Beruflich Dokumente
Kultur Dokumente
Prof. M G Korgaonker
Electronics Contract Industry In 1994, contract manufacturing market approx US $ 18 billion Contractors located in NA, Europe, East Asia, Japan. Over 1000 contract manufacturers 29 with annual revenues over US $ 100 milln each, account for 2/ 3 rds of the total
Electronics Contract Industry Seven market segments Computers Communications Automotive Consumer Industrial Instrumentation Military & avionics
Electronics Contract Industry Consumer segment relatively small for contractors Computer and communications largest and fastest growing segments Account for 3 / 4 ths of all the work
Electronics Contract Industry These segments important for large manufacturers, account for over 80 % of revenues Memory products prices rapidly decreased Rapid growth in units sold, capacity 9 ( megabytes ) and revenues
Electronics Contract Industry In 1999, compounded annual growth rate at 18 % for large players and 7.7 % for small and medium Large contract manufacturers becoming manufacturing arm of OEMs Tech advances lead to increased miniaturization, density, efficiency, throughput, decreased cost in high volume applications
Electronics Contract Industry Reduced product life cycles made contractors flexible and innovative
Contractors becoming increasingly full service providers advanced design, development, testing, repair, box build and delivery
Rationale For Contract Manufacturing Decision Allow OEM focus on own core competencies in designing and marketing new products Achieve higher level of quality and reduce variability Get a product faster
Rationale For Contract Manufacturing Decision Reduce costs 10 20 %, through scale economies Benefit from shared innovation Communication of manufacturing expectation on design, quality, cost and delivery
Some Problems Of Contract Manufacturing Poor responsiveness due to high capacity use and many customers Long lead times, lack of schedule flexibility and delays Remote management and reliance on single contractor
Memory Modules DRAMs mounted on PCBs in various configurations such as Single In Line Memory Modules ( SIMMs ) Double In Line Memory Modules ( DIMMs )
Celestica Formed by IBM. Manufactured , assembled and tested computer electronics such as Custom memory products, power supplies, PC cards, system boards Communication products and Integrated contract manufacturing services
Celestica In 1995, revenues of US $ 2.85 billion One of the largest in North America Selling to OEMs worldwide in computer, communications and related industries
Celestica Expertise in Design, miniaturization, development, prototyping Testing, failure analysis, QA, procurement Supplier management, mfg, warehousing and after sales service
Celestica Organized into 6 customer focused Bus 13 functional units ( Exb 1 ) Earned many prestigious awards
Memory Business Unit ( MBU ) Employed 300 people Operated 24 hrs / day, 7 days / week, produced 200,000 units / week 80 % revenues from higher margin contract services for OEMs and other tech customers
Memory Business Unit ( MBU ) Annual revenues US $1.6 billion in 1995 One of the industry leaders 20 % revenues from forecastable, made in batches to stock, branded line, lower margins products
Memory Business Unit ( MBU ) In the latter, company invested in design and engineering Manufactured in small to large batches to order Longer lead times Capability in Surface Mount Technology ( SMT )
Memory Business Unit ( MBU ) Memory upgrade market a potential opportunity for Celestica ( Exb 2 ) OEMs and after markets strongly inter related Drop in DRAM prices weakens OEM demand and explodes after market demand and vice versa
Memory Business Unit ( MBU ) Leading competitors exceed industry average growth rates by Focusing on selected markets Strengthen relationships with these markets Erect competitive barriers
Each sector had own staff and operated independently Products made in batches Required much material handling
MBU - one such FWF, resulting in dramatic improvements in efficiency and effectiveness
In SIMM products, throughput times dropped from 3 weeks to 2 days and WIP reduced accordingly
Production Creation of Celestica as separate entity in 1994 led to significant growth in revenues As sectors became bottlenecks, additional capital equipment added next to existing equipment and so on Bottlenecks shifted and the plant became de facto functional layout within each focused BU
Memory Board Production Six basic stages of production Mounting memory chips onto panels Labeling Separating into individual memory units or modules Inspecting visually and mechanically Electrical testing Packaging
Memory Board Production Panels baked in oven at 2100 celcius, 250 higher than the melting point of solder Panels moved from insertion area to labeling to apply identifying labels manually to individual memory units / modules Panels moved to depanelization to separate into units. A panel contained 7 20 units
Memory Board Production Individual units proceed to visual and mechanical inspection Simple errors corrected by hand More complex errors such involving many solder joints corrected by automated repair machine
Memory Board Production Next step is electrical testing of the product. Time required varies by a factor of 15 Scheduling this bottleneck operation is key to efficient utilization of resources Inspected product sent to packing for wrapping, boxing and casing for delivery to customer
Memory Board Production Some problems : Significant growth expected in DRAM capacity, but decrease in the number of units produced will be tight if demand goes up very much Need to reduce the throughput time from 2 -3 days to 1 day to cut WIP and give better service to customer
Opportunity To Reorganize Phase 1 task force 8 people from manufacturing and engineering and a student intern Task force focus on layout of the new facility and the logistics of moving The proposed layout still very much process layout ( exb 6 )
Some Assumptions In The Model Problems such as parts shortages, equipment failures, absenteeism, stop build orders ignored in simulation
Main goal of simulation to compare various scenarios, not study absolute numbers
Better to use cells, possibly with some sharing of testing capacity among cells ?
But cells require people to cross train and be flexible to do all jobs. Might face some resistance particularly when high status job people are asked to do low status tasks Multi skilling everyone could cost US $ 100,000. Will enrich jobs. Better described as multi tasking
Cellular Layout Multi tasking needs some extra equipment since each cell is a customer focused factory Currently 4 sets of SMT equipment, 3 separation lines, 8 visual and mechanical checking stations, 8 electrical testing stations, 6 packing stations
Cellular Layout Cells imply autonomy staff in the cell take responsibility for quality and productivity Some Implications to supervisors and managers. For ex, once a cell takes an order, it is up to the cell to get it filled No room for shutting down or slowing down
1
2 3 4 5 6 7
Investment, $ milln
WIP, $ milln Throughput Time, days Annual capacity, $ milln Inventory Cost / yr, $ milln Contribution / yr, $ milln Total Benefit/ yr, $ milln
6.4
12.6 2.2 15.6 1.26 4.68 3.42
6.4
12.2 2.2 16.1 1.22 4.83 3.61
9.9
20.1 2.4 25.9 2.01 7.77 5.76
10.2
13.5 1.2 28.8 1.35 8.64 7.29
22.46
21.27
20.63
16.79
Thank You