with an additional highly charged component of massive particulates and/or dust grains.

A significant amount of dust particles was also frequently encountered

in industrial reactors for semiconductor manufacturing, in processing discharges for etching, sputtering, and ion implantation, etc. [8–14], and in the chambers
of fusion devices [15]. Powder formation has also been a critical concern for the microelectronics industry because dust contamination can severely reduce the
yield and performance of fabricated devices. Submicron particles deposited on the surface of process wafers can obscure device regions, cause voids and
dislocations, and reduce the adhesion of thin films[16,17]. These dust particles, which may have sizes ranging from tens of nanometers to hundreds of microns,
are typically billions of times more massive than protons, and can have between one thousand and several hundred thousand elementary charges. Therefore,
the presence of dust grains can significantly alter the properties and behavior of plasma in which they are immersed [18,19].
Powder formation in plasma requires sufficient precursor concentration and sufficient energy input in localized space in plasma reactors. These conditions
result in high radicals concentration promoting volume reaction in plasma. The detailed description of plasma formation is described in [20] and references
cited there.
Nowadays, dusty plasmas have grown into a vast field and new applications of plasma-processed dust particles are emerging. The industrial demand for
particles with special properties and for particle-seeded composite materials has been increased. Low-pressure plasmas offer a unique possibility of
confinement, control and fine tailoring of particle properties. The increased interest in the field of plasma–particle interaction in respect to dusty plasmas is due
to applied research related to material science and surface processing technology [19,21–24]. Powders produced using plasma technology have very interesting
and potentially useful properties, for example, very small sizes (nanometer to micrometer range), uniform size distribution, and chemical activity. Size,
structure, and composition can be tailored to specific requirements, dependent on the desired application [22,24,26,27].
Nanopowders or nanoparticles (NPs) have a great interest in the field of applied research related to material science and surface processing technology. It is
known that nanopowders are referred to as ultra-fine solid particles having a diameter between about 1 and 100 nm (10−9 m to 10−7 m). Nanopowders are
replacing conventional powders in many applications because of their unique properties, such as higher surface area and easier formability, and because of
improved performance of end products. Some current applications of nanopowders are catalysts, fillers, lubricants, abrasives, explosives, magnetically sensitive
materials, decorative materials, taggants, and reflective materials. However, before use, powders need adequate surface treatment in order to acquire new
surface properties required in the different applications.