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Non-Destructive Testing

A short review
Description
Technical methods to examine materials
and/or components in ways that do not impair
future usefulness and serviceability in order to
detect, locate, measure, interpret, and
evaluate flaws
General Procedure
Nondestructive
Testing

Indication

Interpretation

False Relevant Nonrelevant

Evaluation

Accept Reject
NDT Methods
• RT — Radiography Testing
• UT — Ultrasonics Testing
• MT — Magnetic Particle Testing
• PT — Liquid Penetrants Testing
• VT — Visual Testing
• LT — Leak Testing
• ET — Electromagnetic (Eddy Current) Testing
• AE — Acoustic Emission
THANK YOU
Ultrasonics Testing (UT)
• Definition & Principal
• Technique
• Testing Procedure
Definition & Principal (UT)
• UT → NDT method to determine discontinuities
under surface material using ultrasonic
frequency (>20 kHz).
• Ultrasonic sound wave will be refleckted if meets
different medium (crack in steel, backwall, etc)
• Respone of reflected ultrasonic sound wave will
be maximum if direction of ultrasonic sound
wave perpendicular to reflecting surface (cracks,
discontinuity, backwall, etc).
Definition & Principal (UT) cont...
• Example of A-scan display
Technique (UT)
1. Straight beam

Limited to lamination crack (parallel to surface).


Crack detected by pulse behind backwall pulse.
Technique (UT) cont..
2. Angle beam
px
x

td β sd
Pd
Crack on leg I if pulse scale Crack on leg I if pulse scale
Testing Procedure (UT)
Straight Beam Angle Beam
Precleaning

Sweep Range Calibration on


standard block & Confimation

Backwall pulse calculation Determine discontinuity


pulse location
Finding discontinuity pulse by scanning
(discontinuity pulse < backwall pulse) Finding discontinuity pulse by scanning

Determine location and Determine location and


depth of discontinuity depth of discontinuity

Plotting
Magnetic Particle Testing (MT)
• Definition & Principal
• Technique
• Testing Procedure
Definition & Principal (MT)
• MT → NDT method to detect cracks and other
discontinuities on the surfaces or subsurface of
ferromagnetic materials.
• Particle patterns form on the surface where the
magnetic field is forced out of the part and over
discontinuities to cause a leakage field that
attracts the particles.
• Sensitivity of particle pattern will be maximum if
lines of flux oriented perpendicular to the
discontinuities
Definition & Principal (MT) cont...
• Magnetizing current :
– AC → Surface crack detection, poor penetration.
– DC → Deeper crack detection, good penetration.
• Direction of magnetic flux
Technique (MT)
1. Prod
Magnetizing Procedure → prod
to be electrical contacts by
pressed against the surface in
the area
to be examined.

Prod spacing = 3 – 8 in.


Magnetizing Current:
1. t > ¾ in = 100 – 125 amp/in prod spacing
2. t < ¾ in = 90 – 110 amp/in prod spacing
Technique (MT) cont..
2. Longitudinal Magnetization Technique
Magnetizing Current
1. (L/D) ≥ 4
�35000 �
� �
�L + 2 �
Ampere = � D �, n = number _ of _ turn
n
2. 2 < (L/D) < 4
�45000 �
� �
� L �
Ampere = � D �, n = number _ of _ turn
n
3. (L/D) < 2 Coil magnetization technique
Magnetizing Procedure → passing current
cannot be used
through a multi-turn fixed coil (or cables)
that is wrapped around the part or section
of the part to be examined
Technique (MT) cont..
3. Circular Magnetization Technique

Direct contact Magnetizing Procedure →


passing current through the part to be
examined

Central Conductor Magnetizing Procedure →


Magnetizing Current = 300 – 800 passing current through a conductor and
amp/in of outer diameter placed inside of the part to be examined
Technique (MT) cont..
4. Yoke
Lifting Power of Yoke
1. Permanent Yoke → Lifting
power shall be checked daily
prior to use.
2. AC Yoke → yoke shall have a
lifting power of at least 10 lb
(4.5 kg), checked at least one a
year , damaged ,or repaired.
3. DC Yoke → yoke shall have a
lifting power of at least 40 lb
(18 kg), checked at least one a
Yoke produce longitudinal year , damaged ,or repaired.
magnetization.
Testing Procedure (MT)
Continous Magnetization Residual Magnetization
Precleaning

Apply White Contrast Paint

Apply Magnetic Particle Magnetizing


while Magnetizing
Apply Magnetic Particle

Inspect

Demagnetization

Postcleaning
Dye Penetrant Testing (PT)
• Definition & Principal
• Technique
• Testing Procedure
Definition & Principal (PT)
• PT → NDT method to detect discontinuities
which are open to the surface of nonporous
metals and other materials.
• Basic principle of PT method is capillary
attraction or action.
• Normal temperature process 5 - 52°C.
Technique (PT)
1. Water Washable Penetrant
a. Advantages
• Excess penetrant is easily removed with a coarse spray
• The cost is relatively low
• Aplicable for rough surface condition
b. Limitations
• Under or overremoval of penetrant material is
possible
• Not effective for broad or shallow discontinuities
• Limited to water washable system only
Technique (PT) cont...
2. Post Emulsification Penetrant
a. Advantages
• High sensitivity for the detection of smaller
discontinuities (scc, intergranular, etc)
• Less susceptible to overremoval than water washable
penetrant.
b. Limitations
• More time and material is necessary (more expensive)
• It is not as effective for parts with complex shapes
• The emulsification time must be closely controlled
Technique (PT) cont...
3. Solvent Removable Penetrant
a. Advantages
• Can be used for spot examinations on large parts
• Effective when water removal is not feasible
b. Limitations
• The use of solvent for removal limits this technique to
smaller areas
• The sensitivity can be reduced if excessive remover is
applied
• A “background” may occur with this technique, which
could affect the contrast ratio, especially with rougher
surfaces
Testing Procedure (PT)
Water Washable Post Emulsifier Solvent Removable
(Fluorescent dan visible) (Fluorescent dan visible) (Fluorescent dan visible)
Precleaning Precleaning Precleaning

Apply Penetrant Apply Penetrant Apply Penetrant


Penetrant dwell
time 10 – 15 min Apply Lipophilic Water Wash
Emulsifier
Solvent Wipe
Apply Hydrophilic
Emulsifier

Water Wash Apply Developer


10 – 60 min
Drying Apply Water Based
after apply
Wet Developer Inspect developer
Apply Dry
Developer Postcleaning

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