PCB Manufacturing

Different layers of PCB(Single and two layer)

Multilayer PCB
Single and two sided
Substrate
Components in PCB
 substrate
• Woven glass fiber
• dipping or spraying
• glass fiber then passes through rollers which
roll the material to the desired thick-ness for
the finished substrate
• the material is cut into large panels.
 Drilling
• The stacked panels are placed in a CNC
machine, and the holes are drilled according
to the pattern determined when the boards
were laid out
• holes are deburred to remove any excess
material clinging to the edges of the holes
 printed circuit pattern
• additive" process :
• copper is plated, or added, onto the surface of
the substrate in the desired pattern, leaving
the rest of the surface unplated
 printed circuit pattern
• subtractive process :
• the entire surface of the substrate is first
plated, and then the areas that are not part of
the desired pattern are etched away, or
subtracted
 additive" process
• The panels pass through a vacuum chamber
where a layer of positive photoresist material is
pressed.
• A positive photoresist material is a polymer that
has the property of becoming more soluble
when exposed to ultraviolet light.
• The printed circuit pattern mask is laid on top of
the photoresist and the panels are exposed to
an intense ultraviolet light.
 additive" process
• The mask is removed, and the surface of the
panels is sprayed with an alkaline developer
that dissolves the irradiated photoresist in the
areas of the printed circuit pattern, leaving the
copper foil exposed on the surface of the
substrate.
• The panels are then electroplated with copper.
The foil on the surface of the substrate acts as
the cathode.
 Attaching the contact fingers

• The contact fingers are attached to the edge

of the substrate to connect with the printed
circuit.
• The contact fingers are masked off from the
rest of the board and then plated.
 Sealing, stenciling, cutting the panels

• Each panel is sealed with epoxy to protect the

circuits from being damaged while
components are being attached.
• Instructions and other markings are stenciled
onto the boards.
• The panels are then cut into individual boards
and the edges are smoothed.
 Mounting the components

• Individual boards pass through several

machines which place the electronic
components in their proper location in the
circuit.
• SMT: boards first pass through an automatic
solder paster, which places a dab of solder
paste at each component contact point.
 Mounting the components

• The components are then soldered to the

circuits.
• SMT: soldering is done by passing the boards
through another reflow process, which causes
the solder paste to melt and make the
connection.
 Packaging

• Unless the printed circuit boards are going to

be used immediately, they are individually
packaged in protective plastic bags for storage
or shipping.
 Quality Control

• Visual and electrical inspections are made

throughout the manufacturing process to
detect flaws:
• 1. components are sometimes misplaced on
the board or shifted before final soldering
• 2. application of too much solder paste, which
can cause excess solder to flow, or bridge,
across two adjacent printed circuit paths
 Quality Control

• Completed boards are also tested for

functional performance to ensure their output
is within the desired limits.
• environmental tests to determine their
performance under extremes of heat,
humidity, vibration, and impact.