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Module -III
Growth Techniques in Nanomaterial
Recap of previous Modules
Module -I
1. Defination of Nano and Nanomaterial
2. Classification of Nanomaterials
3. Size effects
4. Significancy, Challenges and Applications of Nanomaterials
Module -II
1. Microstructure
2. Defects in nanomaterials
3. E'ect of nanodimension on material properties
Growth Techniques in Nanomaterial
Or
Preparation methods for Nanomaterials
Preparation methods for Nanomaterials
1.Top down
2.Bottom up
Top down
Bottom up
Top down
Nanoparticles
Nanowires/rods/tubes
Nanothinfilms
Bottom up
Preparation methods for Nanomaterials
1.Evaporation
1.Sol-Gel
2.Sputtering
3.Pulsed laser deposition 2.Electrodeposition
4.Molecular beam epitaxy
5.Chemical vapor deposition
(Top down)
Lithographic
O2,H2, N2
etc Remove
(Bottom up) Non-Lithographic
Dis adv
1.Not very clean process
Dis adv 2.Deposition of undesired
1. Costly materials is high
2. Complicated equipments
3. Limited to some materials 3. not compatible with
modenn technology
For each technquie/method
1. Principle
2. Expt Set up
3.Working
4.Advantage and disadvantage
4.Which materials are prepared
General vacuum system
1. Vacuum chamber or
deposition chamber
or growth chamber
2. Vacuum pumps
3.Vacuum
measurement guages
4. Gas inlet
Vacuum chamber Substrate Heater
Substrate rotator
5.Substrate holder
6.Substrate heater
Crystal/Thick
7.Substrate rotator ness monitor
8.Crystal monitor
9. Shutter holder Substrate
Shutter
Wafers
Vacuum system
Exhaust
Evaporation
Thermal evaporation Electron beam evaporation
Wafer holder
Wafers
Atomic
flux
Vacuum system
Exhaust
Thermal evaporation
Principle
Material to be prepared in the form of nanomaterial is
heated to using resistive heating elements and the
evaporated material ( atoms) depostied on the
substrate in form of nanomaterials (particles, wires,
film) depending on the conditions at the substarte.
Resistive heating elements
Tungsten (3000oC)
Molybdenum (2300oC)
Tantalum (3000oC)
Experimental arrangement Heater
Thickness
monitor
holder Substrate
Photos of source material for evaporation
18
Substrate holders
Working Video
1. Load the substrates and material to be deposited in to the vacuum chmaber
3. Resistive element (boat/spira wire) is heated by passing high current through it (I2R)
Wafer holder
Wafers
Atomic
flux
Vacuum system
Exhaust
Depending on the conditions at the substarte
(particles, wires, film)
4. Advantages
1. Principle
Material to be prepared in the form of nanomaterial is
heated to using Electron beam bombardment
(heating) and the evaporated material ( atoms)
depostied on the substrate in form of nanomaterials
(particles, wires, film) depending on the conditions at
the substarte.
2. Experimental set up
Thickne
ss
monitor
holder Substrate
Evaporated material
Photos of source material for evaporation
No powder samples
Source material crucibles
Disadvantages
1.It is costly
2. Incident electron beam can produce the x-rays
3. More di&cult control of (lm composition (ex:ZnS, ZnSe)
4.Which materials are prepared
1.Vacuum system
2.High voltage source
3. Gas inlet(Argon)
Anode
Cathode
Expt Set up
Sputtering
Substrate
Target
material
Portable sputtering systems
Target holders
Substrates:on which we want to
grow nanowires/particles/nanofilms
2222
3. Allow Argon gas till 10-3-10-2 chamber pressure and maintain the
pressure constantly.
4.Switch on the high voltage and apply between the cathode
(target material) and anode (substrate holder).
3. Slightly expensive
5.Which materials are prepared
● Reactive sputtering
● RF sputtering
● Magnetron sputtering
● Collimated sputtering
● Hot sputtering
Molecular beam epitaxy
Most expensive
Mostly used in semiconductor industry
Most Complicated
Molecular beam epitaxy
1.Principle
2. Expt Set up
3. Working
4.Advantages and disadvantages
5.Which materials are prepared
Molecular beam epitaxy
Molecular: Any Material
‘Beam’ :
means the evaporated atoms do not interact
with each other or with other vacuum chamber
gases until they reach the wafer
Epitaxy
Video
1,2,3,4
1. Vacuum system
2. Electrodes
3. Voltage source
4. Extra gas inlet
Expt Set up
Working Videos 222_1,2,3
1. Load the source materials as a anode:
(which material we want to evaporate) and
cathode (on which we want to coat the
material).
2. The inter elect rode distance during t he
stationary period of discharge d ≤ few mm.
3. Create the high vaccum (10-4-10-6 mbar)
4.The pressure of the inert gas (helium) l l
in the discharge chamber is P =5OO Torr..
5. Apply voltage between electrodes
Disadvantages
1.Only limited materials
2.It is difficult to deposit on the substrates like Silicon
Glass substrates.
Which materials are prepared
1.Principle
2.Expt Set up
3.Working
4.Advantages and disadvantages
5.Which materials are prepared
Chemical Vapor Deposition (CVD)
Thinfilm
(Or)
Thin film deposition take place due to a chemical reaction
between vapour phase precursors and hot substrate
2. Expt Set up
Substrate
Working : CVD process steps
Video 1 2 3
Gas stream
1 7
2 6
3 4 5
Wafer
Susceptor
• Reduction (using H )
2
Disadvantages
High temperatures(>600OC)
Complex processes
Toxic and corrosive gasses
Which materials are prepared
●
Chemical Vapor Deposition (CVD)
6. Plasma arc discharge
Electro Deposition/Electroplating
1.Principle
2.Expt Set up
3.Working
4.Advantages and disadvantages
5.Which materials are prepared
Electrodeposition
=
+
Electricity and Liquids Thinfilm
Substrate
(chemicals) Using
Solid materials Gas Precursors
Liquid solutions
1. Principle
Electrodeposition is the application of a metal coating to a
metallic or other conducting surface by an electrochemical
process
Nick Raymond
Disadvantages
Only
thinfilms
1.Principle
2.Expt Set up
3.Working
4.Advantages and disadvantages
5.Which materials are prepared
Gel
A gel is a semi-rigid mass that forms when the solvent from the sol begins to evaporate and
the particles or ions left behind begin to join together in a continuous network
Sol-gel
Sol-gel
Principle: Sol-Gel synthesis of nanomaterials
(particles, 4lms, 4bers and wires) are mainly depend on the
hydrolysis and condensation of metal alkoxides and
metal chlorides.
No special set up
1.Glass beakers
2.Precursor solutions
3.Heating arrangement
4.Spin coater,Dip coater,Spray
coater
Working
Step 1-2: Take the required solution precursors and
allow them to undergo condensation reaction, which
results in the formation of Sol.
Step 3: Take the prepared sol solution and deposit in
the form of thinfilm by spin coating, dip coating and
spray coating.
Video 1 2 3
Spin coat (Thin film) Dip coat (Thin film) Spray (Thin film)
Step 4: Take sol and draw the fibers
Step 1
Step 2
Step 3
Step 4
Step 5: Convert sol into gel
Dehydration
Slow dry
Rapid dry
Xerogel
Aerogel
Sinter/calcination
Dense
ceramic
Unifrom particles
Advantages
Simple process and low cost
Can coat onto large area or complex shape objects
Multicomponent systems
Disadvantages
1. Not a clean process
2. Not compatiable with latest device fabrication technology
Which materials are prepared
Module -III
Growth Techniques in Nanomaterial
Lecture 25
6. Plasma arc discharge
Above structures are
prepared by top down
process only
6. Plasma arc discharge
Photography
Lithography
Principle: It is a printed method that uses
chemical processes to create at image
using light/electron beams/ion beams and
photo resistive material.
Positive Negative
Photo lithography
Principle: It is a printed method that uses
chemical processes to create at image
using light (UV light) and photo resistive
material
PMMA
Working Video 1
Light
Working steps
Big No
Why
Small feature requires
Diffraction
Diffraction limits the resolution = 50 nm
In photolithography
If you want resolution <50 nm
E-beam lithography
E-beam lithography
Principle: It is a printed method that uses
chemical processes to create at image
using electron beam and photo resistive
material
Working
Working steps