Service Manual UP 20 PDF

COLOR VIDEO PRINTER
UP-20
UP-21MD
SERVICE MANUAL
Volume 1 1st Edition (Revised 2)
! WARNING
This manual is intended for qualified service personnel only.
To reduce the risk of electric shock, fire or injury, do not perform any servicing other than that
contained in the operating instructions unless you are qualified to do so. Refer all servicing to
qualified service personnel.
! WARNUNG
Die Anleitung ist nur für qualifiziertes Fachpersonal bestimmt.
Alle Wartungsarbeiten dürfen nur von qualifiziertem Fachpersonal ausgeführt werden. Um die
Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei
Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben
Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung
dazu besitzen.
! AVERTISSEMENT
Ce manual est destiné uniquement aux personnes compétentes en charge de l’entretien. Afin
de réduire les risques de décharge électrique, d’incendie ou de blessure n’effectuer que les
réparations indiquées dans le mode d’emploi à moins d’être qualifié pour en effectuer d’autres.
Pour toute réparation faire appel à une personne compétente uniquement.
UP-20/21MD V1
Table of Contents
Manual Structure
Purpose of this manual .............................................................................................. 3

Related manuals ......................................................................................................... 3
1. Service Information
1-1. Board Location ............................................................................................ 1-1

1-2. Main Parts Location .................................................................................... 1-1
1-3. Removal and Installation of Cabinet ........................................................... 1-2
1-3-1. Top Cover ................................................................................... 1-2
1-3-2. Ribbon Panel Assembly ............................................................. 1-2
1-3-3. Front Panel Assembly ................................................................ 1-3
1-4. Replacement of Main Parts ......................................................................... 1-4
1-4-1. Mechanical Deck Assembly ....................................................... 1-4
1-4-2. DC Fan ....................................................................................... 1-6
1-4-3. Head Assembly .......................................................................... 1-6
1-4-4. DC Motor Assembly .................................................................. 1-7
1-4-5. Stepping Motor Assembly .......................................................... 1-8
1-4-6. Grip Belt ..................................................................................... 1-8
1-4-7. Tray Guide Assembly (2) ........................................................... 1-9
1-4-8. S2/RIBBON Sensor Board ....................................................... 1-10
1-4-9. S1 Sensor Board ....................................................................... 1-11
1-4-10. S8/S9 Sensor Board .................................................................. 1-11
1-4-11. Eject Roller Assembly .............................................................. 1-12
1-4-12. Photo Sensor ............................................................................. 1-12
1-4-13. Interlock Switch Assembly ...................................................... 1-13
1-4-14. Limit Rubber ............................................................................ 1-13
1-4-15. Grip Roller 2 Assembly ........................................................... 1-14
1-4-16. Platen Roller ............................................................................. 1-15
1-4-17. Pinch Roller .............................................................................. 1-15
1-4-18. Cam Gear/Cam R ..................................................................... 1-16
1-5. Unleaded Solder ........................................................................................ 1-18
2. Electrical Alignment and Mechanical Alignment
2-1. Electrical Adjustment .................................................................................. 2-1

2-1-1. Density Adjustment during Thermal Head Replacement .......... 2-1
2-1-2. Output of Test Pattern (Internal Signal) in Service Mode ......... 2-3
2-1-3. Electrical Adjustment (Analog Video Block) ............................ 2-4
2-2. Mechanical Adjustment .............................................................................. 2-8
2-2-1. Mechanical Adjustment Mode ................................................... 2-8
2-2-2. Entering the Mechanical Adjustment Mode .............................. 2-8
2-2-3. Normal Operation Check and Automatic Adjustment ............... 2-9
UP-20/21MD V1 1
3. Sensor Arrangement and Functional Description
4. Circuit Operation Description
4-1. Digital Video Signal Processing Block ....................................................... 4-1

4-1-1. Outline ........................................................................................ 4-1
4-1-2. Flow of Image Signal in Each Operating Mode ......................... 4-2
4-1-3. Basic Operation Timing and CPU Block ................................... 4-6
4-1-4. Memory (DRAM) Block .......................................................... 4-10
4-1-5. Memory Control Block ............................................................ 4-11
4-1-6. Color Adjustment Block .......................................................... 4-13
4-1-7. Sampling Clock Generation Block ........................................... 4-14
4-1-8. Masking Block ......................................................................... 4-14
4-1-9. A/D and D/A Conversion Blocks ............................................. 4-14
4-2. Analog Video Signal Processing Block .................................................... 4-15
4-2-1. Outline ...................................................................................... 4-15
4-2-2. Interface Block (IF-851 Board) ................................................ 4-15
4-2-3. Analog Video Signal Processing Block
(Part of VPR-74 Board) ........................................................... 4-16
4-3. Operation Description of Print Control Block Circuit .............................. 4-23
4-3-1. CPU Flowchart ......................................................................... 4-23
4-3-2. CPU (IC302) Memory Map ..................................................... 4-23
4-3-3. Outline of Motor Drive Function Blocks ................................. 4-24
4-3-4. Outline of Sensor Detection Circuits ....................................... 4-26
4-3-5. Head Control Block .................................................................. 4-31
4-4. Circuit Operation Description of System Control Block .......................... 4-33
4-4-1. Special Mode and Special Operating Method .......................... 4-33
4-4-2. Address Map ............................................................................ 4-33
4-4-3. Circuit Operation ...................................................................... 4-34
4-4-4. Communication with Internal CPU in Unit ............................. 4-35
4-4-5. Analog Video Block (VA) Control on the VPR-74 Board ...... 4-36
4-4-6. RS Communication Control ..................................................... 4-38
4-4-7. Media Protection such for Software ......................................... 4-38
5. Troubleshooting
5-1. Video (Image) Related Trouble .................................................................. 5-1

5-2. Mechanical Troubleshooting ....................................................................... 5-3
Mechanical Trouble NG Code List
2 UP-20/21MD V1
Manual Structure
Purpose of this manual

This manual is the Service Manual Vol.1 of the Color Video Printer UP-20/UP-
21MD.
This manual contains the service information, electrical alignment and mechanical
alignment, sensor arrangement and functional description, circuit operation
description and troubleshooting.
Related manuals
In addition to this Service Manual Vol.1, the following manual is provided.
. Service Manual Vol.2

Part No.: 9-955-307-XX (for J, UC, CE)
Contains the semiconductor pin assignment, spare parts, block diagrams,
schematic diagrams and board layouts.
. Instruction Manual
Part No.: 3-206-154-XX
This manual describes the information required for the actual management and
operation of this unit.
. “Semiconductor Pin Assignments” CD-ROM (Available on request)

This “Semiconductor Pin Assignments” CD-ROM allows you to search for
semiconductors used in B&P Company equipment.
Semiconductors that cannot be searched for on this CD-ROM are listed in the
service manual for the corresponding unit. The service manual contains a com-
plete list of all semiconductors and their ID Nos., and thus should be used together
with the CD-ROM.
Part number: 9-968-546-XX
UP-20/21MD V1 3
Section 1
Service Information
The illustrations of this section use UP-21MD. For spare 1-2. Main Parts Location
parts of each model, refer to “ Section 7 Spare Parts”. The
following describes the differences of board name between Switching regulator
models. DC motor
DC fan
Board name Model names
KEY-49 UP-21MD Stepping motor

KEY-51 UP-20
MEC-15 UP-21MD
MEC-20 UP-20
SE-642 UP-21MD
SE-683 UP-20
* Any other boards describes in above are in common use between models.
1-1. Board Location

Mechanical deck assembly
SW-1081 board
IF-851 board
VPR-74 board
IF-852 board
MEC-15/MEC-20 board
KEY-49/
KEY-51 board
SY-299 board
SE-642/SE-683 board
S2/RIBBON sensor board
S11 sensor board
S8/S9 sensor board
S1 sensor board
UP-20/21MD V1 1-1
1-3. Removal and Installation of Cabinet 1-3-2. Ribbon Panel Assembly
1-3-1. Top Cover 1. Remove the top cover. (Refer to Section 1-3-1.)
2. Pull out the paper tray assembly in the direction
1. Remove the five M3 case fixing screws and then indicated by arrow 1.
remove the top cover. 3. Release the door eject lever and pull out the ribbon
panel assembly in the direction indicated by arrow 2.
Top cover 4. Pull out the print media in the direction indicated by
arrow 3.
M3 case
fixing screw
Print media 3
M3 case
fixing screws
2
M3 case
fixing screws
Ribbon panel assembly
Door eject lever
1
Paper tray assembly
5. Remove the four screws and two thrust retainer bosses,

and then open the VPR-74 board in the direction
indicated by the arrow.
6. Disconnect the flexible flat cable from the connector
2. Re-attach the top cover in the reverse order of step 1. (CN203) on the SY-299 board.
VPR-74 board
BVTT 3x6
Thrust
retainer
bosses
Connector
(CN203)
SY-299 board
Flexible flat cable
1-2 UP-20/21MD V1
7. Remove the front panel. (Refer to Section 1-3-3.) 1-3-3. Front Panel Assembly
8. Remove the two screws (BVTT 3 x 6) and then
remove the door stoppers ((L) and (R)). 1. Remove the top cover. (Refer to Section 1-3-1.)
9. Insert pins into the two holes of sliders and remove the 2. Remove the paper tray assembly. (Refer to Section 1-
ribbon panel assembly. 3-2.)
10. Remove the two screws (BVTT 3 x 6) and four claws, 3. Remove the ribbon panel assembly. (Refer to Section
then remove the ribbon panel. 1-3-2.)
11. Disconnect one flexible flat cable and one harness 4. Remove the four screws and four claws and then
from the connectors (CN301 and CN302) on the KEY- remove the front panel assembly.
49 or KEY-51 board.
12. Remove the four screws (BVTT 3 x 6), then remove
the KEY-49 or KEY-51 board.
13. Remove the four screws (BVTT 3 x 6), then remove
the front plate assembly. BVTT 3x6
14. Remove one screw (PTT 2 x 10), then remove the
interlock plate and SE-642 or SE-683 board. Claw
Door stopper (L)

Front panel
BVTT assembly
3x6
Slider
Pin
Ribbon panel
assembly
Claw
Claw BVTT 3x6
Front panel assembly Claw

BVTT
3x6
Pin
Slider
Door
stopper (R) 5. Re-attach the front panel assembly in the reverse order
Connector
(CN301) Door front Flexible flat cable of steps 1 to 4.
plate assembly
KEY-49/ Connector BVTT
KEY-51 (CN302) 3x6
board Harness
BVTT BVTT
3x6 3x6
SE-642/
SE-683
A board
BVTT
3x6 PTT
2x10
Claws
Interlock
Claws plate
Ribbon panel
Door base
A assembly
15. Re-attach the ribbon panel assembly in the reverse

order of steps 1 to 14.
UP-20/21MD V1 1-3
1-4. Replacement of Main Parts 7. Remove the two screws and then remove the front stay
assembly.
1-4-1. Mechanical Deck Assembly 8. Remove the rod stopper from the switch on the SW-
1081 board.
1. Remove the top cover. (Refer to Section 1-3-1.) n
2. Remove the four screws and two thrust retainer basses, When attaching the rod stopper, refer to Fig. 1.
and then disconnect the four flexible flat cables and 9. Remove the power button and spring compression,
one harness from the connectors (CN102, CN301, then remove the power switch rod.
CN401, CN601, and CN901) on the VPR-74 board.
3. Remove the ribbon panel assembly. (Refer to Section
1-3-2.) Power switch rod Spring
4. Remove the front panel assembly. (Refer to Section 1- compression
3-3.)
5. Disconnect the four flexible flat cables from the
connectors (CN201, CN301, CN302, and CN401) on Crooves
the SY-299 board. Switch
6. Remove the four screws, then remove the SY-299 Rod stopper
board and mechanical partition plate.
Fig.1
Flexible flat cables
Harness
Flexible
VPR-74 board flat cables Power switch rod
BVTT BVTT
3x6 SW-1081
Thrust 3x6 board
retainer Connector
bosses (CN102)
Switch
Connector
(CN901) Flexible Spring compression
Connector flat cables
(CN401) Rod stopper
Connector BVTT
(CN601) 3x6
Connector
(CN301) BVTT
BVTT Front stay assembly
3x6 3x6
Connector
(CN401) SY-299
Connector board
(CN301) Power switch rod BVTT
Connector Mechanical 3x6
(CN302) partition plate
Connector
(CN201)
Power button
1-4 UP-20/21MD V1
10. Remove the two screws (B 4 x 20) and then remove 14. Disconnect the five harnesses from the connectors
the DC fan. (CN105, CN203, CN204, CN205, and CN206) and the
11. Disconnect the two harnesses from the connectors four flexible flat cables from the connectors (CN102,
(CN201 and CN207) on the MEC-15 or MEC-20 CN103, CN104, and CN106) on the MEC-15 or MEC-
board. 20 board.
12. Disconnect one harness connected to the thermal head 15. Remove the three screws and then remove the MEC-
from the switching regulator. 15 or MEC-20 board.
13. Remove the four screws (BVTT 3 x 6) and then
remove the mechanical deck assembly in the direction Flexible flat cable Harnesses Flexible
indicated by the arrow. Connector flat
(CN206) cables
Connector
Connector (CN204)
MEC-15/MEC-20 board (CN205)
Mechanical Connector BVTT
deck (CN102) 3x6
Connector Connector
(CN201) assembly
(CN207) Harnesses
Connector
(CN203)
Thermal
head Harness Harnesses
B Mechanical
B 4x20 deck assembly
BVTT
3x6
Connector
Connector Connector (CN104)
(CN106) (CN105)
DC fan
Connector
BVTT (CN103)
3x6 MEC-15/MEC-20 board
16. Attach mechanical deck assembly in the reverse order

A of steps 1 to 15.
B
Switching
regulator
BVTT
3x6
UP-20/21MD V1 1-5
1-4-2. DC Fan 1-4-3. Head Assembly
1. Remove the top cover. (Refer to Section 1-3-1.) 1. Remove the top cover. (Refer to Section 1-3-1.)
2. Remove the ribbon panel assembly. (Refer to Section 2. Remove the ribbon panel assembly. (Refer to Section
1-3-2.) 1-3-2.)
3. Remove the front panel assembly. (Refer to Section 1- 3. Remove the front panel assembly. (Refer to Section 1-
3-3.) 3-3.)
4. Remove the mechanical deck assembly. (Refer to 4. Remove the mechanical deck assembly and MEC-15
Section 1-4-1.) or MEC-20 board. (Refer to Section 1-4-1.)
5. Cut the band and remove the two harness. 5. Remove the DC fan. (Refer to Section 1-4-2.)
6. Remove the screw (PSW 2.5x6), then remove the 6. Remove the two screws (M 2.5 x 8), then remove the
head harness cover. head assembly.
7. Remove the two screws (M 3x14), then remove the 7. Disconnect one flexible flat cable and one harness
DC fan. from the head assembly.
Harness
M 3x14 To switching
DC fan regurator
Harness M 2.5x8
To SY-299
board
PSW 2.5x6 Head harness

cover Flexible flat
cable
Head assembly
To MEC-15/
MEC-20 board
To switching
regulator
Harness Band
8. Attach the DC fan in the reverse order of steps 1 to 7. 8. Attach the head assembly in the reverse order of steps
1 to 7.
1-6 UP-20/21MD V1
n
When attaching the head assembly, push it in the direction Rear side Front side
Screw
indicated by the arrow, then attach the screw A first and
then the screw B. Screw
Head assembly
DC motor bracket
Screw
Screw A Screw B
DC motor bracket
M 2.6x4
DC motor assembly
Band
Front side
1-4-4. DC Motor Assembly M 3x4 DC gear bearing Planetary gear 1

assembly
1. Remove the top cover. (Refer to Section 1-3-1.)

MEC-15/MEC-20
2. Remove the ribbon panel assembly. (Refer to Section board
DC gear
1-3-2.) bearing CN205
3. Remove the front panel assembly. (Refer to Section 1- Wheel gear
Torque limitter
3-3.)
4. Remove the mechanical deck assembly. (Refer to Bands
Section 1-4-1.)
Harness
5. Remove the three screws (M 2.6 x 4), then remove the
DC motor bracket.
6. Remove the torque limitter, wheel gear, planetary gear
1 assembly, and three DC gear bearings.
7. Cut the three bands.
8. Remove the two screws (M 3 x 4), then remove the
DC motor assembly.
9. Remove one harness from the connector (CN205) on
the MEC-15 or MEC-20 board.
10. Attach the DC motor assembly in the reverse order of

steps 1 to 9.
n
When attaching the DC motor bracket, temporarily
secure it with the three screws, then turn the DC motor
bracket counterclockwise and fully tighten the screws.
UP-20/21MD V1 1-7
1-4-5. Stepping Motor Assembly 1-4-6. Grip Belt
1-3-2.) 1-3-2.)
3-3.) 3-3.)
4. Remove the mechanical deck assembly. (Refer to 4. Remove the mechanical deck assembly. (Refer to
Section 1-4-1.) Section 1-4-1.)
5. Disconnect the harness from the stepping motor 5. Remove the tray guide assembly (2). (Refer to Section
assembly. 1-4-7.)
6. Remove the two screws, then remove the stepping 6. Remove the stepping motor. (Refer to Section 1-4-5.)
motor assembly. 7. Remove the release lever spring.
8. Remove the three screws, then remove the stepping
Harness
Stepping motor motor bracket in the direction indicated by the arrow.
assembly 9. Remove the grip belt.
M 3x6
M 2.6x4
Grip belt
Release lever
spring
M 2.6x4
Stepping motor
bracket
7. Attach the stepping motor assembly in the reverse

n
When attaching the stepping motor assembly, set the
assembly in the direction indicated by the arrow, then
tighten the two screws. 10. Attach the grip belt in the reverse order of steps 1 to 9.
1-8 UP-20/21MD V1
1-4-7. Tray Guide Assembly (2) M 2x6
Sensor guide Two poli-washers 2

n assembly (2)
For the replacement of the S11 sensor board, please buy
tray guide assembly (2) because S11 sensor board is not Flexible flat M 2.6x4
cable
prepared for spare parts.
Electrode
1. Remove the top cover. (Refer to Section 1-3-1.) side
Claws Electrostatic
2. Remove the ribbon panel assembly. (Refer to Section plate spring
1-3-2.) Connector Claws
S11
3. Remove the front panel assembly. (Refer to Section 1- sensor
board
3-3.)
4. Remove the mechanical deck assembly. (Refer to
Section 1-4-1.)
5. Remove the four screws (M 2.6 x 4), then remove the
front beam. Tray guide
assembly (2)
6. Remove one screw (M 2.6 x 4), then remove the M 2.6x4
electrostatic plate spring.
7. Remove the two screws (M 2 x 6), two poli-wahers 2
and four claws, then remove the sensor guide assembly M 2.6x4
(2).
8. Remove the two screws (M 2.6 x 4), then remove the
tray guide assembly (2).
9. Remove the one flexible flat cable from the connector
on the S11 sensor board. Front beam
M 2.6x4
10. Attach the tray guide assembly (2) in the reverse order
of steps 1 to 9.
UP-20/21MD V1 1-9
1-4-8. S2/RIBBON Sensor Board n
When routing the flexible flat cable, be sure to route it
n under the paper eject guide 3.
The three claws securing the S2/RIBBON sensor board are
easily broken, therefore be careful not to break the hooks Paper eject guide 3
when removing and attaching the board. S2/RIBBON
sensor board

1-3-2.)
3. Remove the front panel assembly. (Refer to Section 1-3-3.)
Section 1-4-1.)
5. Remove the tray guide assembly (2). (Refer to Section
1-4-7.) Flexible flat Sensor guide
cable assembly
6. Remove the four claws, then remove the sensor guide
assembly (2).
7. Remove the electrostatic plate in the direction
8. Pull out the two claws of the connector on the S2/
RIBBON sensor board, then disconnect one flexible
flat cable.
9. Remove the three claws, then the S2/RIBBON sensor
board.
Electrostatic plate
Sensor guide
assembly (2)
Claws
Flexible S2/RIBBON
flat cable sensor board
Claw CN1 Claw
Claws
Electrode
side
Tray guide assembly (2)
Claws
10. Attach the S2/RIBBON sensor board in the reverse

1-10 UP-20/21MD V1
1-4-9. S1 Sensor Board 1-4-10. S8/S9 Sensor Board
n 1. Remove the top cover. (Refer to Section 1-3-1.)

The claw securing the S1 sensor board is easily broken, 2. Remove the ribbon panel assembly. (Refer to Section
therefore be careful not to break the hooks when removing 1-3-2.)
and attaching the board. 3. Remove the front panel assembly. (Refer to Section 1-
3-3.)
1. Remove the top cover. (Refer to Section 1-3-1.) 4. Remove the mechanical deck assembly. (Refer to
2. Remove the ribbon panel assembly. (Refer to Section Section 1-4-1.)
1-3-2.) 5. Remove one screw, disconnect one flexible flat cable,
3. Remove the front panel assembly. (Refer to Section 1- and remove the S8/S9 sensor board.
3-3.)
Flexible flat cable
Section 1-4-1.)
1-4-7.)
6. Remove the two claws, then remove the pick roller
assembly.
7. Remove one claw, disconnect one flexible flat cable, M 2.6x4
and remove the S1 sensor board.
Tray guide assembly (2) Claws
Groove
S8/S9 sensor board
6. Attach the S8/S9 sensor board in the reverse order of

steps 1 to 5.
Spring
Flexible flat
cable
S1 sensor board
Pick roller assembly
8. Attach the S1 sensor board in the reverse order of steps

1 to 7.
n
When attaching the pick roller assembly, be sure to
securely attach the spring of the tray guide assembly
(2) to the groove.
UP-20/21MD V1 1-11
1-4-11. Eject Roller Assembly 1-4-12. Photo Sensor
1-3-2.) 1-3-2.)
3-3.) 3-3.)
4. Remove the mechanical deck assembly. (Refer to 4. Remove the mechanical deck assembly (Refer to
5. Remove the tray guide assembly (2). (Refer to Section 5. Disconnect one harness from the connector (CN105)
1-4-7.) on the MEC-15 or MEC-20 board.
6. Remove the sensor guide assembly (2). (Refer to 6. Remove the four claws from the mechanical deck
Section 1-4-8.) chassis, then remove the photo sensor.
7. Remove the two claws, then remove the eject roller
assembly. Photo sensor Claws
Sensor guide assembly (2)
Claws
Claw
Eject roller
assembly
Claw
Tray guide assembly (2)
TO MEC-15/
MEC-20 board Mechanical deck chassis
CN105
8. Attach the eject roller assembly in the reverse order of
steps 1 to 7.
Photo sensor
7. Attach the photo sensor in the reverse order of steps 1

to 6.
1-12 UP-20/21MD V1
1-4-13. Interlock Switch Assembly 1-4-14. Limit Rubber
1-3-2.) 1-3-2.)
3-3.) 3-3.)
4. Remove the mechanical deck assembly (Refer to 4. Remove the mechanical deck assembly. (Refer to
5. Disconnect one harness from the connector (CN203) 5. Remove the tray guide assembly (2). (Refer to Section
on the MEC-15 or MEC-20 board. 1-4-7.)
6. Remove one screw, then remove the interlock switch 6. Remove the limit rubber.
assembly.
Portion C
M 2.6x4
Front side
A B
Limit rubber
Limit rubber
cover
TO MEC-15/MEC-20 board
CN203
Interlock swtich
assembly
7. Attach the interlock switch assembly in the reverse 7. Attach the limit rubber in the reverse order of steps 1
order of steps 1 to 6. to 6.
n m
When attaching the interlock switch assembly, make . When attaching the limit rubber, be careful of its
sure that the assembly is properly oriented. orientation, and attach A first and then B.
. After attaching the limit rubber, clean the portion C
with alcohol.
UP-20/21MD V1 1-13
1-4-15. Grip Roller 2 Assembly
Grip roller 2 assembly Pinch roller
1-3-2.)
3. Remove the front panel assembly. (Refer to Section 1-
3-3.)
Section 1-4-1.)
1-4-7.)
6. Remove the stepping motor bracket. (Refer to Section Protection paper
1-4-6.)
7. Remove one retaining ring, then remove the grip gear Grip roller 2 assembly
2 and grip roller bearing.
8. Remove discharge (midway) gear and one poli- Collar (right)
washer.
9. Remove the two pinch springs.
Hole
10. Insert the protection paper in between the pinch roller
Chassis
and grip roller 2 assembly, then slowly pull out the
grip roller 2 assembly in the direction indicated by the
arrow.
11. Remove the collar (right) from the grip roller 2
assembly.
Pinch springs
Poli-washer E3
Discharge
(midway) gear
Grip gear 2
Grip roller bearing
12. Attach the grip roller 2 assembly in the reverse order

of steps 1 to 11.
n
When attaching the grip roller 2 assembly, be careful
not to damage it at the hole of chassis.
1-14 UP-20/21MD V1
1-4-16. Platen Roller 1-4-17. Pinch Roller
1-3-2.) 1-3-2.)
3-3.) 3-3.)
4. Remove the mechanical deck assembly. (Refer to 4. Remove the mechanical deck assembly. (Refer to
5. Remove the tray guide assembly (2). (Refer to Section 5. Remove the tray guide assembly (2). (Refer to Section
1-4-7.) 1-4-7.)
6. Remove the grip gear 2 and grip roller bearing. (Refer 6. Remove the two pinch springs.
to step 7 of Section 1-4-15.) 7. Remove one retaining ring, then remove the pinch
7. Remove the two pressure springs. roller in the direction indicated by the arrow.
8. Move the two pressure levers in the direction indicated 8. Remove the pinch roller and two bearings.
by the arrow A, then remove the platen roller and two
platen roller bearings in the direction indicated by the Bearing
arrow B.
Bearing
E3
Pinch roller
Bottom of chassis
Platen roller bearing Front side

Pressure
spring
Platen roller
Platen roller bearing

B Pressure
spring
Pinch springs
Pressure
lever
9. Attach the pinch roller in the reverse order of steps 1
to 8.
9. Attach the platen roller in the reverse order of steps 1

to 8.
UP-20/21MD V1 1-15
1-4-18. Cam Gear/Cam R 8. Remove the cam connecting shaft in the direction
Removal 9. Remove the cam mounting bracket and two cam
1. Remove the top cover. (Refer to Section 1-3-1.) connecting gear bearings.
2. Remove the ribbon panel assembly. (Refer to Section 10. Remove the two spring pins, then remove the cam
1-3-2.) gear.
3. Remove the front panel assembly. (Refer to Section 1- 11. Remove the two sheets of cam felt from the cam
3-3.) mounting bracket.
Cam connecting
Section 1-4-1.) gear bearing
5. Remove one flexible flat cable from the clamper. Cam mounting
bracket
6. Remove the two screws, then remove the beam (1). Spring pin
7. Remove one retaining ring, then remove the cam R.
Flexible flat cable
Clamper
Cam gear
M 2.6x4
Cam
Cam connecting connecting
Beam (1) Cam felts gear
shaft
Cam gear Spring pin bearing
M 2.6x4
Cam R
E3
1-16 UP-20/21MD V1
Installation 1. Rotate the cam L in the direction indicated by the
m arrow A, then raise the head assembly in the direction
. Before attaching the cam R, raise the head assembly by indicated by the arrow B.
rotating the cam L. 2. Align the cam follower shaft with the groove inside of
. When attaching the beam (1), temporarily secure it with the cam R, then attach the cam R with one retaining
the two screws and adjust the clearance between the ring.
positioning dowel and beam (1), then fully tighten the
two screws. (Refer to Fig.2.) Cam follower Cam R
. Apply grease to the cam connecting gear bearing and shaft
cam R. (Refer to Fig.1.)
Grease, SONY (SGL-801) 50G
Sony Parts No. : 7-651-000-11
Groove
Apply grease to the inside of Apply grease to the groove on
the cam connecting gear the backside of the cam R. Cam L
bearing. Wipe off excessive
grease if it is applied to A
adjacent areas. Cam R Head assembly
Cam connecting B
gear bearing
Grease Cam R
E3
Grease Groove
Cam follower
shaft
Fig.1
UP-20/21MD V1 1-17
3. Insert the shaft (ø3, 170mm or longer) from the hole of 1-5. Unleaded Solder
the cam R through the hole of the cam L to fix the cam
R and cam L. Boards requiring use of unleaded solder are printed with a
lead free mark (LF) indicating the solder contains no lead.
Positioning dowel (Caution: Some printed circuit boards may not come
Approx. 0.3 mm printed with the lead free mark due to their particular size.)
Beam (1)
: LEAD FREE MARK
Cam L Fig.2
Beam (1) m
Hole
. Be sure to use the unleaded solder for the printed circuit
Chassis
board printed with the lead free mark.
Hole
. The unleaded solder melts at a temperature about 40 d
higher than the ordinary solder, therefore, it is recom-
mended to use the soldering iron having a temperature
regulator.
Cam R
. The ordinary soldering iron can be used but the iron tip
has to be applied to the solder joint for a slightly longer
time. The printed pattern (copper foil) may peel away if
Cam R the heated tip is applied for too long, so be careful.
Shaft
Shaft
170mm or longer
ø3
Shaft
4. Attach the cam gear in the reverse order of steps 8 to

11 and 1 to 6 of “Removal”.
1-18 UP-20/21MD V1
Section 2
Electrical Alignment and Mechanical Alignment
2-1. Electrical Adjustment
n
The UP-20 does not install the LCD. Therefore, when performing this alignment using the UP-20, be sure
to connect a monitor to the UP-20.
2-1-1. Density Adjustment during Thermal Head Replacement
This mode is used when replacing the MEC-15/MEC-20 board, thermal head, power, and parts.
1. Density adjustment
The density must be adjusted during thermal head replacement.
(1) For the density adjustment, print test pattern STEP (V) in advance by the method below before
replacing the head and extract a reference sample.
(2) After replacing the head, print STEP (V) again and adjust the head voltage so that the density is
almost the same as that of the reference sample.
(3) When replace the MEC-15, MEC-20 boards and thermal head, adjust the printing position of head
direction. (Refer to Section. 2-1-1. item4)
(4) After head replacement and voltage adjustment, reset the number of estimated head print sheets.
2. Extraction of sample for density adjustment

(1) Set an ink ribbon and paper.
(2) Set the power switch to ON while pressing the ← and → keys simultaneously. The printer then
enters the service mode.
(3) Message “HIT ANY KEY” is displayed. Press any key.
(4) A menu is displayed.
PRINT TEST
PRESS [EXEC]
(5) Press the EXEC key to start printing.

At that time, the printer controls the thermal head temperature until it reaches a proper temperature.
. When the head temperature is low: The printer performs preheating and starts printing after the
head temperature reaches a proper temperature.
. When the head temperature is high: The printer performs cooling using a fan and starts printing
after the head temperature reaches a proper temperature.
n
If the head temperature is not proper, it may slightly take time to enter the print operation state after
you press the EXEC key.
UP-20/21MD V1 2-1
3. Head voltage adjustment
(4) Press the ↑ and ↓ keys to display “HEAD V:”.
(5) Press the ← and → keys to increase or decrease the head voltage parameter. Next, press the
EXEC key to define the setting.
m
. The head voltage does not change if you do not press the EXEC key.
. By decreasing the parameter, the head voltage decreases and the density also decreases. By
increasing the parameter, the head voltage increases and the density also increases. This parameter
does not directly represent the head applied voltage value.
. When “2. THERMAL & EEPROM CHECK 01” executes under the mechanical adjustment state,
clear the head voltage adjustment to default setting. Therefore, above adjustment must be
performed again.
4. Printing position adjustment of head direction

m
. Printing position adjustment performs when replacing IC102 on the MEC-15/MEC-20 board and
thermal head.
. The following adjustment must be performed if printout result is not center position on the sheet as to
head direction.
. When “2. THERMAL & EEPROM CHECK 01” executes under the mechanical adjustment state, clear
the printing position adjustment. Therefore, following adjustment must be performed again.
(4) Press the ↑ and ↓ keys to display SVC1/SVC2/SVC3.
Press the ← and → keys to move SERVICE MENU2.
(5) Press the ↑ and ↓ keys and message then “P H SHIFT” is displayed, adjust so that the printing
image becomes nearly center position on the print sheet by pressing the ← and → keys.
. When image size is S and increase the numeral value, move the image to left side on the LCD
display.
. When image size is S and decrease the numeral value, move the image to right side on the LCD
display.
5. Resetting the number of estimated head print sheets

(4) Press the ↑ and ↓ keys to display “HEAD PRN:”.
(5) Press the CLEAR key while pressing the EXEC key. The number of estimated print sheets is then
reset.
2-2 UP-20/21MD V1
2-1-2. Output of Test Pattern (Internal Signal) in Service Mode
(1) Set the power switch to ON while pressing the ← and → keys simultaneously. The printer then enters the service
mode.
(4) Press the ↑ and ↓ keys to display “PATTERN” when printing other patterns.
(5) Press the ← and → keys to display the required test pattern name.
(6) Press the PRINT key to start printing.
n
At that time, the printer does not control the thermal head temperature. The printer immediately enters the print
operation when you press the PRINT key.
m
. In the state where an error (e.g., no paper or no ribbon) exists, the printer operates with the error displayed. In this case,
press the MENU key, then press the ← and → keys to display a service menu. Next, perform each operation
described above.
. This test pattern cannot be output in the state where MULTI PIX is set to “2”. When MULTI PIX is other than “1”, a
white frame may be put into the print result of a test pattern. In this case, set MULTI PIX to “1”, then print.
There are several types of test patterns. Four standard patterns are as shown below.
1 STEP (H) 2 STEP (V)
3 RAMP (H) 4 RAMP (V)
UP-20/21MD V1 2-3
2-1-3. Electrical Adjustment (Analog Video Block)
This section describes regarding of the analog video signal adjustment.

The following adjustment must be performed when replace the VPR-74 board.
Preparation
1. Composite video signal
75% FULL FIELD color bars (WHITE REF 100IRE)
2. S video signal
75% FULL FIELD color bars
3. RGB signal (for UP-21MD)
WINDOW (WHITE 100IRE)
4. S video signal (for UP-20)
WINDOW (WHITE 100IRE)
Entering the adjustment mode

. Set the power switch to ON while pressing the ← and → keys simultaneously and start the printer in
the service mode.
. Display “SERVICE MENU3”.
SERVICE MENU3
/SVC2/SVC3/SVC4
IRE : 100/11/12/13
AGC : OFF/ON
VA ADJUST : OFF/ON
INPUT SEL : V/SV/RGB
PICTURE : 33
G-DRIVE : 28
B-DRIVE : 28
SUB-BRIGHT : 14
VBS Y : A1
Q01A 1 S
m
. In the case of UP-20, “INPUT SEL” is displayed as “VIDEO/SV”.
. The italic character varies depending on the adjustment value.
Entering the “VA ADJUST” mode

Move the cursor to the “VA ADJUST” position and set it to “ON” position. The printer then enters the
“VA ADJUST” mode. In this state, no signal is displayed on the monitor. Set it to “OFF” position to
cancel the mode.
Cautions during adjustment

. Before adjustment, return all user adjustment items (including “COLOR ADJUST”) to the center position.
. Adjustment is performed in the SOURCE output mode unless otherwise specified.
2-4 UP-20/21MD V1
1. INT 4Fsc adjustment (NTSC)
Conditions for adjustment Spec. Adjustment
1. SOURCE/MEMORY: MEMORY TP405 (G-6): 14 M 1CT401(F-7): 14.3

2. NTSC/PAL: NTSC
1,431,818 ± 80 Hz
2. INT 4Fsc adjustment (PAL)
1. SOURCE/MEMORY: MEMORY TP404(F-6): 17M 1CT403 (F-6): 17.7

2. NTCS/PAL: PAL
1,773,447.5 ± 80.0 Hz
3. INT 4Fsc adjustment (PAL)
1. SOURCE/MEMORY: MEMORY TP406 (F-7): VCO DC 1CT402 (F-7): 14.1

2. NTCS/PAL: PAL
2.0 ± 0.2 Vdc
4. Picture adjustment
1. VA ADJUST MODE Monitor [SERVICE MENU3]

2. INPUT SELECT: RGB [PICTURE:]
(UP-20: displayed as “S-VIDEO”)
3. AGC: OFF
4. NTSC/PAL: NTSC
Adjust so that the red (or yellow, magenta, or

white) in the diagonally striped portion is the
maximum.
UP-20/21MD V1 2-5
5. G-drive adjustment

2. INPUT SELECT: RGB [G-DRIVE:]
3. AGC: OFF
4. NTSC/PAL: NTSC
Adjust so that the yellow (or white) in the

diagonally striped portion is the maximum.
6. B-drive adjustment

2. INPUT SELECT: RGB [B-DRIVE:]
3. AGC: OFF
4. NTSC/PAL: NTSC
Adjust so that the white in the diagonally

striped portion is the maximum.
7. AGC REF adjustment

2. INPUT SELECT: RGB [SUB-BRIGHT:]
3. AGC: ON
4. NTSC/PAL: NTSC

2-6 UP-20/21MD V1
8. VBS Y adjustment

2. INPUT SELECT: VIDEO [VBS Y:]
SIGNAL: COLOR BAR
3. AGC: OFF
4. NTSC/PAL: NTSC

9. H position adjustment
1. INPUT SELECT: VIDEO TP402 (C-5): SWD HD 1RV201 (D-7): H POSI

2. INPUT SIGNAL: COLOR BAR TP410 (A-5): SYNC MONI
SWD HD
SYNC MONI
A = 100 ± 100 nS
UP-20/21MD V1 2-7
2-2. Mechanical Adjustment
2-2-1. Mechanical Adjustment Mode
In this mode, the adjustment of the sensors installed in a mechanical deck and the assembly of mechanical
parts are confirmed. The confirmation is carried out when replacing the mechanical deck parts.
m
. Various information items of a mechanical deck are stored in IC102 on the MEC-15/MEC-20 board.
Be sure to perform all mechanical adjustment after IC102, MEC-15 or MEC-20 board are replaced.
. The cleaning ribbon set (UPC-21CLN) supplied with this unit is required during adjustments of RBN
TYPE and RBN CD sensors.
2-2-2. Entering the Mechanical Adjustment Mode
1. Turn on the power while pressing the DISPLAY and EXEC keys simultaneously. (Continue
pressing them until MECHA JIG MODE appears on the LCD display.)
2. The “MECHA SETUP” menu in the mechanical adjustment mode appears on the screen (or LCD
display).
[MECHA SETUP menu]
[For OK] [For NG]
3. Press the ↑ and ↓ keys, move the cursor to the item to be adjusted or checked, and then press the
EXEC key.
2-8 UP-20/21MD V1
4. Adjustment and check are automatically performed by the mechanical deck. After the adjustment
and check are completed, the result appears on the screen (or LCD display).
5. When “OK” is displayed, adjustment and check are completed normally. When abnormality is
checked, an error code is displayed. (Take measures referring to the NG_CODE table (at the end of
this manual)).
6. To exit the mechanical adjustment mode, turn on the power again.
2-2-3. Normal Operation Check and Automatic Adjustment
1. SENSORS CHECK
Contents
. Is communication between boards possible?
. Operation check of each PAPER_JAM (S10), PAPER_EJECT (S11) and DOOR sensors.
. Does the sensor of the item to be checked operate normally? (Refer to NG_CODE2.)
. Are harnesses and mechanical parts connected properly?
Procedure
(1) Pull out the ribbon cartridge and paper tray, open the front panel.
(2) Move the cursor to the desired item and press the EXEC key.
Display
. OK: OK
. NG: NO ANSWER (If NO ANSWER is displayed, SCI communication with IC103 of the SY-299
board is impossible. Therefore, the subsequent adjustment and check cannot be carried out.)
NG command (E2) and NG data (**)(One-byte data is displayed using a hexadecimal code. The
hexadecimal code is converted into a binary code, and the bit whose “1” is set indicates the
location where NG occurs. Refer to NG_CODE2.)
2. THERMAL & EEPROM CHECK

Contents
. Does IC102 on the MEC-15/MEC-20 board operate normally? (The number of estimated sheets or the
sensor information is stored in IC102.)
. Do the thermistor of a thermal head, and the thermistor (THP201) on the MEC-15/MEC-20 board operate
normally?
Procedure
(1) Move the cursor to the desired item, press the ← and → keys to select the item, and then press the
EXEC key.
When the display number is 00: Check the thermistor and EEPROM operation. (The contents remain
unchanged.)
When the display number is 01: Check the thermistor and clear the contents of EEPROM (*).
* Contents to be cleared: Number of estimated sheets, number of estimated head sheets,
ShiftH, ShiftV, error history, head voltage parameter, and sensor
information
n
Be sure to adjust it by display number 01 when replacing the MEC-15/MEC-20 board or IC102 newly.
Display
. OK: 00: OK
01: OK OK
. NG: NG command (E3) and NG data (**)(One-byte data is displayed using a hexadecimal code. The
UP-20/21MD V1 2-9
[OK display in case of 00] [OK display in case of 01]
3. HEAD HOME CHECK

Contents
. Does the head position sensors (S8 and S9) operate normally?
. Does the DC motor operate?
Procedure
(1) Pull out the ribbon cartridge and paper tray.
Display
. OK: OK
value of the hexadecimal code is an NG item. Refer to NG_CODE1.)
4. PP IN SENS (S1) ADJUSTMENT

Contents
. Automatic light-emitting level and threshold level adjustments of PP IN (PAPER IN) sensor
Procedure
(1) Insert the paper tray with print papers.
Display
. OK: OK
2-10 UP-20/21MD V1
5. PP LD SENS (S2) ADJUSTMENT
Contents
. Automatic light-emitting level and threshold level adjustments of PP LD (PAPER LOAD) sensor
m
. For the mechanical deck labeled of initial serial numbers, print paper may be jammed during paper
delivery after adjustment. Therefore, the following adjustment must be performed using automatic
adjustments.
. PP IN and PP LD sensors adjustments can be performed automatically during PRINT ADJUSTMENT
and normal printing conditions. This may be adjusted automatically when normal printing at a first
during set the power switch to ON again and executing of PRINT ADJUSTMENT after 2. THERM &
EEPROM CHECK 01 is performed.
Procedure
(1) Insert the paper tray with print papers.
Display
. OK: OK
. NG: NG command (E4) and NG data (**) (One-byte data is displayed using a hexadecimal code. The
6. RBN TYPE CD (S5 to S7) ADJUSTMENT

Contents
. Automatic light-emitting level and threshold level adjustments of RBN TYPE0, 1, 2 (RIBBON TYPE)
sensors.
Procedure
(1) Insert a cleaning ribbon cartridge.
Display
. OK: OK
7. RBN CD (S3) ADJUSTMENT

Contents
. Automatic light-emitting level and threshold level adjustments of RBN CD sensor
. Does the ribbon motor operate?
Procedure
(1) Insert a cleaning ribbon cartridge.
Display
. OK: OK
UP-20/21MD V1 2-11
8. PRINT ADJUSTMENT
Contents
. Automatic light-emitting level and threshold level adjustments of PP IN and PP LD sensors
. Does irregular printing occur by the thermal head or gear?
. Is an error found in the path system of paper?
n
Automatic adjustments of PP IN and PP LD sensors are operated when normal printing condition at a first
during set the power switch to ON again and executing of PRINT ADJUSTMENT after 2.THERM &
EEPROM CHECK 01 is performed.
Procedure
(1) Insert a ribbon cartridge and paper tray.
Display
. OK: OK
. NG: NG command and NG data (H ‘**) (One-byte data is displayed using a hexadecimal code. The
value of the hexadecimal code is an NG item. Refer to NG_CODE4.)
9. SENSORS DATA
Contents
. The adjustment values (light-emitting level value, high-level value, low-level value, and threshold level
value) of automatically adjusted six sensors are displayed.
. Trouble historical information of mechanical deck (The error information that occurred during
mechanical operation is read. Up to the last eight information items are stored. The contents of
information correspond to the NG_CODE1 data. Press the CLEAR key to clear data. When clearing
is completed, OK is displayed.)
Procedure
Move the cursor to the desired item, press the ← and → keys to select the item, and then press the
EXEC key.
When display number is 00: Trouble historical information
For 01: PP IN (S1) sensor For 04: RBN TYPE0 (S5) sensor
For 02: PP LD (S2) sensor For 05: RBN TYPE1 (S6) sensor
For 03: RBN CD (S3) sensor For 06: RBN TYPE2 (S7) sensor
[Display example of trouble historical information] [Display after trouble historical information is cleared]
2-12 UP-20/21MD V1
[Display example of sensor data]
Viewing the display of sensor adjustment value

(Example) 84 f5 0f 80
One-byte data is displayed using a hexadecimal code. In each sensor, data is arranged in the
order of “light-emitting level value”, “high-level value”, “low-level value”, and “threshold
level value” from the beginning.
(For the data described above, the LED voltage value is 84, the high-level value of PHTR is
f5, the low-level value of PHTR is 0f, and the threshold level value is 80.)
Converting the displayed data into the voltage value of a sensor

The displayed data indicates the value obtained when the voltage level (0 to 5.0 V) of each sensor is
divided by 256. Therefore, the voltage value indicated using a hexadecimal code is obtained from the
calculation below.
(Example) When the hexadecimal code is H ‘b3:
H ‘b3 = D’ 179 (← The hexadecimal display is converted into a decimal display.)
5.0 (v) x 179/256 = 3.4 (v) (← Voltage value of sensor indicated by H ‘b3)
UP-20/21MD V1 2-13
Section 3
Sensor Arrangement and Functional Description
No. Name Type of sensor Function
1 Head position sensor (S8, S9) Photo Interrupter Detects the up/down position of the head
2 Jamming sensor (S10) Photo Interrupter Detects the paper end
3 Delivery flap sensor (S11) Photo Interrupter Detects the amount of delivery
4 Paper-in sensor (S1) Reflector Detects the paper exists or not into the paper feed tray
5 Paper feed sensor (S2) Reflector Defects the paper extremity
6 Ribbon type detection sensor (S5-S7) Reflector Detects the type of the ribbon
7 Ribbon cueing sensor (S3) Reflector Detects the cue of the ribbon
8 Front panel opening detection Mechanical Detects the opening/closing of the front panel
9 Interlock sensor Mechanical Detects the installing of the bottom cover on the unit
m
. Front panel opening detection sensor at No.8 is mounted on the SE-642/SE-683 board.
Regarding to arrangement of the SE-642/SE-683 board, refer to “1-1. Board Location”.
. For more details of each sensor, refer to “4-3-4. Outline of Sensor Detection Circuits”.
UP-20/21MD V1 3-1
Section 4
Circuit Operation Description
4-1. Digital Video Signal Processing Block
4-1-1. Outline
The main functions of the digital signal processing block on the VPR-74 board are as follows:
1. Converts a video input signal from analog to digital and stores it in memory (DRAM). (Capture)
2. Color-adjusts the image data stored in memory using a color adjustment circuit, and then converts the
data from digital to analog and outputs it to the analog signal processing block on the VPR-74 board
as a monitor output signal. (Monitor output)
3. Color-adjusts the image data stored in memory using a color adjustment circuit and then outputs it to
the head control block through a masking block as print data. (Print data output)
4. Converts a video input signal from analog to digital, converts the signal from digital to analog as it is,
and outputs it to the analog signal processing block as a monitor output signal. (Source output)
The digital signal processing block on the VPR-74 board consists of the following blocks.
. CPU block
. Memory (DRAM) block
. Memory control (ASIC) block
. Sampling clock generation block
. Color adjustment block
. Masking block
UP-20/21MD V1 4-1
4-1-2. Flow of Image Signal in Each Operating Mode
The operating mode on the flow of an image signal in a digital signal processing block can be classified
into the following four modes.
. Source mode
. Memory mode
. Capture mode
. Print data transfer mode
Source mode
In this mode, a video input signal is directly output to the monitor via a digital signal processing block.
The flow of an image signal is as described below.
The RGB analog signal input from an analog signal processing block is converted from analog to digital
as an eight-bit digital signal, respectively. This signal is passed through a DRAM control circuit
(IC1001) and adjusted in color using a color adjustment circuit (IC701). After that, the image size is
adjusted by the blanking produced using a CPU and DRAM control circuit. The resultant signal is
converted from digital to analog again as an analog signal and output to the analog signal processing
block.
4-2 UP-20/21MD V1
Memory mode
In this mode, the image data fetched into DRAM is output to the monitor.
The digital image data fetched into DRAM is read using a DRAM control circuit (CXD9111R: IC1001)
and converted from 32 bits to 8 bits. After that, the image data is adjusted in color using a color
adjustment circuit (IC701), and the image size is adjusted by the blanking produced using a DRAM
control circuit. The resultant data is converted from digital to analog and output to the analog signal
processing block.
UP-20/21MD V1 4-3
Capture mode
In this mode, a video input signal is converted from analog to digital and fetched into DRAM.
The video signal input from an analog signal processing block is converted from analog to digital as an
eight-bit digital signal. The converted video signal is converted from 8 bits to 32 bits in a DRAM control
circuit (CXD9111R: IC1001), and expanded in DRAM.
4-4 UP-20/21MD V1
Print data transfer mode
In this mode, the image data that exists in DRAM is output to the SY-299 board as print data during
printing.
The data request signal from the SY-299 board is input to CPU (IC501).
The CPU controls a DRAM control circuit (CXD9111R: IC1001), and the DRAM control circuit converts
the image data in DRAM into print data and outputs it. After that, the data is color-adjusted, color-
rotated, and converted from RGB to YMC using a color adjustment circuit (IC901). Next, the data is
masking-converted using two masking ROMs and output to the SY-299 board as print data.
UP-20/21MD V1 4-5
4-1-3. Basic Operation Timing and CPU Block
The operation of the digital signal processing block on the VPR-74 board is controlled and managed
according to the command from the SY board by CPU.
CPU operates with the VD signal (SWD_VD) switched into EXT or INT as reference and performs each
setting and control for a DRAM control circuit (CXD911R).
The main functions of a CPU block for digital signal processing are as follows:
. Reception and execution of command from SY board
. VF judgment (synchronous management) of video input signal
. Output of blanking signal
. Control of DRAM control circuit
. Write of color adjustment data
. Write of caption data
CPU memory map

The memory map of CPU is shown below.
000000
Program ROM
01FFFF
200000
DRAM controller.register
400000
Color adjustment circuit (Print)
600000
Color adjustment circuit (Monitor)
6007FF
FFEC00
CPU internal SRAM
FFFBFF
FFFE40
CPU internal register

FFFFFF
4-6 UP-20/21MD V1
Flowchart of CPU
START
Initialize
MAIN: SWD_VD
VF judgment and
IRQ0
setting of counter for CPU_VD creation
SWD_HD
VF judgment and
IRQ1
VBLANK generation
PRNT_DREQ
Setting of print data output

IRQ2
IMCAP
Execution of highest-speed image fetch function

IRQ4
SCI
Command storage and

RXI
command flag setting
Each DMA flag DRAM controller setting
VBLANK
Color adjustment VBLANK Write of color adjustment data
flag
VBLANK
Caption flag VBLANK Write of caption data
Command flag Command execution
UP-20/21MD V1 4-7
Time-sharing timing
(1) VBLNK DLYD_HD
(2) (3)
A B C
HBLNK
(1) VBLNK period

. DRAM access
. VF judgment
. Write of color adjustment data
(2) HBLNK period

. DRAM access
(3) Effective screen period

. DRAM access
. Input and output of capture or monitor output image data
(A) DRAM refresh
(B) DRAM access of capture or monitor output image data
(C) Output of print data, and write or read of caption data
Command communication with SY board

The command communication with the SY board is performed by the bi-directional asynchronous serial
communication in which the serial communication port of CPU is used.
Asynchronous serial communication
. Start bit: 1
. Data bit: 8
. Stop bit: 1
. Parity bit: None
. Baud rate: 19200 bps
4-8 UP-20/21MD V1
Synchronous control
The external sync signals (EXT_VD and AFC_HD) and internal sync signals (OVD and OHD (IC406
CXD1217QN)) produced in an analog signal processing block are switched using an SRC/nMEM signal
from CPU (IC501) and sent to the CPU and DRAM control circuit as a V sync signal (SWD_VD) and H
sync signal (SWD_HD). The AFC_HD signal is AFC-processed in the analog signal processing block. If
the AFC processing should be interrupted, the operation of a digital signal processing block is not
guaranteed. The CPU to which the SWD_HD and SWD_VD sync signals were input compares each
phase for VF judgment (frame judgment). This VF judgment performs processing so that the context is
not lost even if a jitter slightly exists in the sync signals. Therefore, odd and even fields are not misplaced
for capturing. The SWD_VD sync signal is also AFC-processed by the software in CPU. Even if noise is
mixed in the SWD_VD sync signal, therefore, the noise component is canceled. A virtual VD signal is
generated by CPU even if the SWD-VD signal is interrupted and even if the period is changed
(CPU_VD). The CPU_VD signal is input to the DRAM control circuit.
Output of blanking signal

The V blanking signal that determines the position of the effective screen in the vertical direction counts
the falling of an SWD_HD signal after an SWD_VD signal is input to CPU, and it is output as a
CPUVBLNKV signal. For the H blanking signal that determines the position of the effective screen in
the horizontal direction, a BLNK signal is output as the blanking signal for input image data capture and
memory image data monitor output operations by the setting value set to the control register of a DRAM
control circuit and the input of a CPUVBLNKV signal.
Control of DRAM control circuit

. Capture operation
. Monitor output operation
. Print data output
. DRAM refresh operation
. Random access operation
To perform the operations described above, each mode is set to the register of a DRAM control circuit.
The DRAM control circuit triggers VD and HD signals for operation.
Each setting is not restricted by video timing. The setting value is latched using a VD signal and
validated after the VD signal.
UP-20/21MD V1 4-9
Write of color adjustment data
The data for a conversion table is written in CXD8869Q (color adjustment circuit) during V blanking.
Write of caption data

Caption data is set to a DRAM control circuit so as to output an access trigger (RATRG). The DRAM
control circuit expands the data on DRAM.
4-1-4. Memory (DRAM) Block
The memory of a four-frame uses 64M-bit SDRAM x 1.
The memory space is constituted by 600 (RAS) x 256 (CAS) x 32 bits for each color of one frame image
memory. However, the memory space is apparently considered as 600 (RAS) x 1024 (CAS) x 8 bits
during use by storing eight-bit image data proportionally to four-dot pixels (four-dot pixels in one
address) in the direction of depth. The conversion of eight bits to 32 bits and vice versa is performed
using a DRAM control circuit.
Memory Configuration (Four-Frame)
4-10 UP-20/21MD V1
4-1-5. Memory Control Block
A four-dot pixel is stored in one address for high-speed processing using SDRAM of 32 bits in the
direction of depth so as to double the apparent SDRAM access speed. This processing is performed using
a standard cell circuit. The circuit is controlled by CPU.
Conversion of 8 bits to 32 bits and vice versa in case of input image data capture (FULL)
The eight-bit image data input to this circuit is stored in each line buffer in the order below.
The main operation and setting of a DRAM control circuit are as follows:
. Various capture operations
FULL image
SPLIT 2 image
SPLIT 4 image
Capture shift size
Write DRAM address
By setting the items above, the DRAM control circuit automatically performs the capture operation in
synchronization with VD and HD signals.
. Print data output operation
Number of output data items
Read DRAM address
The print data output operation is performed by setting the items above and by triggering from CPU.
UP-20/21MD V1 4-11
. Various monitor output operations
FULL image
SPLIT 2 image (Decimated in the horizontal and vertical directions.)
4IN1 image (Equal to a SPLIT 2 image as IC operation.)
Monitor output shift size
Read DRAM address
By setting the items above, the DRAM control circuit automatically performs the monitor output
operation in synchronization with VD and HD signals.
. Random access operation
Write DRAM address
Write data
The random access operation is performed by setting the items above and by triggering from CPU during
V blanking period.
. DRAM refresh operation
Number of refresh access addresses
By setting the item above, the DRAM control circuit automatically performs the DRAM refresh
operation. (RAS only refresh)
4-12 UP-20/21MD V1
4-1-6. Color Adjustment Block
On the video side, the color of image data is adjusted using an SRAM conversion table in IC701
(CXD8869Q). On the print side, it is adjusted using a conversion table in IC901 (CXD8869Q). The table
data is provided in the program ROM of CPU. On the video side, the table data is rewritten during V
blanking period. On the print side, it is rewritten immediately before printing.
On the print side, the color rotation and RGB-YMC conversion of print data are also performed as well as
color adjustment. The flow of data shown below is obtained according to the print color. CPU controls
the print setting of each color by receiving the color information command.
UP-20/21MD V1 4-13
4-1-7. Sampling Clock Generation Block
This block generates a sampling clock, locks the phase to the “high” level of external and internal sync
signals, and distributes the clock to the DRAM control circuit or color adjustment circuit.
The clock frequency is 18.425196 MHz for NTSC and PAL in common.
The operation timing is shown below.
XT1A (IC603)
SWD_HD
HDB (IC603)
CKO1A (IC603)
O_HDO
O_HDOD
AD_CLK
TAP1 (IC607)
DLYD_HD
4-1-8. Masking Block
The masking block corrects the difference between the ideal reproduction color and the three primary
colors (Y, M, and C) of printed materials using a two-ROM data conversion system of main masking
ROM and sub-masking ROM.
The MAIN, SUB1, SUB2 and print color information signals output from a color adjustment circuit (on
the print side) are input to the main and sub-masking ROMs. The data that was masking-corrected using
a two-ROM conversion table is latched by IC905 and IC906 and output to the SY-299 board as eight-bit
print data.
4-1-9. A/D and D/A Conversion Blocks
The A/D conversion block consists of three A/D converters (CXD1176Q IC350 to IC352). The analog
RGB signal input from an analog signal processing block is clamped using a clamp pulse (nCLAMP
signal) and adjusted in gain using a CLP_REF signal that is input to the VREF pin of an A/D converter.
In the D/A conversion block, an eight-bit digital RGB signal is converted into an analog video signal
using an encoder (BH7243KV IC407) incorporating a three-channel D/A converter.
4-14 UP-20/21MD V1
4-2. Analog Video Signal Processing Block
4-2-1. Outline
The analog video signal processing block mainly consists of the following two blocks.
1. Interface block (IF-851 board)
The interface block mounts a relay for THROUGH/EE selection.
All video signals are input and output from and to the external equipment via this block.
2. Analog video signal processing block (Part of VPR-74 board)
A part of the VPR-74 board consists of an analog video signal processing block.
Moreover, this block can be mainly classified into a video decoder block (that fetches the input video
signal into memory) and video encoder block (that monitors the digital video signal from memory).
I2CBUS is almost used for the setting and adjustment of an analog video block. The analog video
block is controlled by the SY-299 board.
The main functions of the analog video signal processing block are as follows:
. Selection of input signals (composite video, S video, and RGB signals)
. Conversion of composite video and S video signals into RGB signal (Decoding of video signal)
. AGC (Automatic Gain Control) for input signal
. User adjustments (HUE, COLOR, GAIN, OFFSET, MONITOR-RGB, etc.)
. OSD (On Screen Display) function
. Selection of monitor output signal (SOURCE/MEMORY)
. Sync signal processing (NTSC/PAL detection, signal detection, sync separation, and AFC)
. Conversion of RGB digital signal into composite video and S video signals (Encoding of video signal)
4-2-2. Interface Block (IF-851 Board)
A monitor output signal is switched into THROUGH or EE using this block. By using a mechanical
relay, the monitor output of an input signal can be performed even if the power of this unit is off.
R122 R113
0 150 R129
V_IN RY107 0
8
10
R114
150
7
CN106
EMI CN107
5
IN OUT EMI
3
GND IN OUT V_OUT

6
D113 GND
RD9.1M-T1B FL107
12
NM FL114
1
NM D127
D114 RD9.1M-T1B
RD9.1M-T1B
D128
RD9.1M-T1B
UP-20/21MD V1 4-15
4-2-3. Analog Video Signal Processing Block (Part of VPR-74 Board)
1. Input signal processing block (Decoder block)

(1) SYNC ON GREEN discriminator circuit
This board mounts a discriminator circuit that separates a sync signal from a green channel when no
sync signal is input at the time of an RGB signal input.
IC102 discriminates the existence of a sync input signal and controls a video switch (IC103) that
switches green input and sync input signals.
R124 R130 C126

R112 3.3k 470k 22uF
10k 6.3V
C121
Q102 0.47uF
2SC4116YG-TE85L
IC102 (1/3) 1 2 IC103
D101 MC74HC4538AFEL 6 NJM2233BM(TE2)
C174 1SS123-T1 C CR 6
22uF Q104 Q 1 +V 7
1
6.3V 2SC4116YG-TE85L 5 IN1 OUT

C105 3
22uF 4 7 IN2
R116 R119 Q 2 R135
6.3V
2
2.2k 2.2k RESET CTL 1k

GND
3
3
C122 8
R127 2.7k 0.001uF C129
R115 C106 R122 0.1uF
22k 330pF 47k
IC102 (2/3) R136
MC74HC4538AFEL 15 14 1k
C CR 10
Q
11
12 9
Q
RESET
13
L105
10uH
L106
10uH C124
22uF
6.3V
Fig. 1-1 SYNC ON GREEN Discriminator Circuit
4-16 UP-20/21MD V1
(2) Y/C separation block
A digital comb filter (IC109) is used to separate the luminance signal (Y) and chroma signal (C) of a
composite video signal.
The input composite video signal is passed through a band rejection filter (FL101), amplified by
about two times, and input to pin 15 of IC109. The separated luminance signal is output from pin 6
and passed through a band rejection filter. After that, the signal is input to the video switch (IC104)
that switches the luminance signal of an S video signal. In the same manner as described above, a
chroma signal is output from pin 8 and input through a band rejection filter to the same video switch.
L109
10uH
R137
10k L103 L108
C131 10uH 10uH
C132 0.022uF
10uF R134
16V 150k C135 C137
C114 0.1uF 100uF
22uF 6.3V R151
6.3V 1k
C118
0.1uF C119
0.1uF
24
23
22
21
20
19
18
17
16
15
14
13
C125
NC
TE1
TE0
CLC
VIN
RBT
RTP
MODE1
MODE0
CLOUT
GND_D1
CLK_AD
0.1uF R169
33
C130
C7 VCC_AD 47uF
25 12 6.3V
C6 GND_AD
26 11 R131
C5 IBIAS 10k
27 10 C120
C4 REF_DA 0.1uF
28 9
C3 COUT
29 8
C2 VCC_DA
R126 30 7
10k C1 YOUT
31 IC109 6 R129
C0 MC141627FT GND_DA 100
32 5
D7 FILIN
33 4 C115
D6 BIAS 10uF 16V R155
34 3 1k
D5 OVCC
35 2
PAL/NTSC
COMB/BPF
D4 PCO R132
Q106
BYPASS
GND_D2
36 1 47
VCC_D
DTC124EKA-T146
FSC
C127
N/M
R133
D3
D2
D1
D0
VH
47uF C128 R154

10k 33
6.3V 0.1uF
37
38
39
40
41
42
43
44
45
46
47
48
R128
33k
Fig. 1-2 Y/C Separation Block
(3) Composite sync signal separation circuit

A composite sync signal (CSYNC) is separated by IC203.
The composite sync signal of the Y signal input to pin 6 of IC203 is separated by IC203, and the Y
signal is output from pin 3. The output signal at pin 3 is positive-synchronous. Therefore, the output
signal is inverted by Q201 so that it is negative-synchronous.
DEC_Y DEC_C D_SYNC

A+5V-1 TP201 TP202 TP205
007-N4 DEC_Y
007-N4 DLYD_SYNC
007-N5 DEC_C
IC203 R211
R201 BA7046F-E27 330
1k C208
8 VCC 6 1uF
010-B3 *EXT_CSYNC R202 PHCOMP VIN
10k
Q201 3
22uF 6.3V
2SC4116YG-TE85L SYNCOUT
C219
2 1
HDOUT HOSC
R208
4 470k
R205 C209
VDOUT 100k 0.001uF
GND
0.1uF
C207
Fig. 1-3 Composite Sync Signal Separation Circuit
UP-20/21MD V1 4-17
(4) Decoder block
On this board, the Y/C jungle (CXA2076Q IC204) for a color television is used for decoding of a
video signal. This circuit is compatible with both NTSC and PAL systems. It integrates luminance
signal processing, chroma signal processing, RGB signal processing, and sync signal processing into
one chip. Each adjustment and setting are controlled by I2CBUS.
The input luminance and chroma signals are input to pins 55 and 57 of IC204. After each processing
has been performed, the input signal is output from pins 22, 24, and 26 as an RGB signal.
A VBS/S video signal is delayed by the processing in IC204. Therefore, the signal passed through a
delay line (DL101) of 350 ns is used for sync separation so as to make the timing of a video signal
coincide with that of a sync signal. (Input signal at pin 56)
The hue and color that the user adjusts are adjusted by IC204.
IC211 is a 1H CCD delay line for PAL.
A+9V-1
L203
10uH
C259 Q205
47uF 2SC4116YG-TE85L
16V
R219
2.2k
Q204 C251 R228
47uF C236 C246 C258
2SA1586YG-TE85L 16V 0.1uF 2.7k 0.1uF R230 0.1uF
1k
R221
100
100pF
C223
R218 R220 R229

1.8k 470 C252 1k
C250 2.2uF R231
1uF 50V 1k
50V
41 R225 470 X203 50KHz
A_GND
0.01uF
C238
0.0047uF
0.1uF
C244
330k
R222
C240
0.0047uF
0.47uF
R223
10k
C228
C226
C247
0.1uF
5.6k
R227
R216 C253
220 0.1uF
R217
220
51
50
49
48
47
46
45
44
43
42
40
39
38
37
36
35
34
33
SDA
SCL
VM
SYNCOUT
HSIN
VSIN
VSFIL
DVCC2
IREF
DGND
CERA
AFCFIL
L2FIL
AFCPIN/HOFF
HDOUT
DVCC1
SAWOSC
VAGCSH
E-WOUT
C232 10uF 16V

BLHOLD VD+OUT/VPROT
C216 0.1uF 52 32 C261
CVIN VD-OUT/VPROT 10uF
C220 0.47uF 53 31 16V
DCTRAN VTIM
C234 10uF 16V 54 30
YIN ABLFIL R232
C227 10uF 16V 55 29 C273 1k
EXTSYNCIN ABLIN/VCOMP 10uF R234
C221 0.47uF 56 28 16V 4.7k
CIN IKIN
C222 0.1uF 57 27
TEST IC204 BOUT R233 4.7k
C241 47uF 16V 58 CXA2076Q-TL 26 C254 0.1uF
SVCC1 BSH
C215 470pF 59 25
APCFIL GOUT
60 24 C255 0.1uF
X443 GSH
C213 R213 R250 61 23
0.47uF 15k 39 X358 ROUT
62 22 C256 0.1uF
NC RSH
C211 X201 63 21
15pF R214 FSCOUT SVCC2
4.43 4.433619MHz 470 64 20
-RY_OUT
-BY_OUT
SCMREF
-RY_IN
-BY_IN
SCPOUT
SGND1
SGND2
YOUT
YRET
R1IN
G1IN
B1IN
R2IN
G2IN
B2IN
C212 X202
YS1
YS2
15pF 3.579545MHz
YM
R235
4.7k
10
11
C237 0.01uF 12
13
14
15
16
17
18
19
R215
1
2
3
4
0.1uF 5
6
7
0.1uF 8
9
1.5k TP203
C233
C229
TP204
0.01uF
0.01uF
C274
C242
C239
3.58 C257 R236

0.1uF 47uF 4.7k
C230 16V
R226
100
DEC_YOUT 0.1uF
FSC
0.01uF
0.01uF
0.01uF
C245
C248
C249
R224 1M
R257 NM
C224 0
C225
0.001uF 0.001uF
IC211
9 1 TDA4665T/V5-118
16 VP1 VP2 11
VI_R-Y VO_R-Y
14 12
VI_B-Y VO_B-Y
C260
5 C272 0.1uF
SAND 10uF
2 16V
NC1
7 6
IC2 NC2
4 13
IC1 NC3
8 15
IC3 NC4
GND1 GND2
10 3
Fig. 1-4 Decoder Block
4-18 UP-20/21MD V1
(5) HD generation circuit
The HD signal output from pin 37 of IC204 is adjusted to the proper phase and pulse width by IC207
(monostable multivibrator) and sent to the frame memory block as an HD (horizontal sync) signal for
fetching memory. AFC (Automatic Frequency Control) processing is performed for this HD signal.
A+5V-1
R239 R244
3.9k IC207 (1/3) 6.8k
MC74HC4538AFEL
H POSI
3
C275
IC207 (2/3)
2
47uF RV201 MC74HC4538AFEL

6.3V 2.2k
1
1 2 15 14
C CR 6 C CR 10
Q Q
5 11
4 7 12 9
Q Q AFC_HD 010-B3
RESET RESET
C264 3 13 C269
0.001uF 0.001uF
R245
IC208 (1/3) 2.7k
R240
2.2k MC74HC4538AFEL
IC208 (2/3)
MC74HC4538AFEL
1 2 15 14
C265 C CR 6 C CR 10
0.0022uF Q Q
5 11
4 7 12 9
Q Q
RESET RESET
3 13 C270
0.0022uF
Fig. 1-5 HD Generation Circuit
(6) Demodulation axis correction circuit

Since, in a television circuit (IC204) for the consumer, the demodulation axis is not orthogonal for
NTSC, a matrix circuit (R241 to R249) is inserted into an RGB signal line so as to correct the
demodulation axis to an orthogonal axis. For PAL, the demodulation axis is orthogonal.
Demodulation is not related when an RGB signal is selected. In this case, therefore, the matrix circuit
must be turned off. The matrix circuit is switched to ON or OFF by IC206 and IC210.
R248
470
DEC_G 009-B3
IC206 C267
TC7S66FU(TE85R) 0.1uF
R241
470
5 R246
1 2 2.2k
GND
4 3
DEC_R 009-B3
IC210 DEC_B 009-B4
TC7S66FU(TE85R) R249
R247 470
5 C268
1 2 0.1uF 4.7k
GND
4 3 R242
10k
IC205
TC7W00FU(TE12R)
N/P 007-B9,009-B8,010-M5
8
1 VCC 7
1A 1Y
2
1B
5 3
2A 2Y
6 C266
2B 0.1uF
GND Q206
4
DTC124EKA-T146
INPUT_SEL1 009-B9,010-B5
Fig. 1-6 Demodulation Axis Correction Circuit
UP-20/21MD V1 4-19
(7) AGC (Automatic Gain Control) circuit
This unit mounts a peak AGC circuit that has actual results on the medical market.
The peak value of the RGB signal output from IC204 is sampled by Q301, Q302, and Q303. The
resultant signal is passed through a low-pass filter (R314 and C306) and then input to the operational
amplifier (IC302). The control level is properly adjusted by IC302. The input signal is then passed
through a switch (IC307) for manual gain adjustment (output signal at pin 3 of IC303) and input to the
control pin of GCA (Gain Control Amplifier) (IC304 to IC306).
R312 R351
1.8k 330 IC306
BA7655AF-E2
Q306 C313 8
1 2 4 XN2501-TX 47uF
6.3V 1 VCC 3
IN1 OUT1
FL303
3 5 2
R321 8 5 4 1 9 3 6
8 5 4 1 O3 O2 I2 CTL1
1k 2 7 C325
IN LPF OUT 0.1uF7
Q303 FG1 G1 G2 G3 G4 O1 I1 FG2 5
XN4601-TW 6 1 IN2 OUT2
19 18 16 15 10 13 12 20
5 2
R318 6
R309 560 CTL2
33 4 3 GND
4
C321 C329
R326 0.1uF 0.1uF
1k
IC302 R337
C307 R322
8.2k
LM358PW-E05 10k
10uF 8
16V
3 VCC 1
IN+1 OUT1 IC307
2 TC4W53FU(TE12R)
R313 IN-1
0 R314 5 7
2.2k IN+2 OUT2 8 5 Q307
6
IN-2 VDD A 6 DTC124EKA-T146
GND R328 1
C305 C306 R323 C316 7
2.7k 4 0.1uF 470
10uF 47uF R315 R327 INH VSS VEE
16V 22k D301 C326
6.3V 15k
UDZ-TE-17-4.7B 0.1uF 2 4 3 C301
0.1uF
R324
10k
Fig. 1-7 AGC Circuit
(8) EVR (electronic volume) adjustment circuit

Adjustment is partially performed using an electronic volume by IC303.
IC303 has a five-channel internal DA converter. The four channels of it are used for “VBS gain”,
“offset”, “AGC gain”, and “manual gain”, respectively. Adjustment is performed by I2CBUS.
(9) EEPROM
EEPROM (IC301) is mounted to store the setting and adjustment values of this board. This EEPROM
writes or reads data by I2CBUS.
4-20 UP-20/21MD V1
2. Output Signal Processing Block (Encoder Block)
(1) Video encoder block
On this board, BH7243KV (IC407) (made by ROHM) is used as the encoder of a video signal. This
circuit incorporates an eight-bit, three-channel DA converter and video encoder. By inputting a
subcarrier and composite sync signal, an eight-bit RGB digital signal can be converted into a
composite video signal by one chip. The output of RGB, S video, and composite video signals can be
driven in 75 ohms. Moreover, this circuit has an internal OSD (On Screen Display) selector switch.
Setting and adjustment are all performed by I2CBUS. An OSD character signal is sent from the SY-
299 board.
IC409
MM1031XML
2
R463
3.3k VCC C458
0.1uF
DACLK 3 1
SI SO
TP703 C457
0.1uF
GND
R464
1k 4
R418 33
C435
23 C419 0.1uF
100uF R466
R416 33 6.3V 2.7k IC410
R417 NJM2538BV(TE2)
31 %RDA4
30 %RDA5
29 %RDA6
28 %RDA7
33 C434
0.1uF
L402 R467
10uH
32
27
26
25
24
22
21
20
19
18
17
C411 390 15 16
C410 47uF C462
0.1uF
DVDD
VCLK
RDATA4
RDATA5
RDATA6
RDATA7
OSDCLK
SDA
SCL
VREG
AGND1
SCIN
CSYNCIN
SYNIN
NT/PAL
NC3
6.3V 0.1uF 1 V+1 V+2 9

YIN1 YOUT
C459 0.1uF 3 10
YIN2 YSAG
C460 0.1uF 2
C463 GCACTL1/MUTE
%RDA3 1uF 20 12
RDATA3 SYNCOUT CLAMP_REF VOUT
%RDA2 33 16 R465 1M 4 11
RDATA2 BFPOUT CLAMP VSAG
%RDA1 34 15
RDATA1 YTRAP C461
%RDA0 35 14 1uF 19 14
RDATA0 VOUT CIN1 COUT
%GDA7 36 13 R471 C464 0.1uF 17
GDATA7 TEST R470 680 CIN2/INSEL
%GDA6 37 12 1k 18
GDATA6 COUT R469 GCACTL2/PWRSAVE
%GDA5 38 11 1k
GDATA5 YOUT C466
39 10 0.1uF 7 13
%GDA4 R468
GDATA4 AVCC2 1k WIDE SDCOUT
%GDA3 40 9 L404 C467
GDATA3 AGND2 10uH C465 0.1uF
%GDA2 41 8 5 47uF
GDATA2 BOUT CHARA 6.3V
%GDA1 42 7 6
GDATA1 GOUT BLANK
%GDA0 43 6 GND
GDATA0 ROUT
%BDA7 44 5 8
BDATA7 NC2
%BDA6 45 4
BDATA6 NC1
%BDA5 46 3
BDATA5 OSDOFF
%BDA4 47 2
BDATA4 OSDSW
48 1
BDACOUT
GDACOUT
RDACOUT
BDATA3
BDATA2
BDATA1
BDATA0
DACOFF
AVCC1
DGND
OSDR
OSDG
OSDB
RIN
GIN
BIN
BDA7-0
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
IC407
BH7243KV
%BDA3
%BDA2
%BDA1
%BDA0
0.1uF
0.1uF
C421
C422
0.1uF
0.1uF
0.1uF
C426
C428
C432
0.1uF
C425
0.1uF
C429
BDA7-0 BDA7-0
BDA7-0
BDA7-0
47uF 6.3V
GND
C431
TP403
Fig. 1-8 Video Encoder Circuit
UP-20/21MD V1 4-21
(2) Sync generator block
A sync signal for the monitor output must be generated by this unit when a memory image is selected
for the monitor output or when no input signal exists. This circuit is peripheral circuit IC406.
IC406 is a sync signal generator compatible with NTSC and PAL systems. IC406 generates video
pulses (CSYNC, ODD/EVEN, HD, VD, and SC signals) by inputting a clock. These video pulses are
sent to IC407 and a frame memory block.
NTSC and PAL are switched by Q408. For NTSC, the X401 block is turned on, and a clock of
14.31818 MHz is sent. For PAL, the X402 and X403 blocks are turned on, and clocks of 14.1875
MHz and 17.734475 MHz are sent, respectively. For PAL, a subcarrier (SC signal) is synchronized
with a horizontal sync signal by VCXO (peripheral circuits Q407 and Q409).
Q405
DTA124EKA-T146 Q406
2SC4116YG-TE85L L403
C416 10uH Q409
C408 0.1uF Q407 R420 C430
0.1uF 2SC4116YG-TE85L 6.8k 0.1uF 2SC4116YG-TE85L
R413
6.8k IC405 VCO DC
X401
1
3
14.318182MHz TC4W53FU(TE12R) TP406
X404
C423 14.1875MHz R426
8 5 39pF 4.7k
C417 C433 R422
0.1uF
0.001uF 0.1uF CL408
2
4
C412 VDD A 6 100k

47pF
R427 220k
1
CT401 7
20pF INH VSS VEE
C437
C415 2 4 3
C409 0.001uF D401 C436
4pF HVC350BTRF 2.2uF R428
R415 R419 C424 R425 10k
1k 1k 39pF 10k 50V
L401
10uH R414 C413 R421 C427 CT402
14.3 10k 47pF 10k 33pF 20pF 14.1 CN402
C402 NM
100uF
6.3V C404 14.3M 1
0.1uF
GND 2
VCO DL 3
C418 0.1uF GND 4
17.7M 5
C420
47uF IC406
6.3V
28
CXD1217Q-T4
17 VDD 22
OSC HCOMOUT
Q410
8 DTA124EKA-T146
4FSCIN TP404 L405
17M 10uH
7 CL406
4FSCOUT
R443
R423 6.8k Q411
1.5k R424
TP405 4.7k C438
X403 2SC4116YG-TE85L
24 17.734475MHz
CLIN 14M 0.1uF
30 23 CL407 C454
OFLD1 CLOUT 0.001uF
3 C452
OFLD 47pF
5 Q412
OLALT C472 DTC124EKA-T146
31 19 17.7 7pF R444
OBF/COLB MODE1 Q408 10k C453
4 20 DTC124EKA-T146 CT403 47pF
OBLK MODE2 20pF
2 18
OSYNC EXT R445
10 13 1k
OVD LALTRI
6 21
OHD HRI
26 29
CL405 OFH VRI
15 14 N/P 007-B9,008-L5,009-B8
O2FH TEST
VSS
12
Fig. 1-9 Sync Generator Block
4-22 UP-20/21MD V1
4-3. Operation Description of Print Control Block Circuit
Outline
The print control block consists of the following blocks.
1. Mechanical control block (IC301 and peripheral on the SY-299 board)
2. Head control block (IC401, IC501 and peripheral on the SY-299 board)
3. Motor driver and sensor control block (MEC-15/MEC-20 board)
IC102 on the MEC-15/MEC-20 board is memorized any informations such as sensor information,
total number of the print count on the unit, total number of the print count on the head, record of error
message, Shift H, Shift V, remaining amount of ribbon and head voltage parameter.
4-3-1. CPU Flowchart
START
Initialize
MAIN:
Mechanical status flag Status processing
Command flag Command execution
4-3-2. CPU (IC302) Memory Map
The memory map of CPU is shown below.
000000
Built-in ROM (Program)
020000
IC502 (PQC IC)
040000
IC501 (γ RAM, Color offset)
060000
CN305 (for Debug)
080000
IC402 (Line number correction ROM)
0A0000
FFE080
Built-in RAM
FFEFFF
FFFE50
Internal I/O register
FFFFFF
UP-20/21MD V1 4-23
4-3-3. Outline of Motor Drive Function Blocks
The motor drive circuit of a mechanical control block consists of the following circuits.
. Fan motor drive circuit
. Stepping motor drive circuit
. DC motor drive circuit
1. Fan motor drive circuit

The fan motor is driven by turning on the transistor (Q201) on the MEC-15/MEC-20 board using the
control signal from pin 33 of IC302. The fan motor is rotated when the head temperature exceeds the
fixed value during printing and in the standby state.
+12V
CN204 HEAD_FAN
HED_FAN 1
GND 2
+5V C205 C206

0.1uF 10uF ROOM_FAN
16V CN207
ROOM_FAN 1
+5V NC 2
R210 GND 3
1k R238
47 4 5
R239 2SD999-T1CK
10k
Q201
To IC302 33pin +12GND
Q204
DTC124EKA-T146
GND
SY-299 MEC-15/MEC-20
2. Stepping motor drive circuit

The control signals of each phase (A, A, B, and B) are output at pins 93 to 96 of IC302 on the SY-299
board. Drive circuit IC204 on the MEC-15/MEC-20 board drives the stepping motor by chopper drive.
The excitation system of the stepping motor is based on one-/two- phase excitation. The reference
voltage input to pins 3 and 14 of IC204 on the MEC-15/MEC-20 board drops during a motor stops by
switching the control signal at pin 29 of IC302 on the MEC-15/MEC-20 board. Then, grip roller drives
through the belt from a stepping motor.
Besides, this circuit is designed that +32 V is not supplied by controlling of power supply control line
(pin 3 of CN201) except print and pre-heat conditions.
+5V
+32V
R212 R214 R215 R216
SLA7024M
4.7k 4.7k 4.7k 4.7k
IC204
To SY-299
IC302
PLT_MTR
93-96pin 7 12
VSA VSB CN206
6 8
INA OUTA B 1
5 1
INA OUTA A 2
+32V 3
17 18
+5V INB OUTB +32V 4
R230 C211 16 11
1 0.0022uF INB OUTB +5V /B 5
REF /A 6
R222 9
390 TP210 RSA
PWDWN
R224 R236 R237
Q203 +32GND 2.2k 3 47k 47k
TP207 R221 REFA
2SC1623-T1-L5L6 82
To SY-299 14
REFB C217
33uF
C218
33uF
2 50V 50V
IC302 R223
R225
2.2k 10
TDA
13
R218 82 R231 RSB TDB
29pin 1k 1 GNDA GNDB
C219
C215 C216 0.1uF
GND GND C212 4 15 470pF 470pF
0.0022uF
+32GND
MEC-15/MEC-20 GND +32GND
4-24 UP-20/21MD V1
3. DC motor drive circuit
Motor drive circuit IC203 on the MEC-15/MEC-20 board is controlled by the control signals at pins 55
and 56 of IC302 on the SY-299 board. DC motor drives the feed paper roller, head up/down and ribbon
rewinding respectively by each mechanism positions.
+12V
C221 C213
47uF 0.1uF
+5V 16V
C220
R211 47uF
R213 16V
10k 10k IC203
7 TA8428K
CN205
To SY-299 1 VCC 3
IC302 2
IN1 OUT1
5 + 1
55,56pin
IN2 OUT2
C214 - 2
0.022uF
6
NC
GND
4
+12GND
MEC-15/MEC-20
UP-20/21MD V1 4-25
4-3-4. Outline of Sensor Detection Circuits
A sensor of this unit is classified into the following three types.

The sensor of the reflective type perform the A/D conversion input according to the change with the
passage of time in a sensor level.
Photo interruptive type

. Head position sensor (S8, S9)
. Jamming sensor (S10) (Detects the paper end)
. Delivery flap sensor (S11)
Reflective type
. Paper-in sensor (S1)
. Paper feed sensor (S2) (Detects the paper extremity)
. Ribbon type detection sensor (S5-S7)
. Ribbon cueing detection sensor (S3)
Mechanical type
. Front panel opening detection sensor (SE-642/SE-683 board)
. Interlock sensor
1. Head position sensor (S8, S9)

Type: Photo Interruptive type
Function: Discriminates the thermal head position.
Level: Discriminates to sequentially shown as below.
Position HED_POS_SENSE0 HED_POS_SENS1

IC302 51P IC302 52P
Head up Standby state H H

Paper pip Paper feed position H L
Head half Ribbon cueing, Paper feed H L
Head down Y print H L
Head half Ribbon cueing, Paper retracting H L
Head down M print H L
Head half Ribbon cueing, Paper feed H L
Head down C print H L
2. Jamming sensor (Detects the paper end) (S10)

Function: Detects whether print paper is not jammed in the mechanical unit during standby.
Detects paper feed and paper during retracting.
Level: PAPER_JAM_SENS IC302 50P
H: Print paper exists.
L: Print paper does not exist.
4-26 UP-20/21MD V1
3. Delivery flap sensor (S11)
Function: Detects the paper stack of a delivery part.
Level: PAPER_EJ_SENS IC302 49P
H: Print paper stacks, “REMOVE PAPER” is displayed.
L: Print paper does not exist.
+5V
Q108
2SB798-T1-DLDK
R123
10k
R141
47
R142
10k
R124
1k
+5V
Q107
HPOS0 HPOS1 DTC124EKA-T146
TP309 TP308 R326 R325
39k 39k
GND
R307
47 CN301 9P CN101 12P
IC203 51P
IC203 52P
R308 CN301 10P CN101 11P
47
C312
220pF S8 S9
C313
220pF
GND
GND
+5V
JAM GND
TP304
R331
39k
R309
47 CN301 11P CN101 10P
IC203 30P
C314 S10
220pF
GND
+5V
EJ
TP305 GND
R333
39k
R310
47 CN301 12P CN101 9P
IC203 49P
C315 S11
220pF
GND
GND
Sensor circuits for S8 to S11
UP-20/21MD V1 4-27
4. Paper-in sensor (S1)
Type: Reflective (Paper reflective) type
Function: Detects whether print paper exist or not into the paper feed tray.
Level: PAPER_IN_SENS IC302 38P
H (analog level): Print paper exists.
L (analog level): Print paper does not exist.
+5V
PPIN
TP310
R314
82k
R301
47 CN301 2P CN101 19P CN103 2P
IC302 38P
C301
220pF
Q101
GND 2SC1623-T1-L5L6 +5V
IC103 (1/2)
5 LM358PSR
IC101 13P R107 PAPER IN
+ 7 47
6 -
TP104
CN102 3P
PAPER IN
S1
CN102 1P
GND
5. Paper feed sensor (Detects the paper extremity) (S2)

Type: Reflective (Paper reflective) type
Function: Detects the paper feed timing.
Detect whether print paper is not jammed at a paper feed port during standby.
Level: PAPER_LD_SENS IC302 39P
H (analog level): Print paper exists.
L (analog level): Print paper does not exist.
+5V
PPLD
TP311
R319
15k
R302
47 CN301 3P CN101 18P CN103 2P
IC302 39P
+5V
C303
220pF
CN103 6P
GND PAPER IN
S2
+5V
PAPER_LD
Q102
+5V 2SC1623-T1-L5L6 R113 TP105
10k
IC103 (2/2)
3 8 LM358PSR
IC101 13P R108
+ 1 47 CN103 3P
C106 2 -
0.1uF
4
R114 R131 R132

220 120 120
NM NM
GND
GND
CN103 1P
GND
4-28 UP-20/21MD V1
6. Ribbon type detection sensor (S5-S7)
Type: Reflective type
Function: Detects whether ribbon cassette is installed on the unit.
Discriminates the type of ribbon cassette.
Level: (analog level)
RBN_TYPE_SENS0 RBN_TYPE_SENS1 RBN_TYPE_SENS2

IC302 41P IC302 42P IC302 43P
UPC-21S H L H
UPC-21L L H L
Cleaning L L L
+5V
RB0
TP314
R321
39k
R304
47 CN103 7P
IC302 41P
CN301 5P CN101 16P
+5V
C306
220pF
GND CN103 6P
PAPER IN
+5V
RBN_TYPE0 S5
Q104
+5V 2SC1623-T1-L5L6 R117 TP107
10k
IC104 (2/2)
3 8 LM358PSR
IC101 15P R110
+ 1 47 CN103 8P
C107 2 -
0.1uF
4
R118 R135 R136
330 330 120
+5V NM
RB1
TP316 GND
R322 GND
39k
R305
47 CN103 9P
IC302 42P
CN301 6P CN101 15P
C307 PAPER IN
220pF
+5V
RBN_TYPE1 S6
GND Q105
2SC1623-T1-L5L6 R119 TP108
10k
IC105 (1/2)
5 LM358PSR
IC101 4P R111 CN103 10P
+ 7 47
6 -
+5V R120 R137 R138

RB2 330 330 120
TP317 NM
R324
39k
GND
R306
47 CN103 11P
IC302 43P
CN301 7P CN101 14P
C310 PAPER IN
220pF
+5V S7
GND RBN_TYPE2
Q106
+5V 2SC1623-T1-L5L6 R121 TP109
10k
IC105 (2/2)
3 8 LM358PSR
IC101 5P R112 CN103 12P
+ 1 47
C108 2 -
0.1uF 4
R122 R139 R140
330 330 120
NM
GND
GND
CN103 1P
GND
UP-20/21MD V1 4-29
7. Ribbon cueing detection sensor
Type: Reflective type
Function: Detects the start mark and cue mark of a ribbon.
Level: RBN_CD_SENS IC302 40P
H (analog level): Detects the cue mark of each color.
L (analog level): Others
+5V
RB_CD
TP312
R320
12k
R303
47 CN301 4P CN101 17P CN103 4P
IC302 40P
C305
220pF +5V
GND
CN103 6P
PAPER IN
S3
+5V
RBN_CD
Q103
2SC1623-T1-L5L6 R115 TP106
10k
IC104 (1/2)
5 LM358PSR
IC101 14P R109 CN103 5P
+ 7 47
6 -
R116 R133 R134

330 120 120
NM NM
GND
CN103 1P
GND
8. Front panel opening detection sensor (S401/SE-642 or SE-683)

Type: Mechanical type
Function: Detects whether opening or closing of the front panel.
Level: DOOR_SENS IC302 48P
H: Open the front panel.
L: Close the front panel.
+5V +5V
DOOR SENS
TP318
R250 R317
10k 10k
S401
FB231 2
1
IC302 48P 3
+5V
C302
220pF
3
2
1
GND D210
1SS123-T1
GND
SY-299 KEY-49/KEY-51 SE-642/SE-683
4-30 UP-20/21MD V1
9. Interlock sensor
Type: Mechanical type
Function: Detects whether bottom plate is installed on the unit. When bottom plate is not installed on
the unit, turn off the power of the unit.
Level: MEC-15/MEC-20 board CN201 7P
H: Power ON
L: Power OFF
CN201 VCONT
+12V
1 D+3.3V
TP201
2 M+12V
3 V_CONT VCONT 001-J9
4 D+5V R205
1k
5 GND
6 GND CN203
GND
7 REMOTE nON/OFF NO 1
8 GND
+32V
COM 2
To INTERLOCK SW
9 STEPM
GND
R201
0
R202
0
+12GND
R203
0
R204
0
GND +32GND
MEC-15/MEC-20
4-3-5. Head Control Block
The head control block corrects the parallel print data per line from the VPR-74 board and transfers it to
the thermal head for printing.
The head control block consists of the following five blocks.

. Color table γ RAM plus temperature correction offset (IC501) that γ-corrects the parallel print data
from VPR-74 board
. Image processing circuit (picture quality control) (IC502) that performs pattern recognition
interpolation, edge emphasis, and thermal storage correction
. Head drive circuit (IC401, 403) that PWM-converts parallel data and transfers print data to the thermal
head
. Line number correction circuit (voltage drop control) (IC402) that corrects the voltage drop due to the
common resistor of a thermal head
. Head voltage correction circuit
Print data is received from the VPR-74 board as parallel data, γ-corrected, and processed by a PQC
circuit. After that, the print data is PWM-modulated using a head drive circuit and transferred to the
thermal head via CN401 on the SY-299 board.
γ correction circuit
The print data sent from the VPR-74 board is γ-corrected using the data conversion table of γ RAM
(IC501). Before printing, the γ data of each YMC color corresponding to the media type, paper feeding
and γ type is written in the address of γ RAM. IC501 also accounts two data offset for temperature
correction of continuity printing and color balance functions, and then add it to print data.
UP-20/21MD V1 4-31
PQC IC
The main functions of PQC IC are as follows.
. Edge emphasis
Performs the edge emphasis that improves the sharpness of an image using a digital filter in the
horizontal and vertical directions.
. Thermal storage correction
Corrects the dullness and unstableness of rising due to the defective thermal response of a head using a
digital filter.
. Re-sizing
Digitized video signal data is re-sized to number of a head element corresponding to division mode.
. Patter recognition of data complement
Performs the data complement in relation to the head direction and feed direction respectively.
Head drive circuit

. PWM modulation
PWM-modulates eight-bit parallel data and converts it into serial print data.
. Divided print processing
Divides one gradation into four for printing so that the clearance between print lines does not stand out
when the print dot area of a low-density image portion becomes smaller.
Line number correction circuit

The combined resistance of an element decreases when the number of heating resistor elements that
carries a current to the thermal head increases. In this case, the voltage drop due to the common
resistance of a harness cannot be ignored and the print density decreases. Therefore, this circuit controls
the current-carrying time of a head element and corrects the print density.
Head voltage correction

The head voltage can be increased or decreased by changing a VCONT signal (pin 3 of CN201 on the
MEC-15/MEC-20 board) for the power supply block. A VCONT signal is controlled using software by
using the D/A conversion output (pin 6 of IC101 on the MEC-15/MEC-20 board).
All that, head voltage is not output according to VCONT signal controls except during printing and pre-
heating of the thermal head.
. Correction by feed pitch
When data is printed at the same head voltage, the print density becomes thicker as the feed pitch
becomes narrower. Therefore, an offset is made in each feed of ordinary S-size print (FULL, two-
division and four-division), L-size print (FULL, two-division and eight-division) and moreover printing
speed.
4-32 UP-20/21MD V1
4-4. Circuit Operation Description of System Control Block
System control block consists of the following circuit blocks.

. IC103 and peripheral circuit on the SY-299 board
. KEY-49 board (for UP-21MD)
KEY-51 board (for UP-20)
. IF-851 board
. IF-852 board
This section describes the following contents.

1. Special mode and special operating method
2. Address map
3. Circuit operation
4. Communication with internal CPU
. Interface with mechanical control block (IC302: PRT) on the SY-299 board
. Interface with mechanical control block (IC501: FMY) on the VPR-74 board
5. Analog video block (VA) control of the VPR-74 board
. I2C bus control
. Screen display-related signals
. Status signal
6. RS communication control
7. Media protection such for software
4-4-1. Special Mode and Special Operating Method
. Reset of the default setting

Turn on the power by pressing the [STOP], [CAPTURE] and [PRINT] keys simultaneously.
. Service mode
Turn on the power by pressing the [←] and [→] keys simultaneously.
. Mechanical adjustment mode
Turn on the power by pressing the [DISPLAY] and [EXEC] keys simultaneously.
. Transport mode
Press the [←], [→] and [MENU] keys simultaneously during power on condition.
4-4-2. Address Map
Address Contents IC Remarks
000000h-03FFFFh 256k-byte FLASH IC103 CPU built-in

400000h-400003h LCD IC201, IC204
600000h-600008h Keymatrix IC201, IC204
FFB000h-FFEFBFh 16k-byte SRAM (1/2) IC103 CPU built-in
FFF800h-FFFFBFh I/O IC103 CPU built-in
FFFFC0h-FFFFFFh 16k-byte SRAM (2/2) IC103 CPU built-in
UP-20/21MD V1 4-33
4-4-3. Circuit Operation
. Reset circuit
The reset circuit uses PST572CMT (IC105). This circuit outputs a low pulse of about 60 msec when Vcc
becomes less than 4.5 V during the power-on or off sequence. The reset pulse is input to the reset pin
(pin 59) of CPU (IC103). The CPU on the SY-299 board is then reset. After the reset is released, the
CPU outputs the reset pulses for other boards from the reset output pins (pins 28 and 74).
IC103 TP Object to be reset Remarks
Pin 59 TP110:RESET1 CPU on SY-299 board Output of reset circuit

Pin 28 TP109:RESET2 VPR-74 board and peripheral circuit on SY-299 board
Pin 74 TP106:RESET3 Mechanical control block
. Oscillator circuit
The basic clock (9.8304 MHz) of the SY-299 board that is generated using an oscillator circuit
incorporating a crystal oscillator (X101) and CPU (IC103) can be confirmed at pin 61 of IC103.
. Nonvolatile memory
Each menu setting, caption character string or data for “COLOR LOAD” and “USER LOAD” is stored in
64 kbit I2C serial EEPROM (IC101). The system starts under last-call state (that is setting state under
turned off the power) according to data is read from the nonvolatile memory when the system starts.
However, when setting is changed in COLOR ADJUST menu and turn off the power during [TEMP]
state but “SAVE COLOR” is not set in the menu, setting value on this menu page is not stored in IC101.
At that, I2C bus using for data storing is used in common that controls for analog board. When this IC is
replaced, reset of default setting must be performed after resetting of “LANGUAGE” on the SERVICE
MENU 1.
. LED control
The PRINT LED (that lights during printing) is controlled by CPU (pin 35 of IC103). A digital transistor
of final stage is Q301 on the KEY-49/KEY-51 board. (Q302 on the KEY-51 board for UP-20.) The
ALARM LED (that lights when an error occurs in a printer) is controlled by CPU (pin 36 of IC103). A
digital transistor of final stage is Q302 on the KEY-49/KEY-51 board. (Q301 on the KEY-51 board for
UP-20.)
. Buzzer control
A buzzer sound pulse is output from CPU (pin 39 of IC103). The buzzer does not sound when
[BEEP:OFF] is set in the menu.
. Liquid-crystal display (LCD) control

The bus control of LCD is performed using IC201 and IC204, and IC301 on the KEY-49/KEY-51 board.
The display density of LCD is decided the analog voltage value that is output from CPU (pin 43 of
IC103) and then drive it in IC 206 and peripheral circuit. No display may appear on the LCD when
[LCD-CONT:OFF] is set in the menu. This circuit is common to keymatrix and operates as bus control
of LCD when CS2 is set in the menu.
. Input of main unit’s key (main key/operation key)

The state of the main unit’s key is processed by IC201 and IC204, and IC303, IC304, D305 to D308 and
R342 to R347 on the KEY-49/KEY-51 board, and input through a data bus to CPU. This circuit is
common to bus control of LCD and operates as input of main unit’s key when CS3 is set in the menu.
4-34 UP-20/21MD V1
. Screen display control
A screen display control signal is generated by IC102. Exclusive clock circuit uses in this IC102. The
clock frequency have an effect to horizontal size on the screen. The H-sync and V-sync signal inputs
from the VPR-74 board are required as a timing pulse during operation. The control signal of display
data is output from CPU (pins 1 to 3 of IC103). Characters are actually superimposed using an analog
switch on the VPR-74 board. No screen display may appear when [SOURCE:THRU] or
[DISPLAY:OFF] is set in the menu.
. Remote 1 input and infrared remote control reception

An infrared remote control pulse is received using the infrared photosensor (IC302) on the KEY-49/KEY-
51 board. This pulse is waveform-shaped by IC209 on the SY-299 board and output to the IF-852 board.
When a wired remote control is connected to J1 on the IF-852 board, a wired remote control pulse is
selected as output. When it is not connected to J1, output pulse of a photosensor is selected as output.
One of selected pulse is waveform-shaped by IC209 on the SY-299 board and shift by IC106, then input
to CPU (pins 40 and 41 of IC103). Therefore, the wire remote control operation may fail due to the
failure of J1 on the IF-852 board.
. Remote 2 input
The two types of remote controls can be connected that are a open/short remote control (RM-91 etc.) and
analog-level remote control (FS-36 etc.) in J2 on the IF-852 board. A open/short-level signal is processed
by IC205 and input to CPU (pin 75 of IC103). An analog-level signal is processed by IC206 and input to
CPU (pin 49 of IC103).
. Remote 2 output
The control signal of a BUSY output signal is output by CPU (pin 34 of IC103) and driven using a buffer
(IC208). Afterward, a signal is input to two circuits of TTL output and open collector output, then an
output signal is decided either them by setting of S201 on the SY-299 board.
4-4-4. Communication with Internal CPU in Unit
. Interface with mechanical control block on the SY-299 board (IC302: PRT)
Bi-directional communication is performed by the asynchronous serial communication that uses serial
communication interface CH.0 incorporated into CPU.
Signal line name I/O Description
SY_PRT_TXD Output Communication data (IC103: SY → IC302: PRT)

PRT_SY_RXD Input Communication data (IC302: PRT → IC103: SY)
SY_PRT_RTS Output Communication enable (IC103: SY → IC302: PRT) L:active
PRT_SY_CTS Input Communication enable (IC302: PRT → IC103: SY) L:active
Communication format
System Asynchronous system

Data length 8 bits
Stop bit 1 bit
Parity None
Baud rate 19200 bps
UP-20/21MD V1 4-35
. Interface with mechanical control block on the VPR-74 board (FMY)
Bi-directional communication is performed by the asynchronous serial communication that uses serial
communication interface CH.3 incorporated into CPU.
SY_FMY_TXD Output Communication data

(SY-299 board, IC103: SY → VPR-74 board, IC501: FMY)
FMY_SY_RXD Input Communication data
(VPR-74 board, IC501: FMY → SY-299 board, IC103: SY)
SY_FMY_RTS Output Communication enable
(SY-299 board, IC103: SY → VPR-74 board, IC501: FMY) L:active
FMY_SY_CTS Input Communication enable
(VPR-74 board, IC501: FMY → SY-299 board, IC103: SY) L:active

Data length 8 bits
Stop bit 1 bit
Parity None
Baud rate 19200 bps
4-4-5. Analog Video Block (VA) Control on the VPR-74 Board
. I2C bus control

Purpose
Controls the I2C bus circuit on the analog board.
IIC-SCL Output Serial data clock H:active

IIC_SDA Output Serial data H:active
IIC_CTS Input Serial data transfer enable H:active
Functions obtained by I2C bus control

(User menu)
HUE, COLOR, GAIN, OFFSET, MONI-R, MONI-G, MONI-B, IRE, SYNC ON G, and
INPUT SEL
(Service menu)
PICTURE, G DRIVE, B DRIVE, SUB-BRIGHT, and VBS Y
(Other functions)
HALFTONE
n
The object to be handled is an I2C-compatible circuit on the VPR-74 board. The center value for
adjustment is stored in I2C-EEPROM on the VPR-74 board. During start, the SY-299 board reads data
from I2C-EEPROM and initializes the IC on the VPR-74 board. These set values can be changed
(readjusted) in the service man mode. No communication is performed when I2C-CTS is in the send
disable (L) state.
4-36 UP-20/21MD V1
. Screen display-related signals
Purpose
Produces a pulse signal for screen display.
OSD-R Output Screen display control data (R) H:active

OSD-G Output Screen display control data (G) H:active
OSD-B Output Screen display control data (B) H:active
OSD_BLK Output Screen display control data (Blanking) H:active
OSD_ON_NOFF Output Batch control of screen display superimposition (yes/no) H:active
OSD_HD Input Timing pulse (H-SYNC) Sync negative
OSD_VD Input Timing pulse (V-SYNC) Sync negative
. Status signal
Input signal specification
The signal line INPUT_SEL1 shows on the schematic diagrams, but this line does not use in reality. All
of input signal switching realizes by IIC controls.
. Signal selection during output of source screen
THRU_EE Contents
L THROUGH
H EE
n
This signal is used for control of a relay switch on the IF-851 board.
When menu/error appear on the screen, EE screen is output even if SOURCE is set to THRU.
. Color and B/W selection
SET_CL_nBW Contents
H COLOR
L B/W
n
COLOR/BW bit processed on the I2C bus circuit is output by a status signal.
. Video mode (NTSC/PAL) selection
SW_NTSC_NPAL Contents
H NTSC
L PAL
n
This mode is connected to the NTSC/PAL set switch on the IF-852 board.
UP-20/21MD V1 4-37
4-4-6. RS Communication Control
A serial signal of TTL level that is produced is serial communication interface CH.2 incorporated into
CPU, is converted at ± 8 V by level conversion IC (IC202 and IC203) then output it.
The last output signal is as follows:
Active: 8V
Non-active: _8 V
The TP position is as follows:
Active: 0V
Non-active: +5 V
TXD Output Communication data (UP → External)

RXD Input Communication data (External → UP)
RTS Output Communication enable (UP → External)
CTS Input Communication enable (External → UP)
DTR Output Operation status (UP → External)
DSR Input Operation status (External → UP)

Data length 8 bits
Stop bit 1 bit
Parity None
Baud rate 1200/2400/4800/9600 bps (Menu switching)
4-4-7. Media Protection such for Software
Error message “CHECK RIBBON A0” is displayed when specific printer of exclusive use for S paper is
set the L paper.
4-38 UP-20/21MD V1
Section 5
Troubleshooting
5-1. Video (Image) Related Trouble
The flow of a video signal is shown in the figure below.
[Flow of video signal]
Input block SIGNAL

SOURCE MONITOR Output block(Monitor)
ANALOG RGB.VIDEO.S-VIDEO
IF-851 RELAY
DECODER ENCODER
VPR-74 DIGITAL RGB

A/D DRAM D/A
Test Pattern MASKING
8bit DATA(Serial)
(Serial to Parallel
SY-299 HEAD DRIVER
Conversion)
8bit DATA(Parallel)
THERMAL HEAD
Output block(Print)
PRINT RESULT
The flow of a video signal can be mainly classified into input, monitor output, and print output blocks.
The block in which a trouble occurs can be supposed from the trouble state.
1. Both the print result and monitor display are abnormal.

In this trouble state, a trouble occurs in the input block.
2. The print result is normal and the monitor display is abnormal.
In this trouble state, a trouble occurs in the monitor output block.
3. The print result is abnormal and the monitor display is normal.
In this trouble state, a trouble occurs in the print output block.
Each block is described below.

For more details, refer to the block diagram, schematic diagram, and circuit operation description of each
board.
UP-20/21MD V1 5-1
Input Block
In the input block, the flow of a signal is as follows:
Signal input terminal (IF-851) - ADC (VPR-74) - DRAM (VPR-74)
If a trouble is judged to occur in the input block, check the state of a video trouble fully. For fine
symptoms in dots, a trouble may occur in a digital processing system [ADC (around IC350 to IC352) -
DRAM (around IC801)]. In other states, a trouble may occur in an analog processing system [IF-851 -
Decoder (around IC204) - ADC].
In the trouble of an analog processing system, the place where a trouble occurs can be more narrowed
down by checking the state of each signal (VIDEO, S-VIDEO, and RGB).
Monitor Output Block

In the monitor output block, the flow of a signal is as follows:
DRAM (VPR-74) - Encoder (VPR-74) - Signal output terminal (IF-851)
Like an input processing block, it can be supposed to some degree by the trouble state whether the block
where a trouble occurs is a digital processing system [DRAM - encoder (around IC407)] or analog
processing system (encoder - IF-851).
The place where a trouble occurs can be more narrowed down by the state of each monitor output signal
(VIDEO, S-VIDEO, and RGB).
Print Output Block

In the print output block, the flow of a signal is as follows:
DRAM (VPR-74) - Masking (VPR-74) - Head control (SY-299) - Thermal head
The data output from DRAM on the VPR-74 board is input through the masking circuit (around IC902
and IC903) on the VPR-74 board to the head control circuit (around IC401, IC402, and IC403) on the
SY-299 board.
Moreover, the print signal that was converted from serial to parallel in the head control block is output
through a harness from CN401 on the SY-299 board to the thermal head.
5-2 UP-20/21MD V1
5-2. Mechanical Troubleshooting
Symptom Cause Remedy
Power does not turn on Interlock switch is damaged Replace an interlock switch
Interlock switch connector is not connected Connect an interlock switch connector
Ribbon cassette is not inserted Head block incorrectly position Turn on the power again
Head block incorrectly position Replace the sensor board assembly of
(Sensor S8 or S9 has failed) S8 or S9
Head block incorrectly position Replace a gear or cam
(Gear or cam is damaged)
Head block is slipped out of the place Reinstall a head block
Ribbon guide is detached Reinstall a ribbon guide
Head does not move to downwar Head block is unbiased when installing Reinstall a head block while biasing
Cannot set the paper tray Pinch roller shaft is detached Reinstall a pick roller shaft
SET PAPER indicator does not Sensor S1 has failed Replace a S1 sensor board assembly
disappear even if setting the paper
Harness on S1 sensor board assembly Connect a harness
is not connected
Paper curled Remove the paper curling
NO RIBBON CASSETTE indicator does Sensor S5, S6 or S7 has failed Replace a S2 sensor board assembly
not disappear even if setting the ribbon
Harness on S2 sensor board assembly is not Connect a harness
connected
Specified ribbon cassette does not use Use a specified ribbon cassette
Discrimination mark for ribbon cassette is Replace a ribbon cassette
stripped
Cannot paper feed DC motor has failed (No rotating) Replace a DC motor
(Cannot pull in paper to the unit)
DC motor connector is not connected Connect a DC motor connector
(No rotating)
Pick roller slipped Confirm the paper surface not dirty
Replace a pick roller assembly
(Worn out of roller)
Planetary gears 1, 2 and 3 Replace the mechanism deck
cannot change correctly
Harness make contact to pick roller Improve the wiring of harness
Gear has failed (or damaged) Replace a gear
Cannot paper feed (Paper can pull in to STM has failed (No rotating) Replace a STM assembly
the unit but stops into grip roller)
STM connector is not connected Connect the connector on a
STM assembly
Grip roller does not meshing to pinch roller Replace the mechanism deck
Loss of synchronism in STM Readjust the belt tension correctly
(Belt incorrectly tension)
UP-20/21MD V1 5-3
Unsuitable size of paper and Paper is unsuitability size with ribbon Replace the paper or ribbon cassette
ribbon cassette is displayed in order to suitability size
Ribbon discriminate mark cannot Replace a ribbon cassette
discriminate by dirty etc.
Sensor S5, S6 or S7 has failed Replace a S2 sensor board assembly
Harness on S2 sensor board Connect a harness
assembly is not connected
Overlapped paper feed Remove the overlapped feed paper
(Extreme cannot detect on the paper) (Do not use the removed paper)
Replace the mechanism deck
Overlapped paper feed cause Remove the overlapped feed paper
of the paper stuck (Do not use the removed paper)
Dispose the remained paper thoroughly
Grip roller does not meshing to pinch roller Replace the mechanism deck
Actuator type photo sensor has failed Replace an actuator type photo sensor
Connector of an actuator type sensor Connect a connector of an actuator type
is not connected photo sensor
Cannot printing Power supply cable of a head is not connected Connect a power supply cable of a head
Head harness for signal line is not connected Connect a head harness for signal line
Power supply cable of a head is disconnected Connect a power supply cable of a head
Head harness for signal line is disconnected Connect a head harness for signal line
Head has failed Replace a head
Sensor S8 or S9 has failed Replace the sensor board assembly
(Head is not regular position) of S8 or S9
Head block incorrectly position Replace the cam, joint gear or gear
(Cam, joint gear or gear has failed)
Planetary gears 1, 2 and 3 cannot Replace the mechanism assembly
change correctly
Paper feeding irregular Belt incorrectly tension Readjust the belt tension correctly
occurs in printing side
Specified paper does not use Use the specified paper
Gear has failed (variety of core etc.) Replace a gear
Creases occurs in printing side Head incorrectly position Readjust a head position correctly
Static electricity plate is not installed correctly Reinstall a static electricity plate
5-4 UP-20/21MD V1
Color print gap occurs in printing side Grip roller does not meshing to pinch roller Replace the mechanism deck
Back tension spring unsuitability strength Replace the mechanism deck
Torque limiter unsuitability strength Replace the mechanism deck
Belt incorrectly tension Readjust the belt tension correctly
Loss of synchronism in STM Reinstall a STM assembly
(Defective of compressibility)
Density irregular occurs in printing side Head has failed Replace a head
Thinning print occurs in printing side Head incorrectly position Readjust the head position correctly
(Defective of compressibility)
Streak lines occurs in printing side Head incorrectly position Replace a head block assembly
Irregular sound occurs under printing Ribbon cassette has failed Replace a ribbon cassette
Back tension spring unsuitability strength Replace the mechanism deck
Torque limiter unsuitability strength Replace the mechanism deck
Gear is damaged Replace a gear
Paper jammed Overlapped paper feed Remove the overlapped feed paper
(Do not use the removed paper)
Replace the mechanism deck
Overlapped paper feed cause Remove the overlapped feed paper
of the paper stuck (Do not use the removed paper)
Dispose the reminded paper thoroughly
Ribbon cassette has failed Replace a ribbon cassette
(Paper caught in the bottom of the cassette)
STM has failed (No rotating) Replace a STM assembly
STM assembly
Harness of the rear side is detached Improve wiring of the harness
to the paper carrying path
UP-20/21MD V1 5-5
Does not paper delivery Planetary gears 1, 2 and 3 cannot Replace the mechanism deck
change correctly
Ribbon cassette has failed Replace a ribbon cassette
(Paper caught in the bottom of the cassette)
STM has failed (No rotating) Replace a STM assembly
STM assembly
Delivery roller has failed Replace a delivery roller assembly
Limit lever is detached from the bearings Reinstall the bearings of a limit lever
Gear is damaged Replace a gear
Too fast timing operates head cleaning DC fan has failed Replace a DC fan
DC fan connector is not connected Connect a DC fan connector
Indicator does not disappear in spite of Limit lever spring is not hanged Re-hang a limit lever spring
no accumulates the delivered paper
Limit lever is detached from the bearings Reinstall the bearings of a limit lever
Delivery guide incorrectly position Reinstall a delivery guide
S11 sensor has failed Replace a S11 sensor board assembly
5-6 UP-20/21MD V1
Mechanical Trouble NG Code List
NG_CODE1
Display message NG command NG data Contents of NG Symptom Cheking point Example of possible cause
MECHA TROUBLE E1 08 HEAD_HOME_TIME_OUT Cannot move head to head up position, time runs out . Relation of DC motor . DC motor harness is not connected.
HEAD 09 HEAD_HOME_PICK_TIMEOUT Cannot move head from head up to paper pick position, time runs out “MEC-15 or MEC-20/CN202, CN205, IC203” . Sensor harness is not connected.
0a HEAD_PICK_HALF1_TIMEOUT Cannot move head from paper pick to head half position, time runs out “SY-299/CN302, IC302” . Overload is applied to mechanical block.
0b HEAD_HALF1_DOWN1_TIMEOUT Cannot move head from head half to Y print position, time runs out . Relation of sensor . Head cam FG has damaged.
0c HEAD_DOWN1_HALF2_TIMEOUT Cannot move head from Y print to head half position, time runs out “MEC-15 or MEC-20/CN101, CN104” etc.
10 HEAD_HALF2_DOWN2_TIMEOUT Cannot move head from head half to M print position, time runs out “SY-299/CN301, IC302”
11 HEAD_DOWN2_HALF3_TIMEOUT Cannot move head from M print to head half position, time runs out S8/S9
12 HEAD_HALF3_DOWN3_TIMEOUT Cannot move head from head half to C print position, time runs out
13 HEAD_DOWN3_HALF4_TIMEOUT Cannot move head from C print to head half position, time runs out
14 HEAD_HALF4_DOWN4_TIMEOUT Cannot move head from head half to L print position, time runs out
15 HEAD_DOWN4_HOME_TIMEOUT Cannot move head from L print to head up position, time runs out
16 HEAD_DOWN3_HOME_TIMEOUT Cannot move head from C print to head up position, time runs out
17 HEAD_PICK_HALF2_TIMEOUT Cannot move head from paper pick to head half position, time runs out
1f HEAD_POS_ERROR Cannot detect head position
1d HEAD_COLD_ERROR Detects the abnormal temperature of thermal head thermistor . Thermal head . Thermal head has failed.
1e HEAD_HEAT_TIMEOUT Cannot rise the regular temperature during pre-heating of a thermal head, time “SY-299/CN401, IC302” . Thermal head harness is not connected or damaged etc,.
runs out
CHECK RIBBON E1 34 RIBBON_MCL_TIMEOUT Detects index mark during magenta or cyan indexing of an ink ribbon by sensor S3, . Relation of DC motor . Sensor harness is not connected.
time runs out “MEC-15 or MEC-20/CN202, CN205, IC203” . Ribbon take-up torque incorrectly.
“SY-299/CN302, IC302” etc.
. Relation of sensor
“MEC-15 or MEC-20/CN101, CN103, IC101, IC104”
“SY-299/CN301, IC302”
S3
A0 CHECK RIBBON Detects an unused ribbon by a ribbon type detect sensor 0 to 2 (S5 to S7) “MEC-15 or MEC-20/CN101, CN103, IC101, IC105” . Type reflection port of an ink ribbon has failed.
“SY-299/CN301, IC302” . Sensor harness is not connected.
S5-S7 . Optical axis is out of place because of sensor board is
installed incorrectly.
MECHA TROUBLE E1 51 LOAD_TMG_TIMEOUT Printing paper is not fed until a feed sensor (S2) when feeding paper, time runs out . Relation of DC motor . Sensor harness is not connected.
LOAD “MEC-15 or MEC-20/CN202, CN205, IC203” . Paper feed is fault by reduce of friction on paper feed
/CHECK PAPER “SY-299/CN302, IC302” roller.
LOAD . Relation of sensor . Paper feed tray has damaged.
“MEC-15 or MEC-20/CN101, CN103, IC101, IC103” etc.
“SY-299/CN301, IC302”
S2
(Continued)
UP-20/21MD V1 (i) (i)

(Continued of NG_CODE1)
Display message NG command NG data Contents of NG Symptom Cheking point Example of possible cause
MECHA TROUBLE E1 52 PULLIN_TMG_TIMEOUT Printing paper cannot be pulled in from a paper feed sensor (S2) to the inside of a unit . Relation of stepping motor . Stepping motor harness is not connected.
LOAD
when feeding paper, time runs out “MEC-15 or MEC-20/CN202, CN206, IC204” . Sensor harness is not connected.
/CHECK PAPER
LOAD 56 LOAD_PAPER_SHORT Detects short paper during load by a paper feed sensor (S2) when feeding paper, time “SY-299/CN302, IC302” . Loss of synchronism in a stepping motor.
runs out . Relation of sensor . Overload is applied to grip roller mechanism.
MECHA TROUBLE E1 58 PUSHOUT_TMG_TIMEOUT Print paper cannot be pushed out from the inside of a unit to a paper feed sensor (S2) “MEC-15 or MEC-20/CN101, CN103, IC101, IC103” . Overlapped paper feed.
EJECT
when paper ejection, time runs out “SY-299/CN301, IC302” etc.
/CHECK PAPER
EJECT 59 EJECT_TMG_TIMEOUT Printing paper cannot be ejected from paper feed sensor (S2) to the outside of a unit S2
when paper ejection, time runs out
MECHA TROUBLE E1 61 PP_LD_MISSING_ERR Detects paper is not existed under paper exist timing conditions by a paper feed . Relation of stepping motor . Sensor harness is not connected.
PROCESS
sensor (S2) when retracting paper “MEC-15 or MEC-20/CN202, CN206, IC204” . Overload is applied to grip roller mechanism.
62 PP_LD_JAM_ERR Detects paper exist under paper is not existed timing conditions by a paper feed “SY-299/CN302, IC302” . Loss of synchronism in a stepping motor.
sensor (S2) when retracting paper . Relation of sensor etc.
“MEC-15 or MEC-20/CN101, CN103, IC101, IC103”
“SY-299/CN301, IC302”
S2
63 PP_JAM_ERR Detects paper exist under paper is not existed timing conditions by a jamming sensor . Relation of stepping motor . Sensor harness is not connected.
(S10) when retracting paper “MEC-15 or MEC-20/CN202, CN206, IC204” . Overload is applied to stepping motor mechanism.
64 PP_JAM_MISSING_ERR Detects paper is not existed under paper exist timing conditions by a jamming sensor “SY-299/CN302, IC302” . Loss of synchronism in a stepping motor.
(S10) when retracting paper . Relation of sensor . Overlapped paper feed.
65 PP_PRINT_TIMEOUT Long time is spent in printing, time runs out “MEC-15 or MEC-20/CN101, CN105” etc.
“SY-299/CN301, IC302”
S10
MECHA TROUBLE E1 73 RBN_CD_ALARM Fall detection level of a ribbon cueing detect sensor (S3) “MEC-15 or MEC-20/CN101, CN103, IC101, IC103- . Deterioration in sensitivity of sensor due to dust
SENSOR 74 PAPER_LD_ALARM Fall detection level of a paper in sensor (S1) IC105” etc,.
75 PAPER_IN_ALARM Fall detection level of a paper feed sensor (S2) “SY-299/CN301, IC302”
76 RBN_TYPE0_ALARM Fall detection level of a ribbon type detect sensor 0 (S5) Each sensor (S1-S7)
77 RBN_TYPE1_ALARM Fall detection level of a ribbon type detect sensor 1 (S6)
78 RBN_TYPE2_ALARM Fall detection level of a ribbon type detect sensor 2 (S7)
7f ROOM_HEAT_ERROR Detects abnormal high temperature in a room thermistor “MEC-15 or MEC-20/THP201, CN202” . Defective of harness etc,.
“SY-299/CN302, IC302”
(ii) (ii) UP-20/21MD V1

A way at looking the list: For NG_CODE2 to 5, refer to HEX code converting as binary. (Example For h’42 = 0100 0010: sixth bit and first bit)
NG_CODE2
NG command NG data Contents of NG Symptom Cheking point Example of possible cause
E2 BIT 2 PAPER_JAM_SENS Defective of a jamming sensor (S10) detection (when “MEC-15 or MEC-20/CN101, CN105” . Sensor harness is not connected.
mechanism adjustment) “SY-299/CN301, IC302” . Sensor board is installed incorrectly.
S10
BIT 1 PAPER_EJ_SENS Defective of a delivery flap sensor (S11) detection (when “MEC-15 or MEC-20/CN101, CN106”
mechanism adjustment) “SY-299/CN301, IC302”
S11
BIT 0 DOOR_SENS Defective of a front panel opening sensor detection (when SE-642
mechanism adjustment) “KEY-49 or KEY-51/CN301, CN302”
“SY-299/CN203, IC302”
NG_CODE3
E3 BIT 6 HEAD THERMISTOR Defective of a temperature detection of a head thermistor (when Thermal head . Thermal head harness is not connected.
BIT 5 mechanism adjustment) “SY-299/CN401, IC302” etc.
BIT 4 ROOM THERMISTOR Defective of temperature detection of a room thermistor “MEC-15 or MEC-20/THP201, CN202” . Harness is not connected.
BIT 3 (THP201 on the MEC-15/MEC-20 board) (when mechanism “SY-299/CN302, IC302”
adjustment)
BIT 0 EEPROM Cannot write or read correctly in EEPROM (IC102 on the MEC- “MEC-15 or MEC-20/IC102, CN101” . Harness is not connected.
15/MEC-20 board) (when mechanism adjustment) “SY-299/CN301, IC302”
NG_CODE4
E4 BIT 5 RBN_CD_SENS Defective of a ribbon cueing sensor (S3) detection (when “MEC-15 or MEC-20/CN101, CN103, IC101, IC104” . Sensor harness is not connected.
BIT 4 mechanism adjustment) “SY-299/CN301, IC302” . Optical axis is out of place because of sensor board is installed incorrectly.
S3
BIT 3 PAPER_LD_SENS Defective of a paper feed sensor (S2) detection (when “MMEC-15 or MEC-20/CN101, CN103, IC101, IC103”
BIT 2 mechanism adjustment) “SY-299/CN301, IC302”
S2
BIT 1 PAPER_IN_SENS Defective of a paper in sensor (S1) detection (when mechanism “MEC-15 or MEC-20/CN101, CN103, IC101, IC103”
BIT 0 adjustment) “SY-299/CN301, IC302”
S1
UP-20/21MD V1 (iii) (iii)

NG_CODE5
E5 BIT 5 RBN_TYPE_SENS2 Defective of a ribbon type sensor 2 (S7) detection (when “MEC-15 or MEC-20/CN101, CN103, IC101, IC105” . Sensor harness is not connected.
BIT 4 mechanism adjustment) “SY-299/CN301, IC302” . Optical axis is out of place because of sensor board is installed incorrectly.
S7
BIT 3 RBN_TYPE_SENS1 Defective of a ribbon type sensor 1 (S6) detection (when “MEC-15 or MEC-20/CN101, CN103, IC101, IC105”
S6
BIT 1 RBN_TYPE_SENS0 Defective of a ribbon type sensor 0 (S5) detection (when “MEC-15 or MEC-20/CN101, CN103, IC101, IC104”
S5
(iv) (iv) UP-20/21MD V1

SAFETY CHECK-OUT
After correcting the original service problem,

perform the following safety checks before
releasing the set to the customer :
Check the metal trim, “metallized” knobs, screws,

and all other exposed metal parts for AC
leakage. Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to

earth ground and from all exposed metal parts to
any exposed metal part having a return to
chassis, must not exceed 0.5 mA. Leakage
current can be measured by any one of three
methods.
1. A commercial leakage tester, such as the

Simpson 229 or RCA WT-540A. Follow the
manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The
Data Precision 245 digital multimeter is
suitable for this job.
3. Measuring the voltage drop across a resistor
by means of a VOM or battery-operated AC
voltmeter. The “limit” indication is 0.5 V, so
analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa
SH-63Trd are examples of a passive VOM
that is suitable. (See Fig. A)
To Exposed Metal
Parts on Set
10 kZ
AC
1.0 kZ 0.015 µF voltmeter
(0.5V)
Earth Ground
Fig A. Using an AC voltmeter to check AC leakage.
UP-20/21MD V1
UP-20 (UC, CE) Printed in Japan
UP-21MD (UC, CE) E Sony Corporation 2003. 8 22
9-955-307-13 B&P Company ©2001

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COLOR VIDEO PRINTER

Purpose of this manual .............................................................................................. 3

1-1. Board Location ............................................................................................ 1-1

2. Electrical Alignment and Mechanical Alignment

2-1. Electrical Adjustment .................................................................................. 2-1

4. Circuit Operation Description

4-1. Digital Video Signal Processing Block ....................................................... 4-1

5-1. Video (Image) Related Trouble .................................................................. 5-1

Mechanical Trouble NG Code List

Purpose of this manual

. Service Manual Vol.2

. “Semiconductor Pin Assignments” CD-ROM (Available on request)

KEY-49 UP-21MD Stepping motor

1-1. Board Location

S2/RIBBON sensor board

S11 sensor board

S8/S9 sensor board

Ribbon panel assembly

Door eject lever

5. Remove the four screws and two thrust retainer bosses,

Door stopper (L)

Claw BVTT 3x6

Front panel assembly Claw

15. Re-attach the ribbon panel assembly in the reverse

16. Attach mechanical deck assembly in the reverse order

PSW 2.5x6 Head harness

1-4-4. DC Motor Assembly M 3x4 DC gear bearing Planetary gear 1

1. Remove the top cover. (Refer to Section 1-3-1.)

10. Attach the DC motor assembly in the reverse order of

7. Attach the stepping motor assembly in the reverse

Sensor guide Two poli-washers 2

1. Remove the top cover. (Refer to Section 1-3-1.)

Claw CN1 Claw

Tray guide assembly (2)

10. Attach the S2/RIBBON sensor board in the reverse

n 1. Remove the top cover. (Refer to Section 1-3-1.)

Tray guide assembly (2) Claws

6. Attach the S8/S9 sensor board in the reverse order of

Pick roller assembly

8. Attach the S1 sensor board in the reverse order of steps

Sensor guide assembly (2)

Tray guide assembly (2)

7. Attach the photo sensor in the reverse order of steps 1

12. Attach the grip roller 2 assembly in the reverse order

Platen roller bearing Front side

Platen roller bearing

9. Attach the platen roller in the reverse order of steps 1

Flexible flat cable

4. Attach the cam gear in the reverse order of steps 8 to

2-1. Electrical Adjustment

2-1-1. Density Adjustment during Thermal Head Replacement

2. Extraction of sample for density adjustment

(5) Press the EXEC key to start printing.

4. Printing position adjustment of head direction

5. Resetting the number of estimated head print sheets

3 RAMP (H) 4 RAMP (V)

This section describes regarding of the analog video signal adjustment.

Entering the adjustment mode

Entering the “VA ADJUST” mode

Cautions during adjustment

Conditions for adjustment Spec. Adjustment

1. SOURCE/MEMORY: MEMORY TP405 (G-6): 14 M 1CT401(F-7): 14.3

2. INT 4Fsc adjustment (PAL)