Beruflich Dokumente
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Text Books:
1. W. D. Callister, Jr: Materials Science and Engineering- An Introduction, John Wiley and Sons, N.Y, 1985.
2. J. F. Shackelford: Introduction to Materials Science for Engineers, Mc-Millan Publishing Co., N.Y. 1992.
3. W.F. Smith: Principles of Materials Science and Engineering, Mc Graw Hill Int., 1986.
4. V. Raghavan: Materials Science and Engineering, 4th Ed., Prentice Hall of India, 1998.
Metals: valence electrons are detached from atoms, and spread in an 'electron sea' that "glues" the ions
together. Metals are usually strong, conduct electricity and heat well and are opaque to light (shiny if
polished). Examples: aluminum, steel, brass, gold.
Semiconductors: the bonding is covalent (electrons are shared between atoms). Their electrical
properties depend extremely strongly on minute proportions of contaminants. They are opaque to
visible light but transparent to the infrared. Examples: Si, Ge, GaAs.
Ceramics: atoms behave mostly like either positive or negative ions, and are bound by Coulomb forces
between them. They are usually combinations of metals or semiconductors with oxygen, nitrogen or
carbon (oxides, nitrides, and carbides). Examples: glass, porcelain, many minerals.
Polymers: are bound by covalent forces and also by weak van der Waals forces, and usually based on H,
C and other non-metallic elements. They decompose at moderate temperatures (100 – 400 C), and are
lightweight. Other properties vary greatly. Examples: plastics (nylon, Teflon, polyester) and rubber.
Other categories are not based on bonding. A particular microstructure identifies composites, made of
different materials in intimate contact (example: fiberglass, concrete, wood) to achieve specific
properties. Biomaterials can be any type of material that is biocompatible and used, for instance, to
replace human body parts.
POLYMERS
Polymers are macro-sized molecules of relatively high molecular mass. They are obtained by joining together a large
number of small molecules. Structurally, they are characterized by many repeating molecular units which form linear
chains or a cross-linked network. The process of formation of polymers from their starting materials is called
polymerization and the small molecules that combine with each other are termed as monomers.
A polymer may be made by polymerization of a large number of one or more compounds. Thus, polythene is
made only from ethylene (ethene) but nylon-66 is made from H2N-(CH2)6-NH2 (hexamethylene diamine) and
HOOC(CH2)4COOH (adipic acid).
IONIC BONDING
COVALENT BONDING
METALLIC BONDING
INTERMOLECULAR BONDING
INTERMOLECULAR BONDING
INTERMOLECULAR BONDING
INTERMOLECULAR BONDING
Atomic Bonding
• Covalent • Metallic
– sharing electrons – metal ions in sea or electrons
– strong – moderately strong
– directional – non-directional
• Ionic • Secondary
– trading of elecrons – Van der Waals
– electrostatic attraction or ions – H-bonding
– strong – electrostatic attraction of
– non-directional electric dipole (local charge
distribution
– weak
Types of Materials
• Metals:
– Strong, ductile
– high thermal & electrical conductivity
– opaque, reflective.
• Polymers/plastics: Covalent bonding sharing of e’s
– Soft, ductile, low strength, low density
– thermal & electrical insulators
– Optically translucent or transparent.
• Ceramics: ionic bonding (refractory) – compounds of metallic & non-
metallic elements (oxides, carbides, nitrides, sulfides)
– Brittle, glassy, elastic
– non-conducting (insulators)
BONDING CHARACTERISTICS – SIGNIFICANCE
Summary: Primary Bonds
Ceramics Large bond energy
large Tm
(Ionic & covalent bonding): large E
small a
6
5
4
(10-8 Ohm-m)
Resistivity, r
3
2
1
0 T (°C)
-200 -100 0
• Adding “impurity” atoms to Cu increases resistivity.
• Deforming Cu increases resistivity.
THERMAL
• Space Shuttle Tiles: • Thermal Conductivity
--Silica fiber insulation of Copper:
offers low heat conduction. --It decreases when
you add zinc!
400
Thermal Conductivity
300
(W/m-K)
200
100
0
0 10 20 30 40
Composition (wt% Zinc)
100mm
MAGNETIC
• Magnetic Storage:
• Magnetic Permeability
--Recording medium vs. Composition:
is magnetized by --Adding 3 atomic % Si
recording head. makes Fe a better
recording medium!
Fe+3%Si
Magnetization
Fe
Magnetic Field
OPTICAL
• Transmittance:
--Aluminum oxide may be transparent, translucent, or
opaque depending on the material structure.
polycrystal: polycrystal:
single crystal low porosity high porosity
Fundamentals of Structure of Crystalline
Solids
ISSUES TO ADDRESS...
• How do atoms assemble into solid structures in
crystalline and non-crystalline materials?
typical neighbor
bond length
typical neighbor r
bond energy
typical neighbor
bond length
typical neighbor r
bond energy
Noncrystalline materials...
Si Oxygen
• atoms have no periodic packing
• occurs for: -complex structures
-rapid cooling
y
a 000 b Point coordinates for unit cell
x
corner are 111
z 2c
Translation: integer multiple of
lattice constants
identical position in another
unit cell
b y
b
Crystallographic Directions
z Algorithm
z
[ u ' v ' w ' ] [ uvtw ]
1
u = ( 2 u ' - v ')
3
a2 1
v = ( 2 v ' - u ')
3
-
a3 t = - (u + v )
a1
w = w '
Crystallographic Planes
Crystallographic Planes
• Miller Indices: Reciprocals of the (three) axial
intercepts for a plane, cleared of fractions &
common multiples. All parallel planes have same
Miller indices.
• Algorithm
1. Read off intercepts of plane with axes in
terms of a, b, c
2. Take reciprocals of intercepts
3. Reduce to smallest integer values
4. Enclose in parentheses, no
commas i.e., (hkl)
Miller Indices
(hkl) specific
Planes - No commas
{hkl} family
- No fractions
- Negative indicated
[hkl] specific
Directions by bar overnumber
<hkl> family
example a b c c
1. Intercepts 1 1
2. Reciprocals 1/1 1/1 1/
1 1 0
y
3. Reduction 1 1 0
a b
4. Miller Indices (110) x
z
example a b c
1. Intercepts 1/2 c
2. Reciprocals 1/½ 1/ 1/
2 0 0
3. Reduction 2 0 0 y
4. Miller Indices (100) a b
x
Crystallographic Planes
z
example
a b c
c
1. Intercepts 1/2 1 3/4
2. Reciprocals 1/½ 1/1 1/¾
2 1 4/3 y
a b
3. Reduction 6 3 4
x
4. Miller Indices (634)
example a1 a2 a3 c
1. Intercepts 1 -1 1
2. Reciprocals 1 1/ -1 1
1 0 -1 1 a2
3. Reduction 1 0 -1 1
a3
33
Miller Indices - Directions
c
b -1 1/2
a
x y z
-1/3
1/2 -1 -1/3 (x 6)
3 6 2
1/2
1 x y z
1 1/4 1/2 (x 4)
4 1 2
1/4
Miller Indices - Planes
c c
1 1
b 4 b 4
a a
1 1
2 2
x y z
intercept 1/4 -1/2
reciprocal 4 0 -2
4 0 2
Miller Indices - Planes
c
c
1 b
1
3 a
3
b
a
1 1
4 4
1 1
2 2
x y z
intercept 1/4 -1/3 -1/2
reciprocal 4 -3 -2
4 3 2