Slide 3

Creep Failure
Creep may be defined as
"Time-dependent permanent
deformation of a material
under constant loading at
high temperatures". Or
CREEP IS THE SLOW PLASTIC
DEFORMATION OF METALS UNDER
CONSTANT STRESSES OR UNDER
PROLONGED LOADING USUALLY
AT HIGH TEMPERATURE
Slide 3
Creep strength oI a material is the highest stress that
the material can withstand Ior a speciIied length oI time
without exceeding the speciIied deIormation at a
particular temperature.
Creep-rupture strength oI a material is the highest
stress that the material can withstand Ior a speciIied
length oI time without rupture at particular
temperature.
Slide 3
Example
End oI service liIe oI high
temp. components in a boiler
like superheater and reheater
tubes and headers is usually
Iailure by creep.
However, some material like
Pb, Sn, having low melting
point show creep at room
temperature.
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CREEP TEST
Slide 3
Procedure
The main objective in a creep
test is to measure how a given metal or
an alloy will perIorm under constant
load, at elevated temperatures.
Specimens Ior creep tests are usually the same as
Ior conventional test.
Strain indicator is attached to measure the
elongation.
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The specimen is subjected to constant loading or a
constant stress through a system oI dead weights
and levers etc.
A tubular, electrically heated Iurnace is made to Iit
around the specimen. Elongated ends oI the
specimen may have a thermocouple in each ends
Ior temperature measurement.
Stress, strain, temperature and time are noted
down and graph is plotted.
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A typical creep behavior is presented
in the diagram:
Slide 3
STAGES OF CREEP
Slide 3
Classical creep curve
Z- Time-dependenf deformofion: creep
foiIure (7)
ferfiory creep
d1/df
primory creep
d1/df
ndrode Iow
fime
s
f
r
o
i
n
secondory creep
d1/df~consfonf
f
f
(:)
s
f
r
e
s
s
fime
:
fime
d
1
/
d
f
ineIosfic
eIosfic, reversibIe
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Andrade's analysis of the competing processes
Which determine the creep curve
Slide 3
ANDRADE EQUATION
Andrade Iound that the creep curve could be
represented by the Iollowing empirical
equation
e e
0
(1t
1/3
)e
(kt)

Where e strain, t time,

and k constants
e
0
Instantaneous strain
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Creep
%ime
Stress
Strain
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Primary creep
The primary creep has decreasing creep rate because oI
work hardening process resulting Irom deIormation.
The primary creep is essentially similar in its
mechanism to delayed elasticity or the elastic aIter
eIIect and as is recoverable by unloading the specimen.
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Secondary creep
In Secondary creep, the strain increases linearly with
time. From design point oI view, this region is the most
important one Ior parts designed Ior long service liIe
because it comprises the longest creep duration. The
main creep test result is the slope oI this region which
is known as the steady-state creep rate ('cs). During this
stage oI creep, there is a balance between strain
hardening due to deIormation and soItening due to
recovery processes similar to those occurring during
the annealing oI metals at elevated temperature.
Slide 3
Slide 3
Tertiary creep
II the stress is suIIiciently high and temperature is also
high, there is a tertiary stage in which the creep rate
accelerates until Iracture occurs. It is more probably the
result oI structural changes occurring in the metal.
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Mechanisms oI Creep
Slide 3
Mechanisms oI Creep
High rates oI diIIusion permit reshaping oI crystals
to relieve stress
DiIIusion signiIicant at both grain boundaries and in
the bulk
High energy and weak bonds allow dislocations to
'climb around structures that pin them at lower
temperature
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Dependency of CREEP
Slide 3
Stress Rupture Curve
(Applied stress vs. time to rupture)
Slide 3
Dependency of CREEP
Slide 3
MECHANISM OF CREEP
DISLOCATION GLIDE
Dislocation is created in the metal during the process
oI plastic deIormation. Mechanism oI the creep is
related to the glide oI dislocation leading to slip. When
the stress is applied to he given specimen at the given
temperature those dislocation which are impeded by a
smallest barriers will be able to surmount them by the
process oI thermal activation in a short time but the
more diIIicult barrier will be overcome by the
dislocation in much longer time.
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DISLOCATION CLIMB
Slide 3
DISLOCATION CLIMB
At high temperature (as is viscous creep) atomic
moment permit the dislocation to climb, jog or even
be annihilated. Sessile dislocation is blocking the
motion oI other in its slip plane and the result oI the
dislocation will be pile-up. the climb oI the leading
slip dislocation over the sessile dislocation has permit
all slip dislocation to advanced and deIormation by
slip to continue.
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DIFFUSION OF VACANCIES
Slide 3
DIFFUSION OF VACANCIES
In this mechanism, grain boundary act as a Iree source
and sink oI vacancies. The mechanism depends in the
migration Irom one side oI the grain to another. Fig
shows WXYZ is under a stress P, the atom are
transIerred Irom Iaces XY and WZ. To the Iace WX
and ZY, along the path shows, and the grain creeps in
the direction oI the stress. To transport atom in this
way it involves creating vacancies on the Iaces WX and
ZY and destroying them on the other Iace.
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CREEP DUE TO GRAIN BOUNDRIES
Grain boundary sliding during creep has been inIerred
Irom the observation oI steps at the boundary. AIter
the small amount oI sliding at the boundary interIace,
movement will be arrested by protuberances. The
grains are then locked and the rate oI slip will be
determined by rate oI plastic Ilow in protuberances.
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CREEP FRACTURE
At low temp. grain boundaries are stronger and at
higher temp. it becomes weak as compared to
grains.the temp. at which the strength oI grain
boundary is equal to the strength oI grain is called
equicohesive strength.
Material always Iail at weak region by initiating crack.
When crack occurred below equicohesive temperature,
Iracture is transgranular or transcrystalline i.e the crack
moves through the grains.when crack occurred above
equicohesive temp.Iracture is intergranular or
intercrystalline and it move along grain the boundries.
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CREEP FRACTURE
Two type oI Iracture occurs
1.Transgranular Iracture or transcrystalline i.e the crack
moves through the grains
2. Intergranular Iracture. or intercrystalline i.e it move
along grain the boundaries
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%ransgranular fracture
1.Transgranular Iracture
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CREEP FRACTURE
Two type oI Iracture occurs
1.Transgranular Iracture or
transcrystalline i.e the crack
moves through the grains
2. Intergranular Iracture. or
intercrystalline i.e it move
along grain the boundaries
(as shown in Iig.)
ntergranular fracture
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Threshold Ior Creep
The Critical Temperature Ior Creep is 40 oI the
Melting Temperature.
II T ~ 0.40 T
M
Creep Is Likely
amlpe
Will Lead Creep at Room
%emperature?
%

327 HC 600 HK
%
ROO
23 HC 296 HK
Slide 3
Creep Example
Will Lead Products Creep at Room Temperature?
T
M
327 HC 600 HK
T
ROOM
23 HC 296 HK
100 x 296 / 600 49.3 Will Creep
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How Do We Deal With Creep
?
1. Reduce the eIIect oI grain boundaries
2. Use coarse grain structure because surIace to
volume ration is smaller as compare to Iine
grain.
3. Use Single Crystals
Slide 3
Stress Rupture in Single Crystals
CSX-4 & C 6 (yellow) are
Single Crystals
Advanced aterials & Processes
April 995
Slide 3
How Do We Deal With Creep ?
1. Reduce the eIIect oI grain
boundaries
Use Single Crystals
2. Change Materials
3. Change Operating Conditions
Slide 3
CREEP RESISTANT MATERIAL
It should have high melting point. This is because
the creep becomes signiIicant above 0.4 Tm. II the
melting point is higher, the material can be used at
higher service temperature without appreciable creep
deIormation.
It should have coarse grain structure. The grain
boundary becomes quasi-viscous at creep
temperature. Since in coarse grain structure, grain
boundary area is less, less amounts oI quasi-viscous
region is Iormed with a less tendency to Ilow,
reducing the creep deIormation.
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CREEP RESISTANT MATERIAL
It should be precipitation hardenable. It should have
Iine insoluble precipitates at the operating
temperature. The precipitates particle should not
coarsen at this temperature.
Dispersion hardening improves creep resistance. In
dispersion hardening, hard insoluble particles oI
second phase are uniIormly distributed in Iinely
divided Iorm in the metal matrix. These particles do
not allow moving the grain boundaries and hence
reduce the creep deIormation.
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CREEP RESISTANT MATERIAL
t should have high oidation
resistance ie the oide film should
follow either a logarithmic or a cubic
law of growth it improves creep
resistance
ilm thickness
time
Linear
parabolic
logarithmic
cubic law
Slide 3
DESIGN CONSIDERATION
Slide 3
DESIGN CONSIDERATION
Displacement-limited applications in which precise
dimensions or small clearances must be maintained
such as in turbine rotors in jet engines) (Figure 1a).
Rupture-limited applications in which precise
dimensions are not essential but Iracture must be
avoided such as in high-pressure steam tubes and
pipes (Figure 1b).
Stress-relaxation-limited applications in which an
initial tension relaxes with time such as in suspended
cables and tightened bolts (1c)