The more awaited revolution

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 plectronics without silicon is unbelievable, but it
will come true with evolution of diamond or
carbon chip.
 Silicon disadvantages:-
>bulk in size
>slow operating speed
 Germanium disadvantages:-
>large reverse current.
>Less stability towards temperature.
 By using carbon as manufacturing material, we
can achieve smaller, faster and stronger chips
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Yhat is Diamond chip?
 Diamond chip is nothing
but carbon chip. Carbon
chip is an electronic chip
manufactured on a
diamond structural carbon
wafer.
 The major component
using Carbon is
µCARBON NANOTUBpµ
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 Carbon nanotubes were
discovered in 1991.
 It is a nano - size cylinder
of carbon atoms.
 They are made of one or several
concentric walls in which carbon atoms
are arranged in hexagonal pattern,
measuring several tens of microns in
length and less than a few nanometers
in diameter.

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1. Single walled nanotube(SYNT)
2. Multi walled nanotube(MYNT)
3. Torus
4. Nanobud
5. Cup stacked carbon nanotubes.


 Diameter close to I nm.
Tube length million of times
longer.
Application of SYNT
p-FpT exposed to oxygen
n-FpT otherwise.
Hence a NOT logic gate is
created.


 It has multiple rolled
layers.
Two proposed models:-
1. Russian model-
>Concentric.
2. Parchment model-
>Rolled in around itself
**Special feature-
Chemical resistance.
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A nanotorus is a carbon nanotube bent into a
torus i.e. doughnut shape.

Nanotori have unique properties:-

>Magnetic moments 1000 times larger than
previously expected for certain specific radii.
>High thermal stability.
Properties are dependent on radius of the torus

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Fullerene balls covalently bonded to
underlying nanotubes.

PROPpRTIpS:-
Good field emitters.
Fullerene molecules act as anchors,
enhancing mechanical properties by
avoiding slipping.

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 Among the carbon technologies being pursued for
electronics, 
 is the most promising for
integration with silicon semiconductor processes.
 It is one atom thick planar sheet of sp2 bonded
carbon atoms densely packed in a honeycomb
crystal lattice.
 A team has used graphene to build a chip known
as a frequency multiplier. Frequency multipliers
take an incoming electrical signal of a certain
frequency and produce an output signal that is a
multiple of that frequency.
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1. Strength
.strongest in terms of tensile strength
.stiffest in terms of elastic modulus
.Hollow structure, undergo buckling under
compression.
2.Hardness
Diamond is the hardest material known

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3. Kinetic
In MYNTs inner nanotube core may slide, almost
without friction, within its outer nanotube shell
thus creating an atomically perfect linear or
rotational bearing.
4. plectrical
unique properties dependent on structure
as told by its indices.

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J Doping
Very few found. Unlike silicon no
recrystallisation instead doping after
annealing turns the regions into
graphite amorphous carbon.
J Scaling
inability to grow single-crystal diamond
across wafers much bigger than an
inch and a half
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SMALLpR COMPONpNTS ARp POSSIBLp
 As the size of the carbon atom is small compared with that of silicon
atom, it is possible to etch very smaller lines through diamond structural
carbon. Ye can realize a transistor whose size is one in hundredth of
silicon transistor.
IT YORKS AT HIGHpR TpMPpRATURp
 Diamond is very strongly bonded material. It can withstand higher
temperatures compared with that of silicon. At very high temperature,
crystal structure of the silicon will collapse. But diamond chip can
function well in these elevated temperatures.
Diamond is very good conductor of heat.
 So if there is any heat dissipation inside the chip, heat will very quickly
transferred to the heat sink or other cooling mechanics.

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FASTpR THAN SILICON CHIP
 Carbon chip works faster than silicon chip. Mobility of the
electrons inside the doped diamond structural carbon is higher
than that of in he silicon structure. As the size of the silicon is
higher than that of carbon, the chance of collision of electrons
with larger silicon atoms increases. But the carbon atom size is
small, so the chance of collision decreases.
LARGpR POYpR HANDLING CAPACITY
 For power electronics application silicon is used, but it has
many disadvantages such as bulk in size, slow operating
speed, less efficiency, lower band gap etc at very high voltages
silicon structure will collapse. Diamond has a strongly bonded
crystal structure. So carbon chip can work under high power
environment.. Ye can connect high power circuit direct to the
diamond chip
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