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Jose(s7 A)[29] Rejo George Varghese(S7 A)[30] Nithin Alex John(S7 A)[26]
IC PACKAGING
o Semiconductor industry manufactures large variety of Integrated
circuits with different packaging requirements. o Package attributes taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions & cost.
ROLES OF IC PACKAGING
o Two Primary and Fundamental functions : 1) the IC package protects the die from physical damage 2) redistributes the I/O to a more manageable pitch in assembly o Number of potential secondary roles : 1) providing a structure more amenable to standardization 2) providing a thermal path away from the die 3) providing protection from the potential of soft errors due to alpha particles 4)providing a structure more easily disposed to electrical test and burn-in o The IC package has several roles to play as keeper of the chip
o package can also serve to interconnect multiple IC : 1)directly to each other using standard interconnection technologies, such as wire bonding 2) indirectly using interconnection pathways provided on the package, such as those used in hybrid packages and MCMs
CLASSIFICATION
o broadly separated and defined by their basic construction :
- packaging elements
typically are constructed on the face of the wafer, resulting in a true chipsize package.
o depending on next level of interconnection : 1) lead frame and the dual in-line package (DIP), are designed for either pin-in-hole solder assembly 2) pin-grid array (PGA), are designed for socketing 3) compliant-lead-type lead frame packages are designed for surface mounting Eg: quad flat pack (QFP), the leadless-type lead frame package, quad flat no-lead (QFN) package o QFP and QFN are representatives of peripherally leaded packages
o ADV : handle high I/O without sacrificing performance & natural area conservancy
E.g.: Ball grid array (BGA) made using organic laminate substrates
TYPES OF IC PACKAGING
11) Plastic Pin Grid Array :PPGA, is a square-shaped plastic package whose
pins or leads are arranged in a square array at the bottom of the package body.
12) Plastic Leaded Chip Carrier : PLCC is a four-sided plastic package that
has "J" leads around its periphery. These "J" leads occupy less board space than the gull-wing leads that other packages have.
14) Plastic Quad Flat Pack :is an IC package with leads extending
from all four sides of the package body. PQFP's are predominantly square in shape, although rectangular variants do exist.
16) Quad Flat No Leads Package :QFN, is a very small squareshaped or rectangular surface-mount plastic package with no leads. It is basically a quad flat package, except for the absence of leads protruding from its sides. Metal pads or lands around the periphery of the bottom of the QFN package serve as electrical connection points to the outside world. Because the QFN has no leads and has shorter bond wire lengths, it exhibits less inductance than leaded packages and therefore provides a higher electrical performance.
PCB DESIGN
PCB BOARD
Printed Circuit Boards are primarily an insulating material used as base, into which conductive strips are printed The base material is generally fiberglass, and the conductive connections are generally copper and are made through an etching process The main PCB board is called the motherboard, the smaller attachment PCB boards are called daughter boards or daughter cards
PCB board design defines the electrical pathways between components It is derived from a schematic representation of the circuit When it is derived, or imported from a schematic design, it translates the schematic symbols and libraries into physical components and connections
MANUFACTURING PROCESS
Step 1: Film Generation The film is generated from the design files (gerber files) which are sent to the manufacturing house. Step 2: Raw Material Industry standard 0.059 thick, copper clad panel is generated per layer
Step 3: Drill Holes Using NC machines and carbide drills to drill holes according to the drill specifications sent to the manufacturing house Step 4: Electroless Copper Apply thin copper deposit in hole barrels
Step 5: Apply Image Apply photosensitive dry film to panel and use a light source and the film to expose the panel
Step 6: Pattern Plate Electrochemical process to build copper in the holes and on the trace areas. Apply tin to surface
Step 7: Strip and Etch Remove the dryfilm, and then etch the exposed copper. The tin protects the copper circuitry from being etched away
Step 8: Solder Mask Apply a solder mask area to the entire board with the exception of solder pads
Step 9: Solder Coat Apply solder to pads by immersing into tank of solder. Hot air knives level the solder when removed from the tank Step 10: Nomenclature Apply white letter markings using screen printing process
PCB DESIGN LAYERS A PCB design package allows the designer to define and design on multiple layers Many of these are physical layers such as: Signal Layer Power plane Layer Mechanical Layer And some are special layers such as: Solder & Paste Mask Layers Silkscreen or Top Overlay Layers Drill guides Keep-out Layer And some CAD specific displayonly layers: Ratsnest layer DRC Errors
MANUFACTURING DETAILS
Internal layers should be designed at least 15 away from the edge of the PCB board. This is to ensure that the manufacturer of the board does not cut into the copper or short the planes. You can employ the keepout layer for this purpose. Each manufacturing house has their own manufacturing guidelines for minimum space width, copper-to-edge distance, via and hole sizes, annular ring, etc. Many assembly houses require that you provide your PCB boards in a panelized format.
COMPONENT PLACEMENT Component placement is an extremely important function of the designer Components should be placed according to their connections to other components, thermal considerations, mechanical requirements, as well as signal integrity and routability Components which have connections to each other should be placed in the same vicinity Components should also be placed on a grid, usually a 100 mil grid, in order to provide for a symmetric flow of routing where tracks and components are lined up
CABLES
AND CONNECTORS
CABLES
They are the link between the device and the power that makes the mechanism run . Most transmit signals between electrical equipments. The type of signals transmitted is based on what type of cable is being used. Different types of cables are: Twisted wire cables Coaxial cables Optical fibre
Coaxial cable
High-capacity used for video and communication networks Provides higher bandwidth than twisted pair cable Contains a single wire at the center, (stranded or solid) surrounded by a metallic shield that serves as a ground Thin and thick coaxial cables use baseband transmission. Thin coaxial cable has a maximum segment length of 185 meters Thick coaxial cable has a maximum segment length of 500 meters.
CONNECTORS
Cable connectors are audio and visual connectors used to carry audio and/or video signals. These signals are either digital or analog. Cables and connectors are necessary to unite outputs and inputs, and the quality of the signal varies with each connector.
BNC connector
British Naval Connector (or Bayonet Neil-Concelman) Commonly used to connect coaxial cable to NICs, hubs and other network devices Connector is crimped on the cable using a bayonet mount
SERIAL PORTS
Two types of connectors: DB-9 (9-pin) - Usually COM1 DB-25 (25-pin) - Usually COM2 Usually two serial ports are found on PCs: one DB-9 and one DB-25 (some only have 2 DB-9) Traditionally based on Recommended Standard-232 (RS-232) Standard cable limit is 50 feet
PS/2 connectors
A computer mini-socket and plug used to connect a keyboard and a mouse to a computer Consists of a 6-pin circular connector
PARALLEL PORTS
Computer sockets that connect printers or any other parallel device, such as removable disks and tapes backup devices, to a computers Built into the computer motherboard Some manufacturers sell network adapters that can be connected to a parallel port Now enhanced using IEEE 1284 standard, providing bi-directional transfers and increased speeds, and it defines a cable type that allows data transfers up to 32 feet on a parallel cable Uses a DB-25 connector on the computer end, and a Centronics 36-pin connector at the printer
SMALL COMPUTER SYSTEM INTERFACE Allows up to 15 devices to be daisychained using one SCSI controller The last device in a SCSI daisy-chain must have a SCSI terminator Three types of external SCSI connectors: 25-pin (SCSI-1) 4 Mbps, DB-25 (8-bit bus) 50-pin (SCSI-2) 4 Mbps, supports multiple chained devices, Centronics 50 (8-bit bus) 68-pin (SCSI-3) 40 Mbps, Ultra Wide SCSI, Centronics 68 (16-bit bus)
THANK YOU