente
Kultur Dokumente
P-type Semiconductors: P-type is created by doping with impurity atoms having three
valence electrons boron, gallium, indium
Note that there are insufficient number of electrons to complete covalent bonds resulting
a hole
This hole is ready to accept a free electron
The diffused impurities with three valence electrons are called acceptor atoms.
Diode :Diode is formed by bringing these two p- and n-type materials together
Depletion region : Electrons and holes at joined region will combine, resulting in a
lack of carriers in the region near the junction called the depletion region
Semiconductor Diode Cont..
Reverse bias is the condition that prevents current through the diode.
The external potential of V volts (DC Voltage Source) is applied across the
P-N junction such that the positive terminal is connected to N-type
material and the Negative terminal is connected to P-type material as
shown in figure 1.16.
Unlike charges attract each other i.e. the positive of the bias- voltage source
Pulls the free electrons , which are the majority carriers in the n-region,
away from the PN- junction.
In P-type region, the negative of the bias- voltage source Pulls the
positive charges (holes) which are the majority carriers in the P-region,
away from the PN- junction.
VD
ID I S (e nVT
1)
VD
ID ISe nVT
IS Eq 1.4
VT kT / q Thermal Voltage
VT kT / q
a. VT = (1.38x10-23 )(273+27)/(1.6x10-19)
VT = 26 mV
b. VT =32.17 mV
Reverse Saturation Current (IS)
Zener Region (Reverse Break Down) Cont.
Avalanche-breakdown:
Normally, the reverse current is so small that it can be neglected.
If the external reverse bias voltage is increased to a value called the breakdown
voltage , the reverse current will increase drastically.
Concept: The high reverse bias- voltage imparts energy to the free minority electrons so
that as they speed up through the P-region , they collide with atoms with enough energy
to knock valence electrons out of orbit and into the conduction band. The newly created
conduction- electrons are also high in energy and repeat the process. If an electron
knocks out another electron from their valence orbit results two free electrons. Now
these two electrons knocks two more electrons out of their valence orbit during its
travel through the P-region makes four free electrons. The process is continue and the
number quickly multiply. As these high-energy electrons go through the depletion
region, they have enough energy to go through the N-region as conduction electrons,
rather than combining with holes.
The multiplication of conduction electrons just discussed is known as avalanche and
results in a very high reverse current that can damage the diode because of excessive
heat dissipation.
PIV or PRV: The maximum reverse-bias potential that can be applied before entering the
Zener region is called the peak inverse voltage (referred to simply as the PIV rating) or
the peak reverse voltage (denoted by PRV rating).
Silicon versus Germanium
Silicon diodes have, in general, higher PIV and current rating and wider
temperature ranges than germanium diodes.
PIV ratings for silicon can be in the neighborhood of 1000 V.
PIV ratings for germanium is closer to 400 V.
forward-bias voltage required for commercially available silicon (Si) diodes is of
magnitude 0.7 V.
forward-bias voltage required for commercially available Germanium (Ge) diodes
is of magnitude 0.3 V.
The potential at which this rise occurs is commonly referred to as the offset,
threshold, or firing potential.
The notation VT has been adopted, from the word threshold.
VT = 0.7 (Si)
VT = 0.3 (Ge)
Typical values of IS for silicon are much lower than that of germanium for similar
power and current levels as shown in next slide.
Silicon versus Germanium
Temperature Effects
Silicon can be used for applications in which the temperature may rise to about 200C
(400F).
Germanium has a much lower maximum rating (100C).
As the temperature increases, the forward characteristics are actually becoming more ideal,
At room temperature there are approximately 1.5 x1010 free carriers in a cubic centimeter of
intrinsic silicon material.
At the same temperature, intrinsic germanium material will have approximately 2.5 1013 free
carriers per cubic centimeter.
The ratio of the number of carriers in germanium to that of silicon is greater than 103 would
indicate that germanium is a better conductor at room temperature.
In the forward-bias region the characteristic of a silicon diode shift to the left at a rate of 2.5
mV per centigrade degree increase in temperature.
In the reverse-bias region the reverse saturation current of a silicon diode doubles for every 10
0C rise in temperature.
Temperature Effects cont.
The ideal diode is a two-terminal device having the symbol and characteristics
shown in Figs. 1.1a and b, respectively.
The term ideal refers to any device or system that has ideal
characteristicsperfect in every way.
It provides a basis for comparison, and it reveals where
improvements can still be made.
i. AC or Dynamic Resistance
ii. DC or Static Resistance
AC or Dynamic Resistance
The varying input will move the instantaneous operating point up and down a
region of the characteristics and thus defines a specific change in current and
voltage.
rd= Vd/Id
AC or Dynamic Resistance cont..
rd= Vd/Id
DC or Static Resistance
The application of a dc voltage to a circuit containing a semiconductor diode
will result in an operating point on the characteristic curve that will not
change with time.
The resistance of the diode at the operating point can be found simply by
finding the corresponding levels of VD and ID.
RD=VD/ID
Higher the current through a diode, the lower is the dc resistance level.
Example 1.3
a. Determine the ac resistance at ID=2mA.
b. Determine the ac resistance at ID=25mA.
c. Compare the results of part (a) and (b) to
the dc resistances at each current level.
Solution:
a. Id=4mA-0mA=4mA
Vd=0.76V-0.65V=0.11V
rd =27.5
b. Id=30mA-20mA=10mA
Vd=0.8V-0.78V=0.02V
rd =2
c. RD =VD / ID=0.7V/2mA
=350
RD =VD / ID=0.79V/25mA
=31.62
EXAMPLE 1.1
Determine the dc resistance levels for the
diode of Fig. 1.31 at
(a) ID = 2 mA
(b) ID = 20 mA
(c) VD = -10 V
Figure 1.31
EXAMPLE 1.1 cont